FR4 epoxy dielectric constant 4.4
Abstract: FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003
Text: HF Transmission Introduction This document deals with HF Transmission issues in high-speed and broadband applications using Atmel ADCs and DACs. It stresses the hardware choices to be made to reach an optimum tradeoff between high-speed, broadband performances and system
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352A-BDC-10/03
FR4 epoxy dielectric constant 4.4
FR4 substrate with dielectric constant 4.4
PCB Rogers RO4003 substrate
FR4 substrate epoxy dielectric constant 4.4
FR4 substrate epoxy dielectric constant 4.6
ro4003
FR4 dielectric constant 4.3
FR4 4.9 dielectric constant
FR4 dielectric constant 4.6
RO3003
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DOD-A-82720
Abstract: FR4 epoxy dielectric constant 4.2 DP-190 DP-100 Plus DP270 DP460 DP-420 3M DP100
Text: 0362220 Epoxy-Hotmelt 3/30/04 11:29 AM Page 1 High-performance adhesives for demanding electronics applications. With the ever-increasing sophistication of electronics, you need the most dependable and versatile methods for their fabrication and assembly. 3M Scotch-Weld epoxies and Jet-melt
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DP-100
DP-125
DP-190
DP-270
DP-420
DP-460
DOD-A-82720
FR4 epoxy dielectric constant 4.2
DP-100 Plus
DP270
DP460
3M DP100
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ICS1562A
Abstract: ICS1572 1572AN1 FR4 epoxy dielectric constant 4.6
Text: Integrated Circuit Systems, Inc. ICS1572 Document Type: Application Note Document Stage: Release Output Considerations for the ICS1572 1 Introduction The output considerations discussed in this application note apply to both the ICS1562A and the ICS1572. This application note includes a formula for calculating the trace width w that is needed to achieve the
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ICS1572
ICS1562A
ICS1572.
ICS1572
15-inch
1572AN1
FR4 epoxy dielectric constant 4.6
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Nelco 4000-13
Abstract: MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406 Rogers 4350B stackup 4000-13EP FR4 Prepreg
Text: PCB Stackup Design Considerations for Altera FPGAs AN-613-1.0 Application Note This application note presents an overview of the PCB stackup construction and material selection criteria. It discusses the important material parameters that influence the electrical
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AN-613-1
Mil-Std-275E)
Nelco 4000-13
MEGTRON 6
370HR
isola 370HR
Nelco 4000-13 si
Isola FR406
Rogers 4350B
stackup
4000-13EP
FR4 Prepreg
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fbga Substrate design guidelines
Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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R1401
Abstract: THN5601B
Text: THN5601B Semiconductor SiGe NPN Transistor □ Applications Unit in mm SOT-223 o VHF and UHF band medium power amplifier 6.5 3.0 4 □ Features 3.5 7.0 o 4.8 V operation o P1dB = 28 dBm at f = 900 MHz 1 o GP = 8.5 dB at f = 900 MHz 2 3 2.3 0.7 4.6 Pin Configuration
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THN5601B
OT-223
THN5601
R1401
THN5601B
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R1401
Abstract: FR4 dielectric constant 4.6 THN5601B 1695 GP 1 JS 0746 gp 738
Text: THN5601B Semiconductor SiGe NPN Transistor □ Applications Unit in mm SOT-223 o VHF and UHF band medium power amplifier 6.5 3.0 4 □ Features 3.5 7.0 o 4.8 V operation o P1dB = 28 dBm at f = 900 MHz 1 o GP = 8.5 dB at f = 900 MHz 2 3 2.3 0.7 4.6 Pin Configuration
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THN5601B
OT-223
THN5601
R1401
FR4 dielectric constant 4.6
THN5601B
1695 GP 1
JS 0746
gp 738
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FR4 epoxy dielectric constant 4.4
Abstract: HP16500C MC100EL16 RO4003 TS8308500 TSEV8308500G HP8665 HP8663 BGA72
Text: DESCRIPTION The TSEV8308500G Evaluation Board EB is a prototype board which has been designed in order to facilitate the evaluation and the characterization of the TS8308500 device (in CBGA72) up to its 1.3 GHz full power bandwidth at up to 500 Msps in the extended temperature range.
