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    MULTICORE SOLDER PASTE 62 Search Results

    MULTICORE SOLDER PASTE 62 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    MULTICORE SOLDER PASTE 62 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    GR-78-CORE

    Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
    Text: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased


    Original     		MP200 ANSI/J-STD-004 GR-78-CORE J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800 PDF

    SN62MP100AGS90

    Abstract: IPC-SF-818 multicore mp100 SN62MP100 prozone sc 01 cleaner multicore solder paste TR-NWT-000078 prozone solder powder Solder paste stencil life
    Text: E-MAIL: info@angliac.com WEB: www.angliac.com REFLOW SOLDERING SOLDER PASTES / CLEANER SCREEN/STENCIL AND REWORK CLEANER HIGH SPEED PRINTING, NO CLEAN, PIN TESTABLE Multicore MP100 solder cream has been formulated as a pale soft residue product for printing and reflow in air, where process yield


    Original     		MP100 150mm SC-01 500ml SN62MP100AGS90 SC-01 CAT/0135 SN62MP100AGS90 IPC-SF-818 multicore mp100 SN62MP100 prozone sc 01 cleaner multicore solder paste TR-NWT-000078 prozone solder powder Solder paste stencil life PDF

    NC-SMQ230

    Abstract: tamura rma tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a JEDEC SMT reflow profile VISCOSITY tamura solder paste tamura solder paste PROFILE 97SC soft solder dispensing
    Text: Surface Mounting SMT LED Indicator Components Application Note 1060 Contents Moisture Barrier Envelope Packaging • • • • • • • The optical grade materials used in SMT LED components absorb moisture directly from the air. Moisture absorbed in SMT LED components that have been reflow soldered


    Original     		5989-2268EN AV01-0654EN NC-SMQ230 tamura rma tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a JEDEC SMT reflow profile VISCOSITY tamura solder paste tamura solder paste PROFILE 97SC soft solder dispensing PDF

    Multicore 96SC

    Abstract: 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 5988-7963EN multicore solder paste 2C
    Text: The LPCC2x2 Package Application Note 1316 1. Introduction Avago’s LPCC2x2 package is a highly thermal efficient leadless package offering improved RF response over a wide operating frequency, DC - 6 GHz. The exposed die-attach paddle acts as a device grounding, heat


    Original     		5988-7963EN Multicore 96SC 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 multicore solder paste 2C PDF

    SZZA024

    Abstract: ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5
    Text: Application Report SZZA024 - January 2001 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT A nickel/palladium Ni/Pd lead finish for integrated circuits (IC) was introduced in 1989. In


    Original     		SZZA024 ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5 PDF

    Untitled

    Abstract: No abstract text available
    Text: XS1-L16A-128-QF124 Datasheet 2014/03/25 XMOS 2014, All Rights Reserved Document Number: X8006, XS1-L16A-128-QF124 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . 2 XS1-L16A-128-QF124 Features . . 3 Pin Configuration . . . . . . . . . .


    Original     		XS1-L16A-128-QF124 X8006, PDF

    AN1035

    Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
    Text: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction


    Original     		AN-1035 065mm. pp1509-1523 AN1035 tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602 PDF

    IEC 68-2-32

    Abstract: No abstract text available
    Text: Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou*, and T. Koh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore Abstract Manufacturers, suppliers, and industry consortia have all


    Original     		lead-f99, IEC 68-2-32 PDF

    solder voids to263

    Abstract: IEC 68-2-32 R/Detector/"detectors+ic"/"CD"/solder voids to263
    Text: Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou*, and T. Koh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore Abstract Manufacturers, suppliers, and industry consortia have all


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: XS1-L8A-64-TQ128 Datasheet 2013/12/09 XMOS 2013, All Rights Reserved Document Number: X2843, XS1-L8A-64-TQ128 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . 2 XS1-L8A-64-TQ128 Features . . . . 3 Pin Configuration . . . . . . . . . .


    Original     		XS1-L8A-64-TQ128 X2843, PDF

    TQ128

    Abstract: No abstract text available
    Text: XS1-L6A-64-TQ128 Datasheet 2013/12/09 XMOS 2013, All Rights Reserved Document Number: X7427, XS1-L6A-64-TQ128 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . 2 XS1-L6A-64-TQ128 Features . . . . 3 Pin Configuration . . . . . . . . . .


