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    JRH Electronics 806-012-NF9-5PBC

    Circular connector
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 806-012-NF9-5PBC 99 1
    • 1 $1380.06
    • 10 $1269.66
    • 100 $1214.4543
    • 1000 $1214.4543
    • 10000 $1214.4543
    		Buy Now

    JRH Electronics 806-020-NF9-5PBD

    Circular connector
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 806-020-NF9-5PBD 99 1
    • 1 $1232.12
    • 10 $1133.549
    • 100 $1084.2572
    • 1000 $1084.2572
    • 10000 $1084.2572
    		Buy Now

    JRH Electronics 806-012-MT9-5PBB

    Circular connector
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 806-012-MT9-5PBB 99 1
    • 1 $1508.77
    • 10 $1388.073
    • 100 $1327.7268
    • 1000 $1327.7268
    • 10000 $1327.7268
    		Buy Now

    JRH Electronics 806-020-MT9-5PBC

    Circular connector
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 806-020-MT9-5PBC 99 1
    • 1 $1361.03
    • 10 $1252.144
    • 100 $1197.7017
    • 1000 $1197.7017
    • 10000 $1197.7017
    		Buy Now

    JRH Electronics 806-039-NF22E29-5PB

    Circular connector
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 806-039-NF22E29-5PB 99 1
    • 1 $12215.12
    • 10 $11237.907
    • 100 $10749.301
    • 1000 $10749.301
    • 10000 $10749.301
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    Find more 95PB price and stock on Findchips.com

    95PB Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    C-SZU35

    Abstract: Sussex Semiconductor 9ge7 5KP10 5KP10A 5KP11 5KP11A 5KP12 5KP12A 5KP13A
    Text: 5000 WATT UNIPOLAR TRANSIENT SUPPRESSOR CELL SUSSEX SEMICONDUCTOR, INC. TM 12251 TOWNE LAKE DRIVE, FORT MYERS, FLORIDA, 33913 • TEL: 239 768-6800 • FAX: (239) 768-6868 GLASS PASSIVATED UNIPOLAR TRANSIENT SUPPRESSOR CELL 5000 WATT MAXIMUM POWER HANDLING


    Original     		PDF 015in 009in 95Pb/5Sn C-SZU35 Sussex Semiconductor 9ge7 5KP10 5KP10A 5KP11 5KP11A 5KP12 5KP12A 5KP13A

    hmp solder 93.5pb

    Abstract: Internal MLCC cracking result serious failure mode 93.5pb MLCC CRACK 95Pb desk fan hmp solder air filter planar AN-0011
    Text: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com Solder Alloy choice for through hole


    Original     		PDF 62Sn/36Pb/2Ag 60Sn/40Pb 2002/95/EC hmp solder 93.5pb Internal MLCC cracking result serious failure mode 93.5pb MLCC CRACK 95Pb desk fan hmp solder air filter planar AN-0011

    U8439-1

    Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1006-03 DATE: 23-Jul-2010 Product Affected: MEANS OF DISTINGUISHING CHANGED DEVICES: 35.0mm x 35.0mm x 3.42mm FCBGA-1156 (RoHS & Standard)


    Original     		PDF A1006-03 23-Jul-2010 FCBGA-1156 FCBGA-900 23-Oct-2010 89HPES16T16ZABL 89HPES16T16ZABR 89HPES22T16ZABL 89HPES22T16ZABLI U8439-1 AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772

    900E 1800

    Abstract: chotherm power IGBT MOSFET GTO SCR diode 95Sn5Sb SCR GTO die 28Cu72Ag igbt simulation dc to dc chopper by thyristor thyristor POWEREX powerex igbt
    Text: C U S T O M D E S I G N E D P O W E R M O D U L E S Solutions for High Power Applications C U S T O M D E S I G N E D ● High Power ● ● Solutions in ● Custom Module ● Design ● ● Powerex has addressed ● the need for application ● specific custom power


    Original     		PDF 135-5K-4/05 900E 1800 chotherm power IGBT MOSFET GTO SCR diode 95Sn5Sb SCR GTO die 28Cu72Ag igbt simulation dc to dc chopper by thyristor thyristor POWEREX powerex igbt

    12SnOFC

    Abstract: BQ37 PMC-90 PMC-90 leadframe material MKT-TO220B03 FDP3672 HRF3205 equivalent mosfet number Tamac4 a105 transistor HRF3205 equivalent
    Text: Date Created: 1/9/2004 Date Issued: 2/13/2004 PCN # 20040204 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will


