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Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm 256 pin QFP 28 × 28 Terminal Spacing Linear = 0.4 A B 192 193 129 128 F Q R D C S detail of lead end 256 1 65 64 G H I M J M P K N L NOTE Each lead centerline is located within 0.09 mm (0.004 inch) of
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LA-3508A-1
S256GD-40-LMV,
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P120GD-80-LBB
Abstract: No abstract text available
Text: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of
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LA-3508A-1
OT-001T-01
P120GD-80-LBB,
P120GD-80-LBB
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7404
Abstract: jedec do 35 QFP JEDEC tray
Text: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315 322.6 SECTION A-A' 32.8 Applied Package 120-pin Plastic QFP 3.2mm thick 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) Quantity (pcs) MAX. 24 Tray
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120-pin
208-pin
7404
jedec do 35
QFP JEDEC tray
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QFP JEDEC tray
Abstract: JEDEC TRAY QFP JEDEC TRAY DIMENSIONS JEDEC tray standard nec 44-pin qfp
Text: TRAY CONTAINER UNIT : mm 6x16=96 99.3 18.70 14.30 135°C MAX. 19.86 A' MQFP 10×10×2.7 18.30 14.30 280.5 17.25 315.0 322.6 SECTION A-A' 14.30 Applied Package 44-pin Plastic QFP (2.7mm thick) 56-pin Plastic QFP (2.7mm thick) 4.72 (6.35) 9.53 7.62 135.9
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44-pin
56-pin
SSD-A-H6581
QFP JEDEC tray
JEDEC TRAY QFP
JEDEC TRAY DIMENSIONS
JEDEC tray standard
nec 44-pin qfp
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QFP JEDEC tray
Abstract: 7404 JEDEC TRAY QFP 32 jedec tray
Text: HEAT PROOF 7 150°C MAX 30.93 A 3x8 = 24 37.02 PPE 74.04 MQFP28×28×3.2 135.9 UNIT : mm A' 35.2 37.02 27.93 35.2 259.14 315.0 322.6 SECTION A – A' 35.2 (6.35) 7.62 27.37 3.77 Applied Package Quantity (pcs) Tray MQFP 28 × 28 × 3.2 120-pin plastic QFP (3.2mm thick)
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MQFP28
120-pin
160-pin
208-pin
256-pin
QFP JEDEC tray
7404
JEDEC TRAY QFP
32 jedec tray
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MD300-10A
Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
MD300-10A
QFN tray
tray datasheet bga
SIP 400B
TSOP TRAY 40 PIN
BGA package tray 64
NEC A39A 240
TSOP package tray
6-tsop
TRAY DIMENSIONS 132 PGA
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MO-112
Abstract: MS-029 MATRIX TRAY MS-022 LD240
Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced
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TQFP Shipping Trays
Abstract: MQFP Shipping Trays PB1083 Lattice PLSI
Text: Product Bulletin November, 1997 #PB1083 Lattice OEM Customer Ordering Guidelines For Standard Products Introduction Lattice has instituted new OEM ordering guidelines aimed at providing further enhancements to the quality of our products and services. These new guidelines will
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PB1083
1-888-ISP-PLDS
TQFP Shipping Trays
MQFP Shipping Trays
PB1083
Lattice PLSI
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MO-112
Abstract: MS-022 MS-029 DS250G JEDEC standard 033
Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,
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outline of the heat slug for JEDEC
Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
Text: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit
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MS-029/022
outline of the heat slug for JEDEC
heat slug for JEDEC
JEDEC Matrix Tray outlines
MS-029
QFP JEDEC tray
amkor exposed pad
245C
amkor
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LD 337
Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material
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7404
Abstract: MQFP Tray 28 QFP JEDEC tray 32MM
Text: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315.0 322.6 SECTION A-A' 32.8 3.82 6.35 7.62 27.3 Applied Package 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) 256-pin Plastic QFP (Fine Pitch) (3.2mm thick)
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208-pin
256-pin
7404
MQFP Tray 28
QFP JEDEC tray
32MM
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MS-029
Abstract: 144 QFP body size amkor
Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit
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out029
MS-029/022
MS-029
144 QFP body size
amkor
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MS-029
Abstract: JEDEC Matrix Tray outlines MS-022 copper heatsink prime power 1230 JEDEC standard 033 MS029
Text: LEADFRAME data sheet MQFP PowerQuad 2 Features: MQFP PowerQuad® 2 Packages: The MQFP PowerQuad® 2 PQ2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through
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MD300-10A
Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case
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P22C-100-300A-1
P8C-100-300B
P-DIP8-0300-2
MD300-2A
P8CT-100-300B2-1
MD300-1A
P8C-100-300A-1
X13769XJ2V0CD00
MD300-10A
P32C-100-600A
p20d100
C-PGA176-S15U-2
CDIP28
LA-0543A
tray bga
P-TQFP100-14X20-0
0x20010
P14DH-100-300A2-1
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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MS011809-4
MS011809-1
MS011809-5
MS011809-2
MS011809-6
MS011809-3
MS011809-7
MS011809
iso 1043-1
DIN 6120
iso 1043-1 polypropylene
j1344
sae j1344
W28B
D1972
DIN6120
d24j
TA11A
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tray 20 x 14
Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type
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E04102
tray 20 x 14
BGA 31 x 31 tray
bga trays
tray bga 17
bga tray
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MC9S12Dx256
Abstract: tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 EAR99 HCS12 HCS12 1k79x
Text: Page 1 of 4 MC9S12A256BCFU Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics
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MC9S12A256BCFU
MC9S12A256BCFU
HCS12
PQFP-G80
MC9S12Dx256
tray qfp 14x14 1.4
tray qfp 14x14
PEAK TRAY qfp 14x14
MC9S12A256CFUE
1K79X
peak mqfp 14x14
EAR99
HCS12 1k79x
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MS-026
Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is
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JESD51-7
Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Text: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull
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80mmC
JESD51-7
100L
JESD51-2
STATS ChipPAC
Techpoint
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TQFP Shipping Trays
Abstract: LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel
Text: Product Bulletin June, 1998 Updated #PB1084 Lattice Pre-Patterned and Tape and Reel Ordering Guidelines Introduction After reviewing customer ordering patterns and costs associated with providing prepatterned and/or tape and reel PLDs, Lattice has modified its minimum ordering quantity
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PB1084
1-888-ISP-PLDS
TQFP Shipping Trays
LATTICE plsi 3000
PB1084
lattice semiconductor tape and reel
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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MS011809-4
MS011809-1
MS011809-5
MS011809-2
MS011809-6
MS011809-3
MS011809-7
MS011809
iso 1043-1
DIN 6120
sae j1344
j1344
w28c
iso 1043-1 polypropylene
bga Shipping Trays
MEC34
BGA OUTLINE DRAWING
TSOP package tray
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MIL-STD-81705
Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes
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MQFP 28x28
Abstract: No abstract text available
Text: MHiâi a n r u g NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 24. 3. TRAY VACUUN PICKUP METHOD REQUIRES A 28 MM SQUARE MINIMUM WALLED PICKUP AREA, LOCATED AS
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5M-1994.
1X1012
28X28
28X28
MQFP 28x28
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