CCL-HL832NX-A
Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize
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CO-029)
CCL-HL832NX-A
Nitto GE100LFCS
Sumitomo G750
GE100LFCS
GE-100-LFC
CCL-HL832NX
GE100LFCS nitto
GE-100LFCS
CCL-HL-832
CCL-HL832
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TSS463
Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
Text: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2
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TSS463
TSS461C
TSS461C
TSS463/TSS461C
TS80C31X2/C32X2
Nitto MP8000
MARKING Z86
1000 BASE Isolation Modules 5000V
EOS ESD S 61.1
hmt design data book
MOLDING MATERIAL MP8000
HT Q100
temic gateway
EIA-556-A
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MP 130B
Abstract: sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23
Text: LPV321/358/324 Qualification Package 9µA Op Amp Family With 150kHz GBW NEW LPV FAMILY Part # Function Package LPV321 LPV358 LPV324 Single Dual Quad SC70-5, SOT23-5 SOIC, MSOP SOIC, TSSOP LPV Series LMV Series National’s Low-Power LPV300 Familiy IN SC70 Packaging
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LPV321/358/324
150kHz
LPV321
LPV358
LPV324
SC70-5,
OT23-5
LPV300
150kHz
LPV321/LPV358/LPV324
MP 130B
sumitomo epoxy
LPV324M
MP 130B 02
cf 5097
nitto UV tape
A193K
NSC marking code PB
eme-7351ls
eme marking sot23
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EN4900GC
Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.
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PCN1-110704
EFM32G890F128
J-STD-020D,
JESD22-A113
JESD22-A104
C/125
JESD22-A103
JESD22-A102
JESD22-A110
EN4900GC
NC7720
CEL9220HF10
EME-G760L
EME-G760
HL832nxa
Yizbond
Hitachi EN4900GC
CEL9220
DS-7409HG
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Untitled
Abstract: No abstract text available
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
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SMS392x-099
SMS3926
SMS3927
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Amkor Wafer level mold compound
Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
Text: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm
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l2aa
Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
Text: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement
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CO-029)
l2aa
tepbga-2
CO-029
Amkor mold compound
Amkor Wafer level mold compound
GE-100L
Amkor Technology pbga moisture
GE-100-L
UM2219
mold compound
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yellow 5mm LED basic
Abstract: LVY9033 nitto tape, 500
Text: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT TYPE AND REEL LVY9033/TR2 DATA SHEET DOC. NO : QW0905-LVY9033/TR2 REV. : A DATE : 09 - Jun - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LVY9033/TR2 Package Dimensions
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LVY9033/TR2
QW0905-LVY9033/TR2
MIL-STD-750D
J-STD-020
ED-M80HYU
NT-301H-11000
yellow 5mm LED basic
LVY9033
nitto tape, 500
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MO-150
Abstract: C194 MP8000AN G600 MO-137 amkor
Text: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller
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MO-150
MO-118
MO-150
C194
MP8000AN
G600
MO-137
amkor
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SUMITOMO NS12
Abstract: OSC127100A-125-3.3-TS T375J E59481 E165111 sumitomo epoxy am-113 Kikusui* tos8650
Text: December 2013 Transformers for Switching Power Supplies Pin terminal type For multiple outputs ECO series ECO20XXSEO(Vertical/Horizontal types) ECO22XXSEO(Vertical/Horizontal types) ECO24XXSEO(Vertical/Horizontal types) ECO24XXSLD(Vertical/Horizontal types)
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ECO20XXSEO
ECO22XXSEO
ECO24XXSEO
ECO24XXSLD
NS12-1
NS12-2
SUMITOMO NS12
OSC127100A-125-3.3-TS
T375J
E59481
E165111
sumitomo epoxy am-113
Kikusui* tos8650
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Cosel
Abstract: No abstract text available
Text: SLIM STICK S-TYPE LED MODULE APPLICATIONS MANUAL WARNING ・ Direct LED emission can seriously damage the eyes. Never view a LED emission directly. ・ Never use a disassembled LED module. ・ A LED generates heat while it is emitting. The ambient temperature is increased by 20℃
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Untitled
Abstract: No abstract text available
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high performance double balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost 2 ● 1
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SMS392x-099
SMS3926
SMS3927
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nitto GE-100L
Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA
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underfill
Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.
