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    HITACHI MOLD COMPOUND Search Results

    HITACHI MOLD COMPOUND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-USBAA00000-002 Amphenol Cables on Demand Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m Datasheet
    CS-USBAB00000-001 Amphenol Cables on Demand Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m Datasheet
    CS-USBAB00000-002 Amphenol Cables on Demand Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m Datasheet
    CS-USBAA00000-003 Amphenol Cables on Demand Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m Datasheet
    CS-USBAA00000-005 Amphenol Cables on Demand Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m Datasheet

    HITACHI MOLD COMPOUND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    hitachi mold cel

    Abstract: 9200 hitachi CEL9200 cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H
    Text: Cypress Semiconductor Qualification Report QTP# 97383 VERSION 1.0 January, 1998 32 Ld SOJ Package - Hitachi CEL9200 Mold Compound Omedata, Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: 32 Ld SOJ - Hitachi CEL 9200 Mold Compound


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    PDF CEL9200 CEL9200 8361H CY7C109-VC 85C/85 CY7C107-VC hitachi mold cel 9200 hitachi cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H

    CEL8240HF10LX

    Abstract: cel8240 TP2G CEL8240HF10 D17I D19G D18P Nitto
    Text: PRODUCT CHANGE NOTICE PCN Form D4-E000-73 PCN#10-016 NOTIFICATION DATE: August 11, 2010 MODEL(S) AFFECTED: D19G+, TP2G+, D18P+, D17I+ EXTENT OF CHANGE: Change of mold compound used from Nitto NP8000C to Hitachi CEL8240HF10LX EFFECT OF CHANGE: No change in fit, form or function


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    PDF D4-E000-73) NP8000C CEL8240HF10LX PCN10-016 M87093 CEL8240HF10LX cel8240 TP2G CEL8240HF10 D17I D19G D18P Nitto

    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


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    PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100

    Hysol

    Abstract: MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL MG52F SN74ACT16543
    Text: TEXAS INSTRUMENTS Qualification Notification for Hysol MG52F Mold Compound for DL SSOP Packages January 10, 1997 Abstract Texas Instruments is qualifying a new mold compound for the 28, 48, and 56 pin TSSOP DL packages. This new compound will be used in addition to the previously qualified compounds adding


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    PDF MG52F MG52F this116/0 Hysol MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL SN74ACT16543

    cel 9200

    Abstract: hitachi mold cel CY7C199-VC cda 199 Hitachi CEL 9200 9200 hitachi 8361H JESD22
    Text: Cypress Semiconductor Package Qualification Report QTP# 000405 VERSION 1.1 July, 2000 SOJ 28 Leads Hitachi Cel 9200 Molding Compound Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069


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    PDF 85C/85 CY7C199-VC cel 9200 hitachi mold cel CY7C199-VC cda 199 Hitachi CEL 9200 9200 hitachi 8361H JESD22

    F741583

    Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
    Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001


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    PDF EN-4085S2K3 96mils L3/260C UL94-V0 TMS471R1F138 85C/85 3/260C F741583 sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV

    CEL-9240

    Abstract: CEL9240HF10 EN4900F sumitomo crm en4900 CEL9240HF10AKG 1076DS ase qfn EN-4900 KMC288P
    Text: July 23, 2009 CN-072309 Customer Notification M02067L-09-T Package Change Dear Valued Customer: This notification is for the purpose of informing you of a package change from the 4mm BCC package to the 4mm QFN package. Purpose ASE has informed us that the mold compound used for the non-RoHS BCC packages has been discontinued.


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    PDF CN-072309 M02067L-09-T 900ppm, 1500ppm. CEL-9240 CEL9240HF10 EN4900F sumitomo crm en4900 CEL9240HF10AKG 1076DS ase qfn EN-4900 KMC288P

    9200

    Abstract: cel 9200 hitachi mold cel 8361H JESD22 cel hitachi CEL-9200
    Text: Cypress Semiconductor Qualification Report QTP# 97174 VERSION 1.0 June, 1997 Hitachi CEL 9200/9200U Molding Compound Cypress Semiconductor Hitachi CEL 9200/9200U Moding Compound Device: CY7C1009/CY7C199 Package: SOJ/TSOP QTP# 97174, V. 1.0 Page 2 of 7 Jun, 1997


