Ultrasonic Cleaning Transducer
Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family
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gold metal detectors
Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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gold metal detectors
Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of
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CH03WIP
gold metal detectors
soft solder die bonding
schematic diagram intel atom
INCOMING RAW MATERIAL INSPECTION
lead side brazed hermetic
X-RAY INSPECTION
ausi die attach
electrical three phase schematic riser DIAGRAM
epoxy adhesive paste cte table
intel 24008
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solid solubility
Abstract: chemical control process block diagram
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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S2082
Abstract: Soldering guidelines pin in paste CR-14 gold embrittlement
Text: S2082 Surface Mounting Instructions CR-9, 11, 12, 13, 14 Ceramic 16 and 24 PIN Packages Board and Solder Footprint Guidelines Application Note Recommended Mounting Solder footprints Cont’d For optimal performance of surface mount switches and attenuators in ceramic packages, grounding is critical. The
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S2082
packag80
S2082
Soldering guidelines pin in paste
CR-14
gold embrittlement
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hmp solder 93.5pb
Abstract: Internal MLCC cracking result serious failure mode 93.5pb MLCC CRACK 95Pb desk fan hmp solder air filter planar AN-0011
Text: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com Solder Alloy choice for through hole
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62Sn/36Pb/2Ag
60Sn/40Pb
2002/95/EC
hmp solder 93.5pb
Internal MLCC cracking result serious failure mode
93.5pb
MLCC CRACK
95Pb
desk fan
hmp solder
air filter planar
AN-0011
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Internal MLCC cracking result serious failure mode
Abstract: hmp solder 93.5pb air filter planar MLCC CRACK 93.5pb
Text: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com Solder Alloy choice for through hole
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62Sn/36Pb/2Ag
60Sn/40Pb
2002/95/EC
Internal MLCC cracking result serious failure mode
hmp solder 93.5pb
air filter planar
MLCC CRACK
93.5pb
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Untitled
Abstract: No abstract text available
Text: Application Note M538 Surface Mounting Instructions Rev. V5 Footprint Guidelines Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
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J-STD-020
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30392
Abstract: IR 423f MGA-635T6 JEDEC SMT reflow profile
Text: MGA-635T6 UTSLP Package Application Note 5278 Introduction PCB Land Pattern and Stencil Design Avago Technologies's MGA-635T6 UTSLP 2x1.3x0.4 is an economical, easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die‑attach paddle acts as device grounding, heat
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MGA-635T6
MGA-635T6
J-STD-020C
AV01-0210EN
AV02-1697EN
30392
IR 423f
JEDEC SMT reflow profile
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Untitled
Abstract: No abstract text available
Text: Tel: 800 404-0204 www.ironwoodelectronics.com Gull Wing Surface mount Foot Soldering Instructions The gull wing style, surface mount foot (parts with a 'SF-' prefix and a '-G' suffix) is designed to solder to a quad flat pack (QFP) surface mount land pattern. The emulator
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Untitled
Abstract: No abstract text available
Text: Surface Mounting Instructions M538 V4 Footprint Guidelines Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the
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Untitled
Abstract: No abstract text available
Text: Surface Mounting Instructions M538 V3 Footprint Guidelines Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the
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amd (BGA) replacement alloy
Abstract: Sn-58Bi NOKIA CIRCUIT PCB SIEMENS WASHING machine TOSHIBA GLASS MOLD washing machine bosch circuit diagram visteon sony antimony
Text: Lead Pb -Free Packaging Strategy 2000− −2003 . . JUNE 2000 . . . . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same but have different
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CAPACITOR 2.2UF THROUGH HOLE
Abstract: d-class amplifier gaas Low Noise Amplifier power amplifier circuit diagram with pcb layout surface mounted fuse, moisture sensitivity level ACPM-7881 ACPM-7881-BLK ACPM-7881-TR1 J-STD-033 coal
