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    OKI PACKAGE SOJ Search Results

    OKI PACKAGE SOJ Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    OKI PACKAGE SOJ Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DIP24-P-600-2

    Abstract: oki qfp tray SEPT24
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24

    oki qfp tray

    Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 50mil 100mil 70mil 40PQFP oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1

    d1884

    Abstract: TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		PDF 50mil 100mil 70mil 40PQFP d1884 TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B

    SOJ32-P-400-1

    Abstract: No abstract text available
    Text: SOJ32-P-400-1.27-1 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ32-P-400-1

    Untitled

    Abstract: No abstract text available
    Text: SOJ28-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ28-P-400-1

    SOJ28-P-300-1

    Abstract: SOJ28 SOJ28-P SOJ-28
    Text: SOJ28-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ28-P-300-1 SOJ28 SOJ28-P SOJ-28

    Untitled

    Abstract: No abstract text available
    Text: SOJ36-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ36-P-400-1

    20-P-350

    Abstract: No abstract text available
    Text: SOJ26/20-P-350-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ26/20-P-350-1 20-P-350

    SOJ26

    Abstract: No abstract text available
    Text: SOJ26/20-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ26/20-P-300-1 SOJ26

    SOJ32

    Abstract: SOJ32-P-400-1
    Text: SOJ32-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ32-P-400-1 SOJ32

    Untitled

    Abstract: No abstract text available
    Text: SOJ26/24-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ26/24-P-300-1

    oki marking

    Abstract: DEVICE MARKING CODE table oki LOT NUMBER marking LINEAR MARKING OKI marking code list bk marking linear marking code Mos MARKING CODE 06 markings marking P 16
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 6. MARKINGS This document is Chapter 6 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 6. MARKINGS 6. MARKINGS There are two kinds of marking layout; “standard marking layout” that is specified by Oki Electric and “special marking


    Original     		PDF

    soj28

    Abstract: No abstract text available
    Text: SOJ28/24-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ28/24-P-400-1 soj28

    SOJ42

    Abstract: SOJ42-P-400-1
    Text: SOJ42-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ42-P-400-1 SOJ42

    Untitled

    Abstract: No abstract text available
    Text: SOJ50-P-400-0.80 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ50-P-400-0

    SOJ26

    Abstract: No abstract text available
    Text: SOJ26/24-P-300-1.27-3 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF SOJ26/24-P-300-1 SOJ26

    DRAMs

    Abstract: MSM5416258A MSM5432126 MSM54V32126 oki Package SOJ msm51v17405b MSM54 TSOP300 msm514260c
    Text: OKI Semiconductor DRAMs 1-Meg DRAMs 5 V Part Number Description Organization Pins / Package Access Time Max (ns) MSM511664B-xx Fast page 64K x 16 40 / DIP 70, 80 MSM514256C-xx Fast page 256K x 4 60, 70, 80 MSM514256CL-xx Fast page, low-power 20 / DIP, ZIP


    Original     		PDF MSM511664B-xx MSM514256C-xx MSM514256CL-xx MSM511000C-xx MSM51100CL-xx MSM54V32126 MSM5432126 16-Meg MSM5116160A-xx MSM5116165A-xx DRAMs MSM5416258A MSM5432126 MSM54V32126 oki Package SOJ msm51v17405b MSM54 TSOP300 msm514260c

    Untitled

    Abstract: No abstract text available
    Text: Semiconductor OKI MSC23S132-XXBS8/PS8 1,048,576-Word x 32-Bit DRAM MODULE: FAST PAGE MODE GENERAL DESCRIPTION 0.2 ¿iF decoupling capacitors on a 72-pin glass epoxy Single-In-Line Package supports applications where high density and large capacity of storage memory are required.


    OCR Scan     		PDF MSC23S132-XXBS8/PS8 576-Word 32-Bit 72-pin MSC23S132-xxBS8 MSM514400A)

    G1238

    Abstract: sc2331
    Text: O K I Semiconductor MSC2331B-XXYS3/KS3 262,144-Word by 9-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI M SC2331B-xxYS3/KS3 is a fully decoded 262,144-w ord x 9-bit CMOS Dynamic Random Access Memory Module. It is composed of two 1-Mb DRAMs in SOJ MSM514256B packages and one 256-Kb


    OCR Scan     		PDF MSC2331B-XXYS3/KS3 144-Word SC2331B-xxYS3/KS3 144-w MSM514256B) 256-Kb MSM51C256A) 30-pin SC2331B-xxYS3: SC2331B-xxKS3: G1238 sc2331

    MSM51C256A

    Abstract: No abstract text available
    Text: O K I Semiconductor MSC2331 B-xxYS3/KS3 262,144-Word by 9-Bit DRAM Module: Fast Page Mode D E SC R IP TIO N The OKI M SC2331 B-xxYS3 / KS3 is a fully decoded 262,144-word x 9-bit CM OS Dynamic Random Access Memory Module. It is composed of two 1-Mb DRAMs in SOJ M SM514256B packages and one 256-Kb


    OCR Scan     		PDF MSC2331 144-Word MSM514256B) 256-Kb MSM51C256A) 30-pin MSC2331B-xxKS3: MSM51C256A

    Untitled

    Abstract: No abstract text available
    Text: O K I Semiconductor MSC23109B/BL-XXDS3 1,048,576-Word by 9-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI M SC23109B/BL-xxDS3 is a fully decoded 1,048,576 word x 9-bit CMOS Dynamic Random Access Memory Module. It is composed of two 4-Mb DRAMs in SOJ M SM 514400B/BL packages and one 1-Mb


    OCR Scan     		PDF MSC23109B/BL-XXDS3 576-Word SC23109B/BL-xxDS3 514400B/BL) 511000B/BL) 30pin 30-pin

    Untitled

    Abstract: No abstract text available
    Text: O K I Semiconductor MSC23109B/BL-XXDS3 1,048,576-Word by 9-Bit DRAM Module: Fast Page Mode DE S C R IP TIO N The OKI M SC23109B/BL-xxD S3 is a fully decoded 1,048,576 word x 9-bit CM OS Dynamic Random Access Memory Module. It is composed of two 4-M b DRAM s in SOJ M SM 514400B/BL packages and one 1-Mb


    OCR Scan     		PDF MSC23109B/BL-XXDS3 576-Word MSC23109B/BL-xxDS3 MSM514400B/BL) MSM511000B/BL) 30-pin

    Untitled

    Abstract: No abstract text available
    Text: O K I Semiconductor MSC23B33-XXBS4/DS4 524,288-Word by 32-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI M SC 23B33-xxBS4/D S4 is a fully decoded 524,288-w ord x 32-bit CM OS Dynam ic Random Access Memory Module com posed of four 4-M b DRAMs in SOJ M SM 514260 packages mounted with two 0.2


    OCR Scan     		PDF MSC23B33-XXBS4/DS4 288-Word 32-Bit 23B33-xxBS4/D 288-w 72-pin SC23B33-xxBS4:

    MSC2328B-XXYS2

    Abstract: MSM5
    Text: O K I Semiconductor MSC2328B-xxYS2_ 262,144-Word by 8-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI MSC2328B-xxYS2 is a fully decoded 262,144-word x 8-bit CMOS Dynamic Random Access Mem­ ory Module composed of two 1-Mb DRAMs in SOJ MSM514256B packages mounted with two 0.2 |j.F


    OCR Scan     		PDF MSC2328B-xxYS2_ 144-Word MSC2328B-xxYS2 MSM514256B) 30-pin MSM5