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    PDF 9200/9200U CY7C1009/CY7C199 28-pins 8361H JESD22-A112 85C/85 CY7C1009-VC 9200 cel 9200 hitachi mold cel 8361H JESD22 cel hitachi CEL-9200

    sumitomo

    Abstract: en4065 SUMITOMO eme 5274A 50C24 hitachi trace code hitachi assembly date code Sumitomo 1000 SN74FB1650 SN74FB1651
    Text: TEXAS INSTRUMENTS Final Notification of Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site February 5, 1997 Abstract Texas Instruments Standard Linear and Logic SLL is adding Hiji as a qualified assembly site for


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    en4065

    Abstract: EN-4065 SUMITOMO eme Sumitomo 1000 SN74FB1650 SN74FB1651 TNETA1611 TEXAS INSTRUMENTS, Mold Compound sumitomo hitachi en 4065
    Text: TEXAS INSTRUMENTS Notification for the Planned Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site Initial Notification of Planned Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site


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    sumitomo crm

    Abstract: CRM-501 SUMITOMO CDC2582 CDC2586 CDC582 CDC586 SN74ABT32316 SN74ABT32318 CEL-X-9000
    Text: TEXAS INSTRUMENTS Notification of the Planned Qualification for Certain ASL TQFP Packages at the Hiji, Japan Assembly Site January 19, 1996 Abstract Texas Instruments Advanced System Logic ASL is consolidating the manufacture of certain TQFP packaged devices. The affected devices, currently being built in TI’s Philippines and Sherman, Texas


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    84-3MV

    Abstract: twl3025 PTWL3025BZGM TWL3025BZGM TWL3025BZGMR identification trace code texas A07s texas instruments lot trace code t3025bggm twl3025bzqwr
    Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20050304000 New Wafer Fab for IOTA A07s Final Change Notification Dear Customer: This is a final announcement of change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages.


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    PDF T3025BGGM T3025BGQW 84-3MV twl3025 PTWL3025BZGM TWL3025BZGM TWL3025BZGMR identification trace code texas A07s texas instruments lot trace code t3025bggm twl3025bzqwr

    CEL-9000

    Abstract: hitachi mold cel cel hitachi A112 TEXAS INSTRUMENTS, Mold Compound EN-4065 SQFP208 en4065
    Text: TEXAS INSTRUMENTS Notification of the Manufacture of 208 Pin PPM Package at the Sherman Assembly/Test Facility September 11, 1996 Abstract Texas Instruments Advanced System Logic Products ASL has qualified the Sherman Assembly/Test Facility to manufacture the 208 pin PPM package. This qualification will allow for


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    PDF PCI1050PPM CEL-9000 hitachi mold cel cel hitachi A112 TEXAS INSTRUMENTS, Mold Compound EN-4065 SQFP208 en4065

    hitachi mold cel

    Abstract: texas instruments assembly year A112 CEL-9000
    Text: TEXAS INSTRUMENTS Notification for the Manufacture of 208 PinPDV Package at the Sherman Assembly/Test Facility September 18, 1996 Abstract Texas Instruments Advanced System Logic Products ASL has qualified the Sherman Assembly/Test Facility to manufacture 208 pin PDV package. This qualification will allow for improved


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    SN74ACT16245DL

    Abstract: act16245 texas cmos SN74ACT16245D EN-4088Z SN74HC00N SN74HC42D TEXAS INSTRUMENTS, Mold Compound TS-095 cmos testing abstract
    Text: TEXAS INSTRUMENTS Notification of Wafer Thickness Reduction from 15 and 13 Mils to 11 Mils December 5, 1996 Abstract Texas Instruments Advanced System Logic is reducing wafer thickness from 15 and 13 mils to 11 mils for all CMOS and BiCMOS technologies in all Wafer Fabrication Sites producing these


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    PDF HC00N ACT16245DL ABT245ADB SN74ACT16245DL act16245 texas cmos SN74ACT16245D EN-4088Z SN74HC00N SN74HC42D TEXAS INSTRUMENTS, Mold Compound TS-095 cmos testing abstract

