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    Untitled

    Abstract: No abstract text available
    Text: LC Modules MULTILAYER CHIP IFTS, MIA AND MIF SERIES FEATURES • Closed magnetic circuit configuration eliminates cross coupling. Suitable for high density applications. • Monolithic inorganic material construction for high reliability. PC BOARD PATTERNS


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    PDF MIA3225AR455 MIF3225F25R0 MIF3225F25R0 MIF3225F10R7 BBE-016, EVE-001

    tdk marking code

    Abstract: TDK EL
    Text: Multilayer Chip IFTs MIA and MIF Series FEATURES PRODUCT IDENTIFICATIONS MIA 3225 AR455 O □ □ □ • Shielded construction to minimize crosstalk in density mounting applications. • Adjustment free IFTs are well suited for high volume automated assembly.


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    PDF AR455 F10R7 455kHz 25MHz F10R7 F25R0 MIA3225 tdk marking code TDK EL

    10.7MHz, shielded IF transformer

    Abstract: No abstract text available
    Text: Multilayer Chip IFTs MIA and MIF Series TDK has produced the world’s smallest Chip IFT. This adjustment free monolithic circuit is packaged in 3225 3.2L x 2.5W mm [.126 x .098 inches] size. The internal capacitor and transformer are multilayered and cofired resulting in high reliability parts.


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    PDF AR455 F10R7 MIA3225 MIF3225 10.7MHz, shielded IF transformer