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    JEDEC TRAY STANDARD Search Results

    JEDEC TRAY STANDARD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    JEDEC TRAY STANDARD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
    Text: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /


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    PDF OT-007TM-01 JEDEC TRAY DIMENSIONS JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL

    Untitled

    Abstract: No abstract text available
    Text: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78954 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A


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    PDF PS-78954 E29179 LR19980

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    Abstract: No abstract text available
    Text: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78968 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A


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    PDF PS-78968 E29179 LR19980 100Gold

    EIA and EIAJ tape standards

    Abstract: TR3000MT TR-3000MT EIA and EIAJ standards
    Text: TAPE AND REEL EQUIPMENT REEL-TECH TR-3000MT • ■ ■ ■ ■ ■ ■ ■ Dual pick-and-place probes 3400 UPH tray-to-tape Continuous operation 8-inch high stack of JEDEC trays Easy PC control Quick, accurate changeovers Mark, implied lead and pin #1 Vision


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    PDF TR-3000MT TR-3000MT EIA and EIAJ tape standards TR3000MT EIA and EIAJ standards

    trays

    Abstract: QFN Shipping Trays PEAK TRAY bga
    Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad


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    Teradyne connector

    Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
    Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight


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    PDF TB-2082 Teradyne connector 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


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    PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


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    PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


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    PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP

    SMT CONNECTOR

    Abstract: JEDEC tray standard
    Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles


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    PDF MO-160 MO-160 SMT CONNECTOR JEDEC tray standard

    MO-160

    Abstract: MO-190 JEDEC tray standard
    Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles


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    PDF MO-160 MO-160 MO-190 JEDEC tray standard

    2013310-2

    Abstract: JEDEC tray standard DIMM 240 2013298-1 2-2013310-1 2013289-1
    Text: DDR3 DIMM Sockets TE Connectivity’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to


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    JEDEC dip profile

    Abstract: No abstract text available
    Text: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles


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    PDF MO-160 MO-160 JEDEC dip profile

    LQFP-48 thermal pad

    Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


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    TQFP 100 pin ic

    Abstract: 208ld
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


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    ANSI/EOS ESD S11.11-2001

    Abstract: EIA-625 1x10E-8 EIA-541 SSTV16857 SSYA010 abstract for "metal detector" 1x10e9
    Text: Application Report SZZA047 - July 2004 Semiconductor Packing Material Electrostatic Discharge ESD Protection Albert Escusa and Lance Wright Standard Linear and Logic ABSTRACT Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)


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    PDF SZZA047 ANSI/EOS ESD S11.11-2001 EIA-625 1x10E-8 EIA-541 SSTV16857 SSYA010 abstract for "metal detector" 1x10e9

    Untitled

    Abstract: No abstract text available
    Text: m o le x Sockets a n d Edge C onnecto rs FEATURES A N D SPECIFICATIONS Features and Benefits Electrical • Zero insertion force contacts improve socket and module contact life ond provide fo r fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard


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    PDF 30mC2

    IR 9530

    Abstract: No abstract text available
    Text: Sockets and Edge Connectors FEATURES ANDSPECMCAHOHS features and Benefits • Zero insertion farce contacts improve socket and module contact life and provide fo r fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard JEDEC module


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    GS-14-899

    Abstract: MO-269 DDR3 memory DDR3 sodimm socket DDR3 rDIMM DDR3 pcb design GS-12-486 ddr3 dimm connector sc007
    Text: BOARD-TO-BOARD CONNECTORS FCÎ, DDR3 MEMORY MODULE SOCKETS DESCRIPTION Memory module sockets from FCI are designed to accept most industry standard memory types DDR, DDR2, DDR3 and form factors such as DIMM, SO-DIMM or VLP DIMM. The sockets allow convenient memory


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    PDF 240-posltlon MO-269. UL94V-0 GS-12-486 S0-009 MO-269 GS-14-899 MO-269 DDR3 memory DDR3 sodimm socket DDR3 rDIMM DDR3 pcb design ddr3 dimm connector sc007

    Untitled

    Abstract: No abstract text available
    Text: S o c k e ts a n d E d g e C o n n e c to rs FEATURES AMD SPECIFICATIONS Features and Benefits • Zero insertion force contacts improve socket and module contact life and provide for fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard


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    PDF MO-64

    Untitled

    Abstract: No abstract text available
    Text: • Guaranteed 2 points o f contact per readout with standard JEDEC module m o l e x 2.54mm x 12.70mm Flectrical .100 x .500" Pitch Voltage: 2S0V SIMM Classic Current: 1.0A Contact Resistance: 30mC2 max. SIMM Socket Dielectric Withstanding Voltage: 1000V AC


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    PDF 30mC2