    Original     		PDF HUF75343P3 HUF75542P3 HUF75631P3 HUF75645P3 HUF75939P3 HUF76107P3 HUF76132P3 HUF76143P3 HUF76419P3 HUF76432P3 12SnOFC BQ37 PMC-90 PMC-90 leadframe material MKT-TO220B03 FDP3672 HRF3205 equivalent mosfet number Tamac4 a105 transistor HRF3205 equivalent

    microsemi TVS

    Abstract: MicroNote
    Text: MicroNote Series 118 by Mel Clark and Kent Walters, Microsemi Scottsdale TVS/Chip Product Overview Microsemi’s offerings of TVS chip size products include: TVS/Chip Passivated TVS/Chip types of: a planar, b) mesa and c) bidirectional mesa are illustrated


    Original     		PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    duraseal

    Abstract: SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide
    Text: Performance and Reliability Characteristics of 1200 V, 100 A, 200oC Half-Bridge SiC MOSFET-JBS Diode Power Modules James D. Scofield and J. Neil Merrett Air Force Research Laboratory 1950 Fifth St WPAFB, OH 45433 937-255-5949 james.scofield@wpafb.af.mil James Richmond and


    Original     		PDF 200oC duraseal SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide

    KE DIODE ON

    Abstract: 1N6275A 1.5KE 15A diode 1.5 ke 200a KE 75 DIODE KE 16A DIODE KE 15A code diode KE KE 10A DIODE diode KE 1N6302A 1.5KE 180A
    Text: 600 AND 1500 WATT UNIPOLAR TRANSIENT SUPPRESSOR CELL SUSSEX TM SEMICONDUCTOR, INC. 12251 TOWNE LAKE DRIVE, FORT MYERS, FLORIDA, 33913 • TEL: 239 768-6800 • FAX: (239) 768-6868 GLASS PASSIVATED UNIPOLAR TRANSIENT SUPPRESSOR CELL 600 AND 1500 WATT MAXIMUM POWER HANDLING


    Original     		PDF 015in 009in 95Pb/5Sn KE DIODE ON 1N6275A 1.5KE 15A diode 1.5 ke 200a KE 75 DIODE KE 16A DIODE KE 15A code diode KE KE 10A DIODE diode KE 1N6302A 1.5KE 180A

    Technical Brochure

    Abstract: Catalytic capacitors coefficient of thermal expansion Kester sn62 tinning SN62 Ceramic Dielectric Axial Capacitors Glass Encapsulated CERAMICS CAPACITORS 0402 88Au novacap epoxy silver
    Text: NOVACAP TECHNICAL BROCHURE O. CHIP USER GUIDELINES Multilayer ceramic capacitors are sold as chip leadless components, or as encapsulated leaded devices. Traditionally, the chip version has been used in densely packed hybrid and delay line circuits, while the


    Original     		PDF

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    12SnOFC

    Abstract: PMC-90 PMC-90 leadframe material 92.5Pb5Sn2.5Ag Tamac4 MKT-TO263A02 pmc90 PMC-90 to-263 RF1S640SM9A FDB2532
    Text: Date Created: 12/30/2003 Date Issued: 1/15/2004 PCN # 20040002 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will


    Original     		PDF fairchildF76143S3S HUF76145S3S HUF76419S3ST HUF76432S3S HUF76439S3S HUF76445S3ST HUF76639S3S HUF76645S3ST ISL9N303AS3 ISL9N306AS3ST 12SnOFC PMC-90 PMC-90 leadframe material 92.5Pb5Sn2.5Ag Tamac4 MKT-TO263A02 pmc90 PMC-90 to-263 RF1S640SM9A FDB2532

    DIODE 1N649

    Abstract: SZUFD16 1.5ke series SZU16 Sussex Semiconductor 1N4172A 1N4973 SFD16 S100 p4k 20a
    Text: TM SUSSEX SEMICONDUCTOR, INC. DIES AND CELLS SECTION 7 SUSSEX TABLE OF CONTENTS SEMICONDUCTOR, INC. TM 12251 TOWNE LAKE DRIVE, FORT MYERS, FLORIDA, 33913 • TEL: 941 768-6800 • FAX: (941) 768-6868 TABLE OF CONTENTS DEVICE TYPE PAGE NUMBER 1. TRANSIENT SUPPRESSOR DIES


    Original     		PDF SZU35 SZZ35 SZUFD16 SZZD16 015in 009in 95Pb/5Sn DIODE 1N649 SZUFD16 1.5ke series SZU16 Sussex Semiconductor 1N4172A 1N4973 SFD16 S100 p4k 20a

