Untitled
Abstract: No abstract text available
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),
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PDF
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MDP1645
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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208E
Abstract: MDP1646D04 MDP 16
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83 mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55 °C to + 125 °C , MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°C
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Original
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PDF
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18-Jul-08
208E
MDP1646D04
MDP 16
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Untitled
Abstract: No abstract text available
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),
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Original
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PDF
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MDP1645
MDP1646
11-Mar-11
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Untitled
Abstract: No abstract text available
Text: MDP 45, 46 www.vishay.com Vishay Dale 厚膜电阻网络，双排，模压 DIP Thick Film Resistor Networks, Dual-In-Line, Molded DIP 特性 • • • • • • • • • 可采用 TTL/ECL 传输和 SCSI-BUS 信号终端结构 0.190" 4.83 mm 最大座高
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Original
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PDF
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2011/65/EU
2002/95/ECã
2002/95/EC
2011/65/EUã
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),
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Original
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PDF
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MDP1645
MDP1646
18-Jul-08
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Untitled
Abstract: No abstract text available
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Low temperature coefficient (- 55 °C to + 125 °C),
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Original
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PDF
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MDP1645
MDP1646
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
|
208E
Abstract: MDP1646D04 MDP 16
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C
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Original
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PDF
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100ppm/
250ppm/
MDP1645
08-Sep-04
208E
MDP1646D04
MDP 16
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Untitled
Abstract: No abstract text available
Text: MDP 45, 46 www.vishay.com Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available Available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction
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Original
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PDF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
|
208E
Abstract: MDP1646D04 MDP 16
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83 mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55 °C to + 125 °C , MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°C
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Original
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PDF
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08-Apr-05
208E
MDP1646D04
MDP 16
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A016 SMD
Abstract: M8340102K smd marking code A008 smd A018 MDP1603 a015 SMD AC 31061 10k resistor array SIP a014 SMD transistor a015 SMD
Text: VISHAY I N T E R T E C H N O L O G Y , I N C . INTERACTIVE data book rEsIStor ARRays and Networks vishay DALE vsD-db0011-0410 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents
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PDF
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vsD-db0011-0410
A016 SMD
M8340102K
smd marking code A008
smd A018
MDP1603
a015 SMD
AC 31061
10k resistor array SIP
a014 SMD
transistor a015 SMD
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Untitled
Abstract: No abstract text available
Text: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C
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Original
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PDF
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100ppm/
250ppm/
MDP1645
MDP1646
08-Apr-05
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