    Original     		XS1-L6A-64-TQ128 X7427, TQ128 PDF

    Untitled

    Abstract: No abstract text available
    Text: XS1-L6A-64-LQ64 Datasheet 2014/04/25 XMOS 2014, All Rights Reserved Document Number: X9194, XS1-L6A-64-LQ64 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . 2 XS1-L6A-64-LQ64 Features . . . . . 3 Pin Configuration . . . . . . . . . . 4


    Original     		XS1-L6A-64-LQ64 X9194, PDF

    Untitled

    Abstract: No abstract text available
    Text: XS1-L8A-64-LQ64 Datasheet 2014/04/25 XMOS 2014, All Rights Reserved Document Number: X4912, XS1-L8A-64-LQ64 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . 2 XS1-L8A-64-LQ64 Features . . . . . 3 Pin Configuration . . . . . . . . . . 4


    Original     		XS1-L8A-64-LQ64 X4912, PDF

    multicore solder paste

    Abstract: JESD22-B111 JESD22-b111 drop JEOL 6335F JESD22B111 JEOL 6335F PXI-6052E
    Text: Effect of Temperature on the Drop Reliability of Wafer-Level Chips Scale Packaged Electronic Assemblies T. T. Mattila, R. J. James, L. Nguyen* and J. K. Kivilahti Laboratory of Electronic Production Technology Helsinki University of Technology Otakaari 7 A, P.O.Box 3000


    Original     		HUTEPT-13, fi/Diss/2005/isbn9512279843/T) multicore solder paste JESD22-B111 JESD22-b111 drop JEOL 6335F JESD22B111 JEOL 6335F PXI-6052E PDF

    szza026

    Abstract: Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75
    Text: Application Report SZZA026 – July 2001 Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount Integrated Circuits Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT Texas Instruments has introduced a refined version of its nickel/palladium NiPd finish for


    Original     		SZZA026 40-billion szza026 Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75 PDF

    JESD22-B111

    Abstract: LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus
    Text: Reliability of Chip Scale Packages under Mechanical Shock Loading T. T. Mattila1, P. Marjamäki1, L. Nguyen2, and J. K. Kivilahti1 1 Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, 02150 Espoo, Finland 2 National Semiconductor Corporation


    Original     		JESD22-B111 100-bumps 36-bumps 48-leads gov/div898/handbook/, gov/div853/lead 20free/part1 LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus PDF

    SZZA031

    Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
    Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)


    Original     		SZZA031 Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste PDF

    663n

    Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 IEC 68-2-32 tamura solder paste
    Text: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4


    Original     		AN-1035 025mm 500mm 663n technical data sheet of tamura solder paste 100N AN-1050 AN-1080 IEC 68-2-32 tamura solder paste PDF

    mutoh ip-220

    Abstract: No abstract text available
    Text: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK


    Original     		kskimm12 RC22717 W0302-019) mutoh ip-220 PDF

    IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

    Abstract: entek Cu-56 CCGA Kester 953 Flux PEAK TRAY bga IBM ccga 23n50 Cu-56 APD-SBSC-101 T- 200x thinner
    Text: Ceramic Column Grid Array Assembly and Rework User’s Guide July 25, 2002  Copyright International Business Machines Corporation 2002. Copyright and Disclaimer All Rights Reserved Printed in the United States of America July 25, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or


    Original     		PDF

    AN-1035

    Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 A142A 663n tamura solder paste PROFILE
    Text: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4


    Original     		AN-1035 025mm 500mm AN-1035 technical data sheet of tamura solder paste 100N AN-1050 AN-1080 A142A 663n tamura solder paste PROFILE PDF

    Untitled

    Abstract: No abstract text available
    Text: XS1-L01A-LQ64 Datasheet 2012/10/15 XMOS 2012, All Rights Reserved Document Number: X1135, XS1-L01A-LQ64 Datasheet 1 Table of Contents 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Features . . . . . . . . . . . . . . . Pin Configuration . . . . . . . . . . Signal Description . . . . . . . . . .


    Original     		XS1-L01A-LQ64 X1135, PDF

    Untitled

    Abstract: No abstract text available
    Text: XS1-A6A-64-FB96 Datasheet 2013/12/09 XMOS 2013, All Rights Reserved Document Number: X9530, XS1-A6A-64-FB96 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . . . . . 2 XS1-A6A-64-FB96 Features . . . . . . . . . 3 Pin Configuration . . . . . . . . . . . . . .


    Original     		XS1-A6A-64-FB96 X9530, PDF

    Untitled

    Abstract: No abstract text available
    Text: XS1-A8A-64-FB96 Datasheet 2013/12/09 XMOS 2013, All Rights Reserved Document Number: X5391, XS1-A8A-64-FB96 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . . . . . 2 XS1-A8A-64-FB96 Features . . . . . . . . . 3 Pin Configuration . . . . . . . . . . . . . .


    Original     		XS1-A8A-64-FB96 X5391, PDF