Untitled
Abstract: No abstract text available
Text: LC Modules MULTILAYER CHIP IFTS, MIA AND MIF SERIES FEATURES • Closed magnetic circuit configuration eliminates cross coupling. Suitable for high density applications. • Monolithic inorganic material construction for high reliability. PC BOARD PATTERNS
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MIA3225AR455
MIF3225F25R0
MIF3225F25R0
MIF3225F10R7
BBE-016,
EVE-001
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tdk marking code
Abstract: TDK EL
Text: Multilayer Chip IFTs MIA and MIF Series FEATURES PRODUCT IDENTIFICATIONS MIA 3225 AR455 O □ □ □ • Shielded construction to minimize crosstalk in density mounting applications. • Adjustment free IFTs are well suited for high volume automated assembly.
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AR455
F10R7
455kHz
25MHz
F10R7
F25R0
MIA3225
tdk marking code
TDK EL
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10.7MHz, shielded IF transformer
Abstract: No abstract text available
Text: Multilayer Chip IFTs MIA and MIF Series TDK has produced the world’s smallest Chip IFT. This adjustment free monolithic circuit is packaged in 3225 3.2L x 2.5W mm [.126 x .098 inches] size. The internal capacitor and transformer are multilayered and cofired resulting in high reliability parts.
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AR455
F10R7
MIA3225
MIF3225
10.7MHz, shielded IF transformer
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