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TSEV8308500G
TS8308500
CBGA72)
TSEV8308500G
FR4 epoxy dielectric constant 4.4
HP16500C
MC100EL16
RO4003
HP8665
HP8663
BGA72
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FR4 epoxy dielectric constant 4.4
Abstract: FR4 epoxy dielectric constant 4.2 FR4 substrate epoxy dielectric constant 4.6 DIODE K9 FR4 dielectric constant 4.6 ro4003 datasheet MC100EL16 RO4003 TS8388BG TSEV8388BG
Text: DESCRIPTION The TSEV8388BG Evaluation Board EB is a prototype board which has been designed in order to facilitate the evaluation and the characterization of the TS8388BG device (in CBGA72) up to its 1.8 GHz full power bandwidth at up to 1 Gsps in the extended temperature range.
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TSEV8388BG
TS8388BG
CBGA72)
FR4 epoxy dielectric constant 4.4
FR4 epoxy dielectric constant 4.2
FR4 substrate epoxy dielectric constant 4.6
DIODE K9
FR4 dielectric constant 4.6
ro4003 datasheet
MC100EL16
RO4003
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FR4 substrate epoxy dielectric constant 4.4
Abstract: FR4 epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 MC100EL16 RO4003 TS8308500 TS8308500GL TSX8308500GL meander line PCB
Text: ADC 8-bit 500 Msps TSEV8308500 Evaluation Board . User Guide Table of Contents Section 1 Overview . 1-1
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TSEV8308500
TSEV8308500
2165C
FR4 substrate epoxy dielectric constant 4.4
FR4 epoxy dielectric constant 4.4
FR4 substrate epoxy dielectric constant 4.6
MC100EL16
RO4003
TS8308500
TS8308500GL
TSX8308500GL
meander line PCB
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MEGTRON 6
Abstract: AN-672
Text: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission 2013.02.15 AN-672 Subscribe Feedback As transceiver data rates increase and the unit interval time UI decrease, the end-to-end link design of a transceiver channel becomes increasingly critical to the overall performance of the link. Consider an Altera
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AN-672
100-Gpbs
CEI-25G-LR
CEI-28G-VSR.
CEI-28G-VSR
MEGTRON 6
AN-672
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FR4 epoxy dielectric constant 4.4
Abstract: FR4 epoxy dielectric constant 4.2 FR4 epoxy pcb double sided CQFP68 HP16500C MC100EL16 RO4003 TS8388BF TSEV8388BF TSEV8388BFS
Text: DESCRIPTION The TSEV8388BF Evaluation Board EB is a prototype board which has been designed in order to facilitate the evaluation and the characterization of the TS8388BF device (in CQFP68) up to its 1.5 GHz full power bandwidth at up to 1 Gsps in the military temperature range.
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TSEV8388BF
TS8388BF
CQFP68)
TSEV8388BF
FR4 epoxy dielectric constant 4.4
FR4 epoxy dielectric constant 4.2
FR4 epoxy pcb double sided
CQFP68
HP16500C
MC100EL16
RO4003
TSEV8388BFS
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FR1206
Abstract: FR1206JR YAGEO RC1206 cd 4611 FR0603 resistor 240 RESISTOR FOOTPRINT 1206 YAGEO CHIP RESISTORS MARKING RC0603 YNSC056 FR4 epoxy dielectric constant 4.2
Text: DATA SHEET FUSIBLE CHIP RESISTORS FR series Pb Free 5% Product specification – Sep 26, 2005 V.0 sizes 0603/1206 2 Product specification Chip Resistor Surface Mount FR SERIES 11 0603/1206 (Pb Free) SCOPE This specification describes FR0603/1206 fusible chip resistors with leadfree terminations made by thick film process.
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FR0603/1206
FR1206
FR1206JR
YAGEO RC1206
cd 4611
FR0603
resistor 240
RESISTOR FOOTPRINT 1206
YAGEO CHIP RESISTORS MARKING RC0603
YNSC056
FR4 epoxy dielectric constant 4.2
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TR8M1
Abstract: No abstract text available
Text: TR8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN Low ESR, Leadframeless Molded FEATURES • Lead Pb -free face-down terminations • Mounting: Surface mount • 8 mm tape and reel packaging available per EIA-481 and reeling per IEC 60286-3
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EIA-481
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
TR8M1
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loctite 3616
Abstract: No abstract text available
Text: Technical Data Sheet LOCTITE 3616 LOCTITE 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics,
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M10/PK
650LMS
loctite 3616
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Untitled
Abstract: No abstract text available
Text: Micro Guide www.vishay.com Vishay Sprague Guide for Leadframeless Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary
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FR4 epoxy dielectric constant 4.4
Abstract: Beta Transformer Technology RO4003 HP8665 HP lvds connector 40 pin to 30 pin to 7 pin isolated four voltages out power supply schematic CQFP68 HP16500C MC100EL16 TS8388BF
Text: DESCRIPTION The TSEV8388BFS Evaluation Board EB is a prototype board which has been designed in order to facilitate the evaluation and the characterization of the TS8388BF device (in CQFP68) up to its 1.5 GHz full power bandwidth at up to 1 Gsps in the military temperature range.