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200165
Abstract: SMS3927-099 SMS3926 SMS3926-099 SMS3927 SMS3928 SMS3928-099 Schottky diode wafer
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
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SMS392x-099
SMS3926
SMS3927
200165
SMS3927-099
SMS3926-099
SMS3928
SMS3928-099
Schottky diode wafer
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FEBFSL126MR_H432V1
Abstract: sck053 ceramic buss SR-5 UU9.8 ferrite core E157822 468-2FC sck-053 E85640 Nitto 31ct KUHS-225
Text: User Guide for FEBFSL126MR_H432v1 Evaluation Board 5V, 12V Green-Mode Fairchild Power Switch FPS Featured Fairchild Product: FSL126MR Direct questions or comments about this evaluation board to: “Worldwide Direct Support” Fairchild Semiconductor.com
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FEBFSL126MR
H432v1
FSL126MR
H432v1
FEBFSL126MR_H432V1
sck053 ceramic
buss SR-5
UU9.8 ferrite core
E157822
468-2FC
sck-053
E85640
Nitto 31ct
KUHS-225
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features • Designed for high-performance, double-balanced mixers Schottky diodes supplied 100% tested, sawn, mounted on film frame Low cost 4 1 Three barrier heights available
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DMF4102-099
DME4101-099
03306A
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nitto UV tape
Abstract: EME-6710 EME6710 Package 53 8000C MP800 sumitomo epoxy novolac
Text: 2.0 DEVICE INFORMATION 2.1 Datasheets 2.1.1 LMV7251/55 and LMV7235/395 LMV7251/LMV7255 1.8V Low Voltage Comparator with Rail-to-Rail Input General Description Features The LMV7251/LMV7255 are rail-to-rail input low voltage comparators, which can operate at supply voltage range of
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LMV7251/55
LMV7235/395
LMV7251/LMV7255
SC-70
OT23-5
LMV7251
LMV7255
nitto UV tape
EME-6710
EME6710
Package 53
8000C
MP800
sumitomo epoxy novolac
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A48 sc70
Abstract: FSC20010035 LMV301 LMV321 LMV821 SC70-5 SC70-5L LMV301MGX
Text: LMV301 Low Input Bias Current, Single Op Amp Qualification Package National’s LMV301–Low Power, Low Voltage, Single Op Amp Delivers RR/O in a Space Saving SC70 Package IBIAS Current vs. VCM 5 VS =5V 4 IBIAS pA - • Low Input Bias Current (0.18 pA Typ.)
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LMV301
SC70-5
A48 sc70
FSC20010035
LMV321
LMV821
SC70-5L
LMV301MGX
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hyperabrupt tuned oscillator
Abstract: "Varactor Diodes" UHF/tv tuner unit "Voltage Controlled Oscillators" symbol of varactor diode and equivalent circuit S1612 SMV1705 s1611
Text: DATA SHEET SMV1705 Hyperabrupt Tuning Varactors Supplied on Film Frame and Waffle Packs Applications • Wide bandwidth VCOs • VHF and UHF TV tuners • Analog phase shifters Features • Designed for high volume, low-cost battery applications • Low series resistance
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SMV1705
SMV1705-099)
SMV1705-000)
01124A
hyperabrupt tuned oscillator
"Varactor Diodes"
UHF/tv tuner unit
"Voltage Controlled Oscillators"
symbol of varactor diode and equivalent circuit
S1612
s1611
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s1611
Abstract: No abstract text available
Text: DATA SHEET SMV1705 Hyperabrupt Tuning Varactors Supplied on Film Frame and Waffle Packs Applications • Wide bandwidth VCOs • VHF and UHF TV tuners • Analog phase shifters Features • Designed for high volume, low-cost battery applications • Low series resistance
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SMV1705
SMV1705-099)
SMV1705-000)
01124A
s1611
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMV1705: Hyperabrupt Tuning Varactors Supplied on Film Frame and Waffle Packs Applications • Wide bandwidth VCOs VHF and UHF TV tuners Analog phase shifters Features Designed for high volume, low-cost battery applications Low series resistance
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SMV1705:
SMV1705-099)
SMV1705-000)
SQ04-0074.
SMV1705
201124B
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET SMV2025 Hyperabrupt Tuning Varactors Supplied on Film Frame and Waffle Packs Applications • Wide-bandwidth and low phase-noise VCOs Wide-range, voltage-tuned phase shifters and filters Miniature RF and microwave tuners Features
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SMV2025
1SV280
SMV2025-099)
SMV2025-000)
02913A
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transistor KSP 42
Abstract: irf950 IRFP100 transistor KSP 56 transistor KSP 92 G 23 ksp 36 93 IRF9500 transistor KSP 13 Samsung "NAND Flash" "ordering information" IRFP p-channel
Text: ORDERING INFORMATION KSV 3100A C N/ + BURN-IN OPTIONAL (SEE BURN-IN PROGRAM) PACKAGE TYPE (SEE EACH SPEC OF DEVICE) OPERATING TEMP IC’S ONLY BLANK: SEE INDIVIDUAL SPEC C : 0 - 70°C I : - 40 - 85°C M : - 5 5 - + 125°C DEVICE NUMBER AND SUFFIX (OPTIONAL)
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OT-23
O-220
100ns
120ns
150ns
200ns
16bit
transistor KSP 42
irf950
IRFP100
transistor KSP 56
transistor KSP 92 G 23
ksp 36 93
IRF9500
transistor KSP 13
Samsung "NAND Flash" "ordering information"
IRFP p-channel
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