Untitled
Abstract: No abstract text available
Text: D a ta S h e e t , V0 . 8 , A u g . 2 0 0 3 HY S6 4T320 00GDL 2 56 M B y t e HY S6 4T640 20GDL ( 5 12 M B y t e) D DR 2 S m a l l O ut li ne D I M M M o du le s Mem ory P ro duc ts N e v e r s t o p t h i n k i n g . HYS64T32000GDL HYS64T64020GDL Preliminary Datasheet Rev. 0.8 (08.03)
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4T320
00GDL
4T640
20GDL
HYS64T32000GDL
HYS64T64020GDL
200-pin
PC2-3200S
/-4300S
/-5300S
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CNS4785
Abstract: No abstract text available
Text: MICRO SPEAKER MODEL 40CS08P - 50ND1 Hy-Q International 4.4±0.2 Ø40.0±0.2 ALLOW AT LEAST 0.5 FOR DIAPHRAGM MOVEMENT 0.6±0.2 BAFFLE OPENING Ø37.0 1.5±0.2 2.3±0.2 Distance of Loudspeaker to Microphone:- 10cm 0.1 Watt 100 dB SPL 2.83 Volts 90 80 70 60 50
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40CS08P
50ND1
20kHz
20000Hz
SPL-10dB
CNS4784
CNS4785
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT505-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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OT505-2
OT505-2
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RF-WNMP30DS-EG-HY
Abstract: No abstract text available
Text: SPECIFICATIONS FOR REFOND SURFACE MOUNT LED Model: RF-WNMP30DS-EG-HY Company Name: Confirmed By Customer: DATE: Feature ◆ ◆ ◆ ◆ Viewing angle:120 deg The materials of the LED dice is InGaN 3.50mmx2.80mm×1.90mm SMT-LED RoHS compliant lead-free soldering compatible
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RF-WNMP30DS-EG-HY
008inch)
WI--E--045
W46003
RF-WNMP30DS-EG-HY
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA56 package SOT911-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA56
OT911-1
OT911-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA49 package SOT1075-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA49
OT1075-1
OT1075-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA48 package SOT1063-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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VFBGA48
OT1063-1
OT1063-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA54 package SOT1065-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA54
OT1065-1
OT1065-1
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3.6864MHz
Abstract: 4.433619 crystal 7.3728MHz 4.608MHZ 10.245MHz crystal 24.576MHZ QC49/CRYSTAL 92.16MHZ 16.000M CRYSTAL 92.16MHZ 16.384MHZ
Text: MICROPROCESSOR CRYSTAL QC49/S QC59/S Hy-Q International QC49/S QC59/S 3.9 MAX. 3.9 MAX. 12.7±0.2 12.7±0.2 Ø0.50±0.05 TYP. Ø0.50±0.05 TYP. 11.1±0.2 11.1±0.2 4.7±0.2 4.7±0.2 SPECIFICATIONS 1.00 MHz to 200 MHz Refer note 1. NOMINAL FREQUENCY ±50ppm
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QC49/S
QC59/S
QC49/S
50ppm
30ppm
50ppm
000312MHz
0000MHz
433619MHz
3.6864MHz
4.433619
crystal 7.3728MHz
4.608MHZ
10.245MHz crystal
24.576MHZ
QC49/CRYSTAL 92.16MHZ
16.000M
CRYSTAL 92.16MHZ
16.384MHZ
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON16 package SOT1308-1 Gx D 0.105 P C SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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HVSON16
OT1308-1
sot1308-1
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hy-q
Abstract: OSC 50.000MHZ CO21
Text: SURFACE MOUNT CRYSTALS QSMC - 2810, QSMC - 2820 Hy-Q International QSMC - 2810 1.6 4.0 0.8 2.0 1.3 1.3 1.3 2.5 0.4 0.7 1.3 Ceramic Ceramic Suggested Pad Layout Top View QSMC - 2820 1.6 0.7 4.0 2.0 1.3 1.3 1.3 0.4 0.7 2.5 1.3 Metal Suggested Pad Layout Ceramic