    1N6275A 1.5KE 15A

    Abstract: 1.5KE 20A 1N6278A AK 061 KE code code KE code KE diode KE 170A KE 75 DIODE KE DIODE ON P6KE51A
    Text: TM SUSSEX SEMICONDUCTOR, INC. TRANSIENT SUPPRESSOR CELLS 7 7 600 AND 1500 WATT UNIPOLAR TRANSIENT SUPPRESSOR CELL SUSSEX TM SEMICONDUCTOR, INC. 12251 TOWNE LAKE DRIVE, FORT MYERS, FLORIDA, 33913 • TEL: 239 768-6800 • FAX: (239) 768-6868 GLASS PASSIVATED UNIPOLAR TRANSIENT SUPPRESSOR CELL


    Original     		PDF 015in 009in 95Pb/5Sn 1N6275A 1.5KE 15A 1.5KE 20A 1N6278A AK 061 KE code code KE code KE diode KE 170A KE 75 DIODE KE DIODE ON P6KE51A

    Thin Film Resistors SiCr

    Abstract: SiCr thin film TI SAC305 hfss 80Au-20Sn 3 to 10 GHz bandpass filter sac305 thermal conductivity 184394 ansoft SAC305 reflow bga
    Text: AT C / / A V X T H I N F I L M TECHNOLOGIES Engineered Thin Film Solutions TA B L E O F C O N T E N T S Introduction to ATC // AVX Thin Film Technologies .1 - 2


    Original     		PDF

    90Pb10Sn

    Abstract: FODB10X 5SN3 AN-3011 FODB100 95Pb-5 62Sn36Pb2Ag 95Pb5Sn
    Text: www.fairchildsemi.com Application Note AN-3011 Surface Mounting Technology Assembly Guidelines for Fairchild’s Microcouplers Ball Grid Array Optocoupler technology, consisting of a light source and a photosensitive detector surrounded by a transparent light


    Original     		PDF AN-3011 FODB100 AN3006009 90Pb10Sn FODB10X 5SN3 AN-3011 95Pb-5 62Sn36Pb2Ag 95Pb5Sn

    COAXIAL CABLE 5D-2V

    Abstract: 1.5D-HQEW 5D-2V pin shroud rows 1.5D-HQEV 5c-2V COAXIAL CABLE 5c-2V 2 pin male connector 2mm pitch
    Text: 2mm Hard Metric Connector PCN21 Series IEC 61076-4-101-compliant •Features 1. Variety of styles IEC Styles: A 110 contacts, 5 row , B (125 contacts, 5 row), C (55 contacts, 5 row ), D (176 contacts, 8 row), E (200 contacts, 8 row) and M (5 row + 3 coaxial or power


    Original     		PDF PCN21 61076-4-101-compliant -55PM-2PF PO51M-LJ-1 COAXIAL CABLE 5D-2V 1.5D-HQEW 5D-2V pin shroud rows 1.5D-HQEV 5c-2V COAXIAL CABLE 5c-2V 2 pin male connector 2mm pitch

    underfill

    Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate
    Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package


    Original     		PDF 12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate

    Technical Brochure

    Abstract: 470 micro farad aluminum electrolytic capacitor EIA-469-C disc Piezoelectric crystal 1mhz ultrasonic CAPACITOR 330 electrolytic MICRO FARAD 25 VOLT Kester sn62 tinning 1000 micro farad 16v electrolytic capacitor dielectric absorption mechanism EIA-469 1000 micro farad aluminum electrolytic capacitor
    Text: NOVACAP TECHNICAL BROCHURE Table of Contents A. INTRODUCTION . 2 B. CAPACITOR APPLICATIONS . 3


    Original     		PDF

    95Pb

    Abstract: FCCSP amkor RDL
    Text: data sheet W A F E R L E V E L PAC K AG I N G CSPnl Features: Wafer Level Packaging CSPnl™ Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP Chip Scale Package products. Through the


    Original     		PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    24 pin 2 row female pcb header

    Abstract: No abstract text available
    Text: 2mm Hard Metric Connector_ PCN21 Series jlEC 61076-4-101-compliant • F eatu res 1. IEC compliant This 2 mm Hard M etric HM C onnector com plies with IEC 6 1 0 76 -4 -1 0 1. As sp e cifie d by IEC S tan da rd s, 3 types are available: Style A (110 contacts), Style B (125


    OCR Scan     		PDF PCN21 61076-4-101-compliant 55SC-2PF-G PCN21-P-CK PCN21-S-CK 24 pin 2 row female pcb header