IPC-7527
Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2
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Untitled
Abstract: No abstract text available
Text: FDMF6704A - XSTM DrMOS The Xtra Small, High Performance, High Frequency DrMOS Module tm Benefits General Description 1 Ultra compact size - 6 mm x 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm x 8 mm DrMOS packages. 1 Skip mode SMOD [low side gate turn off] input.
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FDMF6704A
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Untitled
Abstract: No abstract text available
Text: FDMF6704 - XSTM DrMOS tm The Xtra Small, High Performance, High Frequency DrMOS Module Benefits General Description 1 Ultra compact size - 6 mm x 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm x 8 mm DrMOS packages. The XSTM DrMOS family is Fairchild’s next-generation fullyoptimized, ultra-compact, integrated MOSFET plus driver power
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FDMF6704
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IPC-SM-7525A
Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
Text: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its
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AN-9048
IPC-A-610-D,
J-STD-001D,
IPC-SM-7525A,
JESD22-B102D,
FDMF6700,
FDMF6704,
FDMF6704A,
FDMF6704V,
FDMF6730
IPC-SM-7525A
ipc 610D
IPC-7525
J-STD-001C
IPC-4101B
entek ht plus
JSTD001D
7525A smt
j-std-001d
IPC610D
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Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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AK08D300-CLCC
Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
AK08D300-CLCC
AK08D300-LFCSP2X3 .5mm
AK08D300-LFCSP3x3 .5mm
AK08D300-MLP.65mm
AK10D300-8SON .65mm
MLP 3X3
MLP 4X4
AK22D300-DFN
AK24D300-LLP
MLP 5X5
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QFN leadframe
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
QFN leadframe
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Untitled
Abstract: No abstract text available
Text: 28 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK28DW600-PLCC
AK28DWS600-PLCC
AK28DWS600-32PLCC-M
AK28DW600-32PLCC-M
AK28D600-32PLCC
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Untitled
Abstract: No abstract text available
Text: 30 Pin to 32 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK32D600-QFN/MLP
6MM-32
7MM-32
AK32D600-QFN
DA26A)
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Untitled
Abstract: No abstract text available
Text: 30 Pin to 32 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK32D600-QFN/MLP
6MM-32
7MM-32
AK32D600-QFN
DA26A)
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Untitled
Abstract: No abstract text available
Text: 36 Pin to 40 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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6MM-40
AK40D600-TSOP
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577ns
Abstract: FIN212AC
Text: FIN212AC 12-Bit Serializer / Deserializer Supporting Cameras and Small Displays Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND) Package
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FIN212AC
12-Bit
40MHz
32-Terminal
42-Ball
FIN212ACMLX
FIN212ACGFX
577ns
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Abstract: No abstract text available
Text: FIN212AC 12-Bit Serializer / Deserializer Supporting Cameras and Small Displays Description Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND)
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FIN212AC
12-Bit
12-Bit
40MHz
32-Terminal
42-Ball
FIN212ACMLX
FIN212ACGFX
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Abstract: No abstract text available
Text: FIN210AC 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz Description Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP)
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FIN210AC
10-Bit
48MHz
10-bit
32-Terminal
42-Ball
FIN210ACMLX
FIN210ACGFX
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FIN212AC
Abstract: 30 pin flex cable lcd 5M cmos camera ipc-SM-782 mobile camera interface microcontroller DSO20 FIN212ACGFX FIN212ACMLX JESD22-A114 dsi LCD driver
Text: FIN212AC 12-Bit Serializer / Deserializer Supporting Cameras and Small Displays Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND) Package