    TMS57002DPHA

    Abstract: TMS57002 identification trace code texas 50C40 F312993PAG TMS57002DPH F312185PJM tms57002d hitachi assembly date code F312993
    Text: Texas Instruments Incorporated Transfer the Assembly Production for the TMS57002DPHA Device from HIJI to TIPI and the Transfer the Wafer Fab Source from MIHO5 to HFAB SAMPLE REQUEST / FINAL NOTIFICATION LETTER PCN# 20020411001 May 28, 2002 Dear Customer: The following notes apply to this correspondence:


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    PDF TMS57002DPHA TMS57002 identification trace code texas 50C40 F312993PAG TMS57002DPH F312185PJM tms57002d hitachi assembly date code F312993

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


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    PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG

    PCN0801

    Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera


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    PDF PCN0801 PCN0801; PCN0801 hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4

    TSSOP DGG

    Abstract: A112 KMC-166 SN74ABT16543DGG KMC166 hitachi 4088z
    Text: TEXAS INSTRUMENTS Informational Notification for the Manufacture of 56 Pin TSSOP Package DGG at the TI Malaysia Assembly/Test Facility August 17, 1995 Abstract Texas Instruments Advanced System Logic Products (ASL) has qualified the TI Malaysia Assembly/Test Facility to manufacture 56 pin TSSOP (DGG) packages. DGG packages are currently


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    AUS308

    Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal
    Text: March 21, 2007 CN 032107 Customer Notification CX2751x-12 Material Set Change Dear Valued Customer: This notification is for the CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. Mindspeed’s turnkey supplier has sent notification that all their BGA products will be manufactured using


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    PDF CX2751x-12 CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. CX2751x-12, CX2751xG-12, 2751x-PCN-001-A AUS308 PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal

    180-Degree Commutation Brushless DC Motor

    Abstract: 5kw inverter circuit diagram Sine wave PWM DC to AC Inverter ics ECN30107s brushless motor 10kW ECN30207 semiconductors cross index ETR-7021 semiconductors cross reference 300w inverter circuit diagram
    Text: IC-SP-06027 R0 Hitachi Single Chip Inverter IC Application Guide Applicable models VSP-input type 6-input type ECN30611 For @ AC115V ECN30102 ECN30105 ECN30107 For @ AC230V ECN30204 ECN30206 ECN30207 ECN30601 ECN30603 ECN30604 Development Department Power Device Division


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    PDF IC-SP-06027 ECN30611 AC115V ECN30102 ECN30105 ECN30107 AC230V ECN30204 ECN30206 ECN30207 180-Degree Commutation Brushless DC Motor 5kw inverter circuit diagram Sine wave PWM DC to AC Inverter ics ECN30107s brushless motor 10kW ECN30207 semiconductors cross index ETR-7021 semiconductors cross reference 300w inverter circuit diagram

    Sine wave PWM DC to AC Inverter ics

    Abstract: 180-Degree Commutation Brushless DC Motor ECN30207 IC-SP-06027 ECN30206SPR ECN30206 ECN30604 semiconductors cross reference semiconductors cross index 120-Degree
    Text: IC-SP-06027 R1 Hitachi Single Chip Inverter IC Application Guide Applicable models For ≅ AC115V For ≅ AC230V VSP-input type 6-input type ECN30105 ECN30611 ECN30107 ECN30204 ECN30601 ECN30206 ECN30603 ECN30207 ECN30604 Development Department Power Device Division


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    PDF IC-SP-06027 AC115V ECN30105 ECN30611 ECN30107 ECN30204 ECN30206 ECN30603 ECN30207 AC230V Sine wave PWM DC to AC Inverter ics 180-Degree Commutation Brushless DC Motor ECN30207 ECN30206SPR ECN30206 ECN30604 semiconductors cross reference semiconductors cross index 120-Degree

    8361H

    Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344
    Text: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


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    PDF ZS444N 44-lead 619919886Q CY7C199-ZC 30C/60 CY7C1021-ZSC CY62128-ZC 8361H EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344

    62256 hitachi

    Abstract: 28 pin plastic dip hitachi dimension hitachi PLC
    Text: Reliability of Hitachi 1C Memories 1. Structure The dies of IC memories are encapsulated in various packages. The most common packages are plastic and cerdip. Plastic packages are widely used in many different types of equipment. Cerdip packaging is especially suitable in equipment


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