7m7004s
Abstract: No abstract text available
Text: y §jl'v\ SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 32 CMOS EEPROM MODULE IDT7M7004 Integrated D ev ic e T ech n o lo g y , In c. DESCRIPTION: FEATURES: H igh-density 1 m eg ab it C M O S E E P R O M m odule M e m b e r of th e S u b s y s te m s " F le x i-P a k ” F a m ily of
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IDT7M7004
IDT7M7014)
7M7004
66-pin
AO-14
7m7004s
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Untitled
Abstract: No abstract text available
Text: S ix SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 32 CMOS EEPROM MODULE dt) IDT7M7004 Integrated Device Technology, Inc. DESCRIPTION: FEATURES: T h e ID T 7 M 7 0 0 4 is a hig h -s p e e d , high-density 1 m eg ab it • H igh-density 1 m eg ab it C M O S E E P R O M
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IDT7M7004
IDT7M7014)
7M7004
66-pin
A14mustspeci
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128k x 8 eeprom
Abstract: 64k x 8 64k x 8 sram
Text: GENERAL INFORMATION THE SUBSYSTEM'S “FLEXI-PAK ” CMOS MODULE FAMILY Integrated Device Technology, Inc. SRAM, EPROM, & EEPROM MODULES FEATURES: DESCRIPTION: • High-density modules using high-speed CMOS SRAM, EPROM, and EEPROM components. • Inter-changeable modules, with equivalent footprints,
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util7004
IDT7M7014
IDT7M7012
16/32K
IDT7M7002
IDT7M7022*
-256K
IDT7M7032*
128k x 8 eeprom
64k x 8
64k x 8 sram
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Untitled
Abstract: No abstract text available
Text: SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 32 CMOS EEPROM MODULE IDT7M7004 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 1 megabit CMOS EEPROM module • M em ber of the Subsystem s "F le xi-P a k" Fam ily of interchangeable modules with equivalent pin-outs
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IDT7M7004
IDT7M7014)
7M7004
66-pin
AO-14
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Untitled
Abstract: No abstract text available
Text: I N T E G R A T E » DE VI CE 3ÔE D • M Ö 2 S 7 7 1 O D G S I S M 1 ■ IDT THE SU B SY ST EM 'S “FLEXI-PAK ” CM O S MODULE FAMILY Integrated Device Technology, Inc. GENERAL INFORMATION SRAM, EPROM, & EEPROM MODULES \ Ol FEATURES: DESCRIPTION: • High-density modules using high-speed C M O S SRAM,
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66-pin,
IDT7M7014
IDT7M7012
16/64KX8
IDT7M7002
1DT7M7022*
-256K
128Kx
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