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FIN212AC
12-Bit
12-Bit
40MHz
32-Terminal
42-Ball
FIN212ACMLX
FIN212ACGFX
FIN212AC
30 pin flex cable lcd
5M cmos camera
ipc-SM-782
mobile camera interface microcontroller
DSO20
FIN212ACGFX
FIN212ACMLX
JESD22-A114
dsi LCD driver
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emi line filter 48MHz
Abstract: Dp 104 FIN210AC 30 pin flex cable lcd mobile camera interface microcontroller DSO20 FIN210 FIN210ACGFX FIN210ACMLX JESD22-A114
Text: FIN210AC 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND)
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FIN210AC
10-Bit
48MHz
10-bit
32-Terminal
42-Ball
FIN210ACMLX
FIN210ACGFX
emi line filter 48MHz
Dp 104
FIN210AC
30 pin flex cable lcd
mobile camera interface microcontroller
DSO20
FIN210
FIN210ACGFX
FIN210ACMLX
JESD22-A114
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FIN210AC
Abstract: 13M-pixel Dp 104 DSO20 FIN210 FIN210ACGFX FIN210ACMLX JESD22-A114 337 BGA footprint PWS1.1
Text: FIN210AC 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND)
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FIN210AC
10-Bit
48MHz
10-bit
32-Terminal
42-Ball
FIN210ACMLX
FIN210ACGFX
FIN210AC
13M-pixel
Dp 104
DSO20
FIN210
FIN210ACGFX
FIN210ACMLX
JESD22-A114
337 BGA footprint
PWS1.1
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Dp 104
Abstract: 30 pin flex cable lcd mobile camera interface microcontroller DSO20 FIN210 FIN210AC FIN210ACGFX FIN210ACMLX JESD22-A114 PWS1.1
Text: FIN210AC 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND)
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FIN210AC
10-Bit
48MHz
10-bit
32-Terminal
42-Ball
FIN210ACMLX
FIN210ACGFX
Dp 104
30 pin flex cable lcd
mobile camera interface microcontroller
DSO20
FIN210
FIN210AC
FIN210ACGFX
FIN210ACMLX
JESD22-A114
PWS1.1
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SiC762CD
Abstract: SiC769 SiC769CD 300khz mosfet driver IC SiC762 SiC769A ISL6336A drMOs intel drMOS 2.0
Text: V i sh ay I n t e r t e ch n o l o g y, I n c . DrMOS The new Vishay Siliconix SiC769, SiC769A, and SiC762 integrated DrMOS solutions provide high-side and low-side n-channel MOSFETs plus a full-featured MOSFET driver IC, all in a single PowerPAK MLF6x6 package.
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SiC76
9/SiC76
/SiC762
SiC769,
SiC769A
SiC762
VMN-PT0172-1002
SiC762CD
SiC769
SiC769CD
300khz mosfet driver IC
ISL6336A
drMOs
intel drMOS 2.0
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Abstract: No abstract text available
Text: Click here for this datasheet translated into Korean! FIN324C 24-Bit Ultra-Low Power Serializer Deserializer Supporting Single and Dual Displays Features Description Ultra-Low Operating Power: ~4mA at 5.44MHz No External Timing Reference Needed
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FIN324C
24-Bit
FIN324C
44MHz
15MHz
AN-5058:
AN-5061:
AN-6031:
AN-6031
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SC451
Abstract: sc1479
Text: SC451 Portable IMVP-IV and IMVP-IV+™ Single Phase Power Supply Controller POWER MANAGEMENT Description Features The SC451 PowerStep IV™ IC is a single chip high-performance Hysteretic PWM controller. With its integrated SmartDriver™, it powers advanced IMVP-IV™ and IMVP4+™
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SC451
6X6-28
TSSOP-28
TSSOP-38
SC450.
sc1479
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SC1479
Abstract: SC451 SC450 TSSOP-28 TSSOP-38
Text: SC451 Portable IMVP-IV and IMVP-IV+™ Single Phase Power Supply Controller POWER MANAGEMENT Description Features The SC451 PowerStep IV™ IC is a single chip high-performance Hysteretic PWM controller. With its integrated SmartDriver™, it powers advanced IMVP-IV™ and IMVP4+™
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SC451
SC451
6X6-28
TSSOP-28
TSSOP-38
SC450.
SC1479
SC450
TSSOP-28
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Abstract: No abstract text available
Text: SC451 Portable IMVP-IV and IMVP-IV+™ Single Phase Power Supply Controller POWER MANAGEMENT Description Features The SC451 PowerStep IV™ IC is a single chip high-performance Hysteretic PWM controller. With its integrated SmartDriver™, it powers advanced IMVP-IV™ and IMVP4+™
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SC451
SC451
6X6-28
TSSOP-28
TSSOP-38
SC450.
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