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000MHz
10ppm
10ppm
50ppm
50ppm
hy-q
OSC 50.000MHZ
CO21
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74573 buffer
Abstract: 159744 16257 74.573
Text: PROGRAMMABLE CRYSTAL OSCILLATOR EXO - 3 SERIES Hy-Q International MAXIMUM ABSOLUTE RATING 12.8 MAX. 8 7 6 ITEM 5 SYMBOL POWER SUPPLY VOLTAGE 7.0 MAX. INPUT VOLTAGE 1 2 3 OUTPUT VOLTAGE 4 STORAGE TEMPERATURE RANGE ø1.6 VDD -0.5 to +7.0 Volts VI -0.03 to VDD +0.3 Volts
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100ppm
74573 buffer
159744
16257
74.573
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3.2768MHz crystal
Abstract: 14.7456MHz crystal smd 7.9872mhz crystal 11.0592mhz 10.245MHz crystal CRYSTAL 92.16MHZ crystal 18.432mhz 5.120MHZ QC49/QC49/SMD 3728MHZ
Text: MICROPROCESSOR CRYSTAL QC49/U QC49/S QC49/SMD Hy-Q International QC49/S QC49/U QC49/SMD 11.05±0.2 10.3±0.2 3.9 MAX. 4.65±0.2 5.0±0.2 12.7±0.2 12.3±0.2 13.46±0.2 ø0.5±0.05 TYP. 11.4±0.2 11.1±0.2 1.0±0.2 TYP. 12.7±0.2 4.7±0.2 4.83±0.2 4.88±0.2
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QC49/U
QC49/S
QC49/SMD
QC49/S
QC49/U
30ppm
50ppm
7345MHz
3.2768MHz crystal
14.7456MHz crystal smd
7.9872mhz
crystal 11.0592mhz
10.245MHz crystal
CRYSTAL 92.16MHZ
crystal 18.432mhz
5.120MHZ
QC49/QC49/SMD
3728MHZ
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2N5250
Abstract: 2N5251 mug 14 431 NIL-S-19500 2N4865 2N5151 FSC5961 2N5250 JAN Xelerated SAA 1006
Text: I I I IWE-FQUND I HIL-s-19500/380B 4 June 1991 SVPSl!5EDItK MIL-s-19500/180A( SLl 17 Septerber 1968 N2L2TARY SPECIP3CATICN SSN203N3WXUR DSV2CE, TWSISIWR,NPN,S2LIIXN,m TYPES 2N4865,2N5250,2N5251,JAIWX, JAN2’XV, ~ JANS MS s~ification is approvedfor w hy e21 Ceptusxts and lq~cies of the Deprt.uentof Defense.
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HIL-s-19500/380B
MIL-s-19500/180A(
SSN203N3WXUR
TYPESN4865,
N5250,
N5251,
NIL-S-19500.
F3-114)
Force-17
koject5961-1222]
2N5250
2N5251
mug 14 431
NIL-S-19500
2N4865
2N5151
FSC5961
2N5250 JAN
Xelerated
SAA 1006
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bridge rectifier SSC
Abstract: No abstract text available
Text: <z?\ roaucti, Una. TELEPHONE: 973 376-2922 (212)227-6005 FAX: (973) 376-8960 20 STERN AVE. SPRINGFIELD, NEW JERSEY 07081 U.S.A. MDA2500 series RECTIFIER ASSEMBLY . . . u t i l i z i n g individual vo'd free molded r e c t i f i e r s , interconnected and mounted on an viectricaily uolaied aluniinum heat sink hy
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MDA2500
JL121JJ
bridge rectifier SSC
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500 mh inductor
Abstract: 62212 62352 HY 400 hy 750 64134 107D 202E 62132 MH200
Text: Ultra-miniature HIGH "Q" Inductors Specifications: z z z z z z z z z z z Inductance Tolerance ± 4% at 0.1V-100KHZ Inductance Stability vs. Temperature ± 2% -55ºC to 105ºC Weight: 2 Grams Thermal Shock 100 Cycles, method 107D MIL-STD 202E Test Condition A3
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V-100KHZ
MIL-PRF-27,
500 mh inductor
62212
62352
HY 400
hy 750
64134
107D
202E
62132
MH200
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6887
Abstract: No abstract text available
Text: Ultraminiature HIGH "Q" Inductors Specifications: Inductance Tolerance ± 4% at 0.1V100KHZ Inductance Stability vs. Temperature ± 2% 55ºC to 105ºC Weight: 2 Grams Thermal Shock 100 Cycles, method 107D MILSTD 202E Test Condition A3
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100KHZ
6887
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kmz10a1
