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    Semicoa Semiconductors JANKCA2N3019

    Low Power - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: JANKCA2N3019)
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    Avnet Americas JANKCA2N3019 Waffle Pack 1
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    2N3700 DIE

    Abstract: PCB land 2n3700ub Dose 2N3700 2N3019 DIE 2N3700 JAN 2N3019 2N3019S 2N3057A 2N3700 2N3700UB
    Text: INCH-POUND The documentation and process conversion measures necessary to comply with this document shall be completed by 11 November 2010. MIL-PRF-19500/391M 20 September 2010 SUPERSEDING MIL-PRF-19500/391L 15 January 2008 PERFORMANCE SPECIFICATION SHEET


    Original     		MIL-PRF-19500/391M MIL-PRF-19500/391L 2N3019, 2N3019S, 2N3057A, 2N3700, 2N3700UB, 2N3700 DIE PCB land 2n3700ub Dose 2N3700 2N3019 DIE 2N3700 JAN 2N3019 2N3019S 2N3057A 2N3700 2N3700UB PDF