JEDEC J-STD-020C
Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public
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J-STD-020C
J-STD-020B
1-580987-46-X
JEDEC J-STD-020C
JESD47
Reliability Test Methods for Packaged Devices
Infineon moisture sensitive package
JESD-47
JESD22-A120
AMD reflow soldering profile BGA
J-STD-035
semiconductors cross reference
ipc-sm-786A
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Reflow
Abstract: JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1
Text: IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public
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J-STD-020D
J-STD-020D
Reflow
JEDEC J-STD-020d.1
JEP-140
JEP140
J-STD-035
JESD22-B112
JEDEC J-STD-020d
JESD47
JESD22-B108
IPC-020d-5-1
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Untitled
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. C 2 3 RELEASED FOR PUBLICATION LOC 1 REVISIONS DIST ALL RIGHTS RESERVED. COPYRIGHT D P DESCRIPTION LTR DATE DWN APVD D 0.79 OVERALL THICKNESS 8.45 NOTES: UNLESS OTHERWISE SPECIFIED. 1. FABRICATE TO MEET IPC - 6012, CLASS 2. INSPECT TO MEET IPC - A - 600, CLASS 2.
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ML200D,
TEC-138-702
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J-STD-020-C
Abstract: J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Text: Lead-Free Reflow Profile Recommendation IPC/JEDEC J-STD-020C Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP
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J-STD-020C)
J-STD-020-C
J-STD-020C
JEDEC J-STD-020c
020C
reflow profile
JSTD020C
JEDEC wave
reflow profile 245
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Untitled
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 2 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC 1 REVISIONS DIST ALL RIGHTS RESERVED. P DESCRIPTION LTR DATE DWN APVD D D .031 OVERALL THICKNESS .148 NOTES: UNLESS OTHERWISE SPECIFIED. .506 1. FABRICATE TO MEET IPC - 6012, CLASS 2.
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1513431-1revF1
ML200D,
C-1513126
TEC-138-702
31MAR2000
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Untitled
Abstract: No abstract text available
Text: AN0333 APPLICATION NOTE 0333 REFLOW SOLDER PROFILE RECOMMENDATION Introduction This application note provides guidelines for Diodes semiconductor packages relating to: • the board mounting • recommended reflow solder profiles This guideline based on IPC/JEDEC J-STD-020D.1 March 2008.
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AN0333
J-STD-020D
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BGA reflow guide
Abstract: pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga
Text: Solder Reflow Guide for Surface Mount Devices November 2010 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which
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TN1076
1-800-LATTICE
BGA reflow guide
pcb warpage* in smt reflow
pcb warpage in ipc standard
JEDEC SMT reflow profile
324 bga thermal
reballing
lattice pb-free
lattice pb-free products
reballing bga
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BGA reflow guide
Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
Text: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which
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TN1076
1-800-LATTICE
BGA reflow guide
JEDEC SMT reflow profile
BGA PROFILING
304-PQFP
reballing
fine BGA thermal profile
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JEDEC J-STD-033b.1
Abstract: ipc-JEDEC J-STD-033 JEDEC J-STD-033b J-STD-020D J-STD-033 Drypacked Devices AN-2029
Text: National Semiconductor Application Note 2029 Martin Schnepf June 18, 2010 Introduction inside the package can create excessive internal pressure resulting in delamination or even cracked package popcorn effect . NSC’s components that are considered moisture sensitive
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J-STD-020
J-STD-033
AN-2029
JEDEC J-STD-033b.1
ipc-JEDEC J-STD-033
JEDEC J-STD-033b
J-STD-020D
Drypacked Devices
AN-2029
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JEDEC J-STD-033
Abstract: jedec JESD625-a RF2057 J-STD-033 96SCAGS89 SN62 PB36 ag2 JESD625-A J-STD-033 PCB multicore solder paste 62 JESD625A
Text: Manufacturing Notes for RF2057 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is
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RF2057
EUDirective2002/95/EC
RF2057
JESD625-A;
J-STD-033)
JEDEC J-STD-033
jedec JESD625-a
J-STD-033
96SCAGS89
SN62 PB36 ag2
JESD625-A
J-STD-033 PCB
multicore solder paste 62
JESD625A
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JESD625-A
Abstract: J-STD-033 PCB Multicore CR39 RF5500 J-STD-033 SN62 PB36 ag2 JEDEC J-STD-033 rework station diagram IPC-020b-5-1
Text: Manufacturing Notes for RF5500 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is
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RF5500
EUDirective2002/95/EC
RF5500
JESD625-A;
J-STD-033)
5500010B
JESD625-A
J-STD-033 PCB
Multicore CR39
J-STD-033
SN62 PB36 ag2
JEDEC J-STD-033
rework station diagram
IPC-020b-5-1
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JEDEC J-STD-033
Abstract: RF2059 JESD625-A J-STD-033 GETEK FR4 SN62 PB36 ag2 JEDEC J-STD-033 TAPE AND REEL
Text: Manufacturing Notes for RF2059 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. "RFMD" for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is
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RF2059
EUDirective2002/95/EC
RF2059
JESD625-A;
J-STD-033)
JEDEC J-STD-033
JESD625-A
J-STD-033
GETEK FR4
SN62 PB36 ag2
JEDEC J-STD-033 TAPE AND REEL
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
E41599
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
32VAC
63VDC
E41599
11Blister
22Blister
24Blister
26Blister
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
32VAC
63VDC
E41599
11Blister
22Blister
24Blister
26Blister
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
32VAC
63VDC
E41599
11Blister
22Blister
24Blister
26Blister
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
32VAC
63VDC
E41599
11Blister
22Blister
24Blister
26Blister
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/PG01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/PG01
E41599
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/PG01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/PG01
E41599
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/PG01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/PG01
E41599
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
32VAC
63VDC
E41599
11Blister
22Blister
24Blister
26Blister
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Untitled
Abstract: No abstract text available
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
E41599
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106E
Abstract: J-STD-020D
Text: USI 1206 Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 3.2 x 1.6 mm, Quick-Acting F, 32 VAC, 63 VDC IEC 60127-4 • 32 VAC · 63 VDC · Quick-Acting F Description Applications - IEC characteristic - High melting I²t-values - Secondary Protection DC and AC
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com/pg01
32VAC
63VDC
E41599
106E
J-STD-020D
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Atmel DATE CODE at25256
Abstract: FM24Cxx AT25256 FM25256 FM30C256 "Ferroelectric RAM" circuit cellar
Text: Battery-Free Nonvolatile RAM Do you have a RAM-hungry design in the works? If so, check out what Brian has to say about Ramtron International’s integrated processor companions. They may be the perfect solution for your memory problems. J. oday's microcontrollers come with
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AT25256
FM25256
Atmel DATE CODE at25256
FM24Cxx
FM30C256
"Ferroelectric RAM"
circuit cellar
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