Abstract: SOT195 KMZ10 MLC716 SC17
Text: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D329 KMZ10A1 Magnetic field sensor Product specification Supersedes data of 1996 Nov 14 File under Discrete Semiconductors, SC17 1998 Apr 06 Philips Semiconductors Product specification Magnetic field sensor
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M3D329
KMZ10A1
KMZ10A1
SCA59
115106/00/03/pp12
SOT195
KMZ10
MLC716
SC17
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land pattern for sot109-1
Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products
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DO-35
DO-41
DO-34
OD80C
OD123F
HXSON12)
OT983
land pattern for sot109-1
TSSOP-8 footprint and soldering sot-23
SOD87 footprint
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HYM594000M70
Abstract: HYM594000M HYM594000 HYM594000M-70 Hyundai HYM594000M
Text: HY U ND A I SEMICONDUCTOR HYM594000 Series 4M x 9-bit CMOS DRAM MODULE DESCRIPTION The HYM594000 Is a 4M x 9-bit Fast page mode CMOS DRAM module consisting of nine HY514100 In 20/26 pin SOJ on a 30 pin glass-epoxy printed circuit board. 0 .2 2 fi? decoupling capacitor is mounted for each DRAM.
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HYM594000
HY514100
HYM594000M
1BC02-20-MAY93
1BC02-20-MAYM
HYM594000M70
HYM594000M-70
Hyundai HYM594000M
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Untitled
Abstract: No abstract text available
Text: -HY UND AI HYM532200A M-Series 2M X 32-bit CMOS DRAM MODULE DESCRIPTION The HYM532200A is a 2M x 32-bit Fast page mode CMOS DRAM module consisting of sixteen HY514400A in 20/26 pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.22^F decoupling capacitor is mounted fo r each DRAM.
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HYM532200A
32-bit
HY514400A
HYM532200AM/ALM
HYM532200AMGVALMG
DQ0-DQ31)
1CD03-01-FEB94
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Untitled
Abstract: No abstract text available
Text: H Y U N D A I • HY M 5 V 72 A 1604 F-Series Unbuffered 16Mx72 bit C M O S DRAM MODULE based on 8Mx8 DRAM, EDO, ECC, 4K/8K-Refresh DESCRIPTION The H Y M 5 V 7 2 A 1 6 0 4 is a 16M x 72-bit E D O mode C M O S D R A M module consisting of eighteen 8M x8 S O J
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OCR Scan
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PDF
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16Mx72
72-bit
2048-bit
5V72A1604FG
5V72A1604TFG
5V72A1634FG
5V72A1634TFG
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Untitled
Abstract: No abstract text available
Text: “63000" SERIES PICO’s miniature A P P R O X . S E LF HIGH “ Q ” INDUCTORS • • • • • N U M BER ± 2% inductance stability vs temperature Smallest possible size Extreme resistance to thermal shock Manufactured to MIL-PRF-27 Grade 5, Class S
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MIL-PRF-27,
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ac inductor 14 mH 1.05 a
Abstract: TF5R20ZZ 500 mh inductor 107D MIL-T-27 hy600 MH38 66298 inductor 220 mh inductor 73 mh
Text: PICO*s miniature HIGH “Q” INDUCTORS • ± 1% inductance stability vs temperature • Smallest possible size • Extreme resistance to thermal shock • Manufactured to Mil-T-27 TF5R20ZZ • All units are magnetically shielded «63000” SERIES PART
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Mil-T-27
TF5R20ZZ)
714n3G
ac inductor 14 mH 1.05 a
TF5R20ZZ
500 mh inductor
107D
MIL-T-27
hy600
MH38
66298
inductor 220 mh
inductor 73 mh
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