Text: ACPM - 7881 W-CDMA Power Amplifer Data Sheet Description Features The ACPM-7881 is a high performance W-CDMA power amplifier module offered in a 4x4x1.1mm package. Designed around Avago Technologies’ GaAs Enhancement Mode pHEMT process, the ACPM-7881 offers premium
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ACPM-7881
5989-1894EN
CAPACITOR 2.2UF THROUGH HOLE
d-class amplifier
gaas Low Noise Amplifier
power amplifier circuit diagram with pcb layout
surface mounted fuse, moisture sensitivity level
ACPM-7881-BLK
ACPM-7881-TR1
J-STD-033
coal
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ACPM7881
Abstract: ACPM-7881 ACPM-7881-BLK ACPM-7881-TR1 J-STD-033
Text: Agilent ACPM-7881 W-CDMA Power Amplifier Data Sheet Features • Operating frequency: 1920 - 1980 MHz • 28.5 dBm Linear Output Power @ 3.5V Description The ACPM-7881 is a high performance W-CDMA power amplifier module offered in a 4x4x1.1mm package. Designed
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ACPM-7881
ACPM-7881
ACPM7881
5989-1894EN
ACPM-7881-BLK
ACPM-7881-TR1
J-STD-033
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avago trace code
Abstract: tds-cdma transceiver 7886 0319E
Text: ACPM-7886 TD-SCDMA Power Amplifier Data Sheet General Description Features The ACPM-7886 is an amplifier module designed for TD-SCDMA applications in the 2010-2025MHz band. Designed around Avago Technologies’ GaAs Enhancement Mode pHEMT process, the ACPM-7886 offers premium
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ACPM-7886
ACPM-7886
2010-2025MHz
quiescCPM-7886
UMTS2100
ACPM7886
AV01-0319EN
AV02-2217EN
avago trace code
tds-cdma transceiver
7886
0319E
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5082 schottky
Abstract: 5082-0087 HP 5082-0024 5082-2713 HP 2835 5082-0097 node B 3206 5082-0024
Text: DE § 4 4 4 7 5 0 4 QDQSñlS S | ~ 4447584 H E WL E T T - P A C K A R D » 58G CMPNTS 02815 D - T - Ö HEW LETT PACKARD SCHOTTKY BARRIER CHIPS FOR HYBRID INTEGRATED CIRCUITS 5082-0009 5082-0013 5082-0023 5082-0024 5082-0029 5082-0031 5082-0041 7 - 0 7 5082-0057
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MA47600
Abstract: No abstract text available
Text: Silicon PIN Diode Chips Features • GLASS OR SILICON DIOXIDE PASSIVATION 131 ■ HERMETICALLY SEALED CERMACHIP DESIGN ■ FAST SPEED, LOW LOSS MICROWAVE CHIPS ■ ATTENUATOR CHIPS ■ VOLTAGE RATINGS TO 2000 VOLTS ■ WIDE RANGE OF PIN CHARACTERISTICS
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MIL-STD-883,
MA4P504
MA4P606
MA47600
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MA47047
Abstract: 65X65 MVA attenuator MA4P150 MA4P151 MA4P152 MA4P153 MA4P154 MA4P155 MA4P156
Text: AtÜKO'1 M an A M P com pany PIN Diode Chips V 2.00 Features • • • • • • CERMACHIP glass or Silicon Dioxide Passivation Hermetically Sealed CERMACHIP Design Fast Speed, Low Loss Microwave Chips Attenuator Chips Voltage Ratings to 1500 Volts
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MIL-STD883,
MA47047
65X65
MVA attenuator
MA4P150
MA4P151
MA4P152
MA4P153
MA4P154
MA4P155
MA4P156
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MILITARY DIODES
Abstract: No abstract text available
Text: M t/X & A Silicon PIN Diode Chips Features • GLASS OR SILICON DIOXIDE PASSIVATION ■ HERMETICALLY SEALED CERMACHIP DESIGN ■ FAST SPEED, LOW LOSS MICROWAVE CHIPS ■ ATTENUATOR CHIPS ■ VOLTAGE RATINGS TO 2000 VOLTS ■ WIDE RANGE OF PIN CHARACTERISTICS
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assembli10-332-6789
MILITARY DIODES
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ultrasonic bond
Abstract: schematic WELDER Gunn Diode schematic WELDER capacitor M541 varactor beam lead thermal conductive teflon mesa similar
Text: Application Note M an A M P com pany Bonding and Handling Procedures for Chip Diode Devices M541 V 2.00 Discussion Microstrip Packages and Chip Carriers Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last
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schematic WELDER
Abstract: gold melting furnace ultrasonic bond
Text: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter natives in the selection of diodes and packaging with each
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OT-23
schematic WELDER
gold melting furnace
ultrasonic bond
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a4p50
Abstract: No abstract text available
Text: M/A-COM SEMICONDiBRLNGTON /y m 11 SL.42214 DDQlllfl G • M I C ‘ T ~ 6 T ~ * Silicon PIN Diode Chips Features ■ GLASS OR SILICON DIOXIDE PASSIVATION ■ HERMETICALLY SEALED CERMACHIP DESIGN ■ FAST SPEED, LOW LOSS MICROWAVE CHIPS ■ ATTENUATOR CHIPS
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5b42214
QDD112S
a4p50
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