128k x 8 eeprom
Abstract: 64k x 8 64k x 8 sram
Text: GENERAL INFORMATION THE SUBSYSTEM'S “FLEXI-PAK ” CMOS MODULE FAMILY Integrated Device Technology, Inc. SRAM, EPROM, & EEPROM MODULES FEATURES: DESCRIPTION: • High-density modules using high-speed CMOS SRAM, EPROM, and EEPROM components. • Inter-changeable modules, with equivalent footprints,
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OCR Scan
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PDF
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util7004
IDT7M7014
IDT7M7012
16/32K
IDT7M7002
IDT7M7022*
-256K
IDT7M7032*
128k x 8 eeprom
64k x 8
64k x 8 sram
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Untitled
Abstract: No abstract text available
Text: I N T E G R A T E » DE VI CE 3ÔE D • M Ö 2 S 7 7 1 O D G S I S M 1 ■ IDT THE SU B SY ST EM 'S “FLEXI-PAK ” CM O S MODULE FAMILY Integrated Device Technology, Inc. GENERAL INFORMATION SRAM, EPROM, & EEPROM MODULES \ Ol FEATURES: DESCRIPTION: • High-density modules using high-speed C M O S SRAM,
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OCR Scan
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PDF
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66-pin,
IDT7M7014
IDT7M7012
16/64KX8
IDT7M7002
1DT7M7022*
-256K
128Kx
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