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TSEV8388BFS
TS8388BF
CQFP68)
TSEV8388BFS
FR4 epoxy dielectric constant 4.4
Beta Transformer Technology
RO4003
HP8665
HP lvds connector 40 pin to 30 pin to 7 pin
isolated four voltages out power supply schematic
CQFP68
HP16500C
MC100EL16
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50/50/A302 w9
Abstract: TL8A0
Text: TL8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors, MICROTAN , High CV Leadframeless Molded Low Profile FEATURES • Ultra-low profile: 0.8 mm to 1.0 mm in a variety of case sizes • Highest capacitance-voltage product in industry • Lead Pb -free L-shaped terminations for
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2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
50/50/A302 w9
TL8A0
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TM8r
Abstract: No abstract text available
Text: TM8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN High Reliability, Low DCL, Leadframeless Molded FEATURES • High reliability solid surface mount tantalum capacitors Available • Low DCL for extended battery life • Small sizes for space constrained applications
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
TM8r
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TL8A0
Abstract: No abstract text available
Text: TL8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors, MICROTAN , High CV Leadframeless Molded Low Profile FEATURES • Ultra-low profile: 0.8 mm to 1.0 mm in a variety of case sizes • Highest capacitance-voltage product in industry • Lead Pb -free L-shaped terminations for
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2002/95/EC.
2002/95/EC
2011/65/EU.
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02-Oct-12
TL8A0
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YAGEO RC0603
Abstract: FR4 epoxy dielectric constant 4.2 marking code fu RESISTOR FOOTPRINT 1206 232275062001 FRC01 marking code mp MIL-R-55342D MP 1008 es tu marking
Text: DATA SHEET FUSIBLE CHIP RESISTORS FR series Pb Free 5% Product specification – Sep 26, 2005 V.0 sizes 0603/1206 Product specification Chip Resistor Surface Mount FR SERIES SCOPE 2 11 0603/1206 (Pb Free) APPLICATIONS Power supply in small equipment This specification describes FR0603/1206 fusible chip resistors with leadfree terminations made by thick film process.
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FR0603/1206
YAGEO RC0603
FR4 epoxy dielectric constant 4.2
marking code fu
RESISTOR FOOTPRINT 1206
232275062001
FRC01
marking code mp
MIL-R-55342D
MP 1008 es
tu marking
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Transistor B36
Abstract: No abstract text available
Text: Whnl h e w le t t mina P A C K A R D 4.8 V NPN Common Em itter Output Power Transistor for AMPS, ETACS Phones Technical Data AT-33225 Features • 4.8 Volt Operation • +31.0 dBm Pon : @ 900 MHz, Typ. • 70% Collector Efficiency @ 900 MHz, Typ. • 9 dB Power Gain @ 900 MHz,
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AT-33225
OT-223
AT-332
AT-33225
Transistor B36
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Untitled
Abstract: No abstract text available
Text: TM8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN High Reliability, Low DCL, Leadframeless Molded FEATURES • High reliability solid surface mount tantalum capacitors Available • Low DCL for extended battery life • Small sizes for space constrained applications
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2002/95/EC
2011/65/EU.
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02-Oct-12
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2222A
Abstract: No abstract text available
Text: Who1 PHAECWKLAERTDT mLKM 4.8 VNPN Common Emitter Medium Power Output Transistor Ifechnical Data AT-31625 Features • 4.8 V olt O peration • +28.0 dBm P, U @ 900 MHz, Typ* MSOP-3 Surface Mount Plastic Package O utline 25 • 70% C ollector E fficiency @ 900 MHz, Typ.
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AT-31625
OT-223
AT-31625
1997H
5965-5911E
2222A
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