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    E-PAK MQFP-28X28-3.5MM

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    MQFP28 Datasheets Context Search

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    QFP JEDEC tray

    Abstract: 7404 JEDEC TRAY QFP 32 jedec tray
    Text: HEAT PROOF 7 150°C MAX 30.93 A 3x8 = 24 37.02 PPE 74.04 MQFP28×28×3.2 135.9 UNIT : mm A' 35.2 37.02 27.93 35.2 259.14 315.0 322.6 SECTION A – A' 35.2 (6.35) 7.62 27.37 3.77 Applied Package Quantity (pcs) Tray MQFP 28 × 28 × 3.2 120-pin plastic QFP (3.2mm thick)


    Original     		PDF MQFP28 120-pin 160-pin 208-pin 256-pin QFP JEDEC tray 7404 JEDEC TRAY QFP 32 jedec tray

    7404

    Abstract: QFP JEDEC tray JEDEC TRAY QFP 32 jedec tray
    Text: TRAY CONTAINER HEAT PROOF 7 PPE A' 35.20 37.02 27.93 35.20 NEC 150°C MAX 30.93 A 3x8 = 24 37.02 74.04 MQFP28×28×3.2 ××× 135.9 UNIT : mm 259.14 315.0 322.6 SECTION A – A' 35.20 3.77 (6.35) 7.62 27.37 Applied Package Quantity (pcs) Material 120-pin plastic QFP (3.2mm thick)


    Original     		PDF MQFP28 120-pin 160-pin 208-pin 256-pin SSD-A-H6295-3 7404 QFP JEDEC tray JEDEC TRAY QFP 32 jedec tray

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF