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    Untitled

    Abstract: No abstract text available
    Text: 0.650" 0.100" typ. 0.750" 1 3 0.421" 4 0.207" 0.050" typ. 0.472" 1 3 4 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;


    Original     		FR4/G10 finish10µ PC-PGA/PLCC32-01 PC-PGA/PLCC032-01 PDF

    DIP52

    Abstract: C1494
    Text: Top View 2.600" 1 2 3 0.900" Side View Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact


    Original     		FR4/G10 finish10µ C1494 PC-PLCC/DIP52-01 C1494 DIP52 PDF

    PA-QFE160SC-C-N-01

    Abstract: No abstract text available
    Text: 2.000" Socket holes 0.5 mm pitch 2.295" 0.100" pitch typ. 1 0.250" 3 0.128" 0.018"±0.002" typ. 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .


    Original     		FR4/G10 finish10µ 20X23 PA-QFE160SC-C-N-01 PDF

    c1869

    Abstract: sf 1020 ZIF pga 84
    Text: 2.400" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		FR4/G10 finish10µ SF-QFJ84SE-L-01 C1869 PC-PGA/QFP-1020-M-Z-T-02 c1869 sf 1020 ZIF pga 84 PDF

    SOIC-08

    Abstract: SOIC08 BOX21151
    Text: RoHS COMPLIANT 0.400" 1 0.400" 0.100" typ. 1 Adapter PCB - Substrate: 2.38mm ±0.18mm [0.094" ±0.007"] per IPC 4101/21, silver surface finish. 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;


    Original     		finish10µ PC-DIP/SOIC08-03F BOX21151 SOIC-08 SOIC08 PDF

    DIP14

    Abstract: DIP-14
    Text: 0.700" 0.200" 0.025" 0.088" 0.400" 0.125" 0.325" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)


    Original     		finish10µ FR4/G10 PC-SOIC/DIP14-01 PC-SOIC/DIP14-01W PC-SOR/DIP14-01 PC-SOIC/DIP14-01 DIP14 DIP-14 PDF

    SF-QFE100SC-L-01

    Abstract: No abstract text available
    Text: 3 0.100 typ. 1.400 Top View 1.400 0.321 3 1 0.421" Plugged 2 0.250 1 Side View 0.5mm pitch 0.600 0.550 Bottom View (emulator foot only) 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" gold over 50µ" nickel (min.).


    Original     		FR4/G10 finish10µ SF-QFE100SC-L-01. PC-PGA/QFP-80C186EC-L-03 SF-QFE100SC-L-01 PDF

    PLCC 32 TO DIP32 SOCKET pinout

    Abstract: shell
    Text: 0.700" PGA pin 1 RoHS COMPLIANT PLCC pin 1 1.600" 4 0.600" 0.554" 0.679" 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHs HASL plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .


    Original     		FR4/G10 finish10µ PC-PLCC/DIP32-01 PLCC 32 TO DIP32 SOCKET pinout shell PDF

    CA-QFE44SE-L-Z-T-01

    Abstract: SF-QFE44SE-L-01
    Text: 0.100 Typ. 2.000 Top View 2.500 3 1.2" assembled 1 2 See SF-QFE44SE-L-01 1 Side View 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)


    Original     		SF-QFE44SE-L-01 FR4/G10 finish10µ CA-QFE44SE-L-Z-T-01 SF-QFE44SE-L-01 PDF

    DIP08

    Abstract: DIP-08 DIP08-01
    Text: 0.400" 0.125" 0.025" 0.063" 0.400" 0.175" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHS plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard;


    Original     		finish10µ FR4/G10 PC-SOIC/DIP8-01 PC-SOIC/DIP8-01W PC-SOR/DIP08-01 PC-SOIC/DIP08-01 DIP08 DIP-08 DIP08-01 PDF

    DIP-16

    Abstract: DIP16
    Text: 0.800" 0.225" 0.025" 0.062" 0.500" 0.275" 0.475" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		finish10µ FR4/G10 PC-SOIC/DIP16-02 PC-SOIC/DIP16-02W PC-SOL/DIP16-02 PC-SOIC/DIP16-02 DIP-16 DIP16 PDF

    CA-SOJ40A-S-P-01

    Abstract: No abstract text available
    Text: 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 4 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		FR4/G10 finish10µ SOJ40A CA-SOJ40A-S-P-01 CA-SOJ40A-S-P-01 PDF

    PA-QFE128SD-P-S-01

    Abstract: QFE128SD
    Text: 1.400" 0.4mm pitch 0.670" 1.400" 0.550" Top View 1 0.250" 3 0.128" 2 0.100" typ. Side View 0.018" dia. typ. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .


    Original     		FR4/G10 finish10µ QFE128SD) 14x14 PA-QFE128SD-P-S-01 QFE128SD PDF

    SF-QFE128SA-L-01

    Abstract: No abstract text available
    Text: Pin 1 0.8mm pitch 1.190" 1.090" Sqr. Sqr. PAD DETAIL 32x.8mm=25.6mm dia.0.018"±0.001" 0.050" 0.018" 0.050" 2 0.008" rad. 0.250" 3 1 A 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .


    Original     		FR4/G10 finish10µ SF-QFE128SA-L-01 PDF

    dip16

    Abstract: DIP-16
    Text: 0.800" 0.225" 0.025" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		FR4/G10 finish10µ PC-SOIC/DIP16-03 PC-SOR/DIP16-01 PC-SOIC/DIP16-03 dip16 DIP-16 PDF

    Untitled

    Abstract: No abstract text available
    Text: RoHS COMPLIANT 15.2mm [0.600"] 17.8mm [0.700"] 1 2.54mm typ. Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] per IPC 4101/21, RoHS finish. 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard;


    Original     		finish10µ 846mm 508mm 937mm PC-DIP/SOIC28-08F SOIC28-08F PDF

    CA-QFE80RB-L-D-T-01

    Abstract: 08mm
    Text: Top View 1.800" 2.100" 2 Side View 1 1.100" 0.688" 3 0.8mm Pitch 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 0.870" 2 Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . 3 Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact


    Original     		FR4/G10 finish10µ CA-QFE80RB-L-D-T-01 CA-QFE080RB-L-D-T-01 08mm PDF

    PLCC-20

    Abstract: No abstract text available
    Text: 0.550" 0.550" 3 0.421" 4 0.386" 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . Contact material- BeCu; finish 10µ" Au over 100µ" Ni (min.) 4 Leads: material- BeCu Alloy 194; plating- 60/40 SnPb (150-400µ") Description: Package Converter (PC)


    Original     		finish10µ PC-PGA/PLCC20-02 PLCC-20 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1.000" 1.600" 1 0.900" 0.297" 0.173" 3 0.018" 0.600" 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		FR4/G10 finish10µ PC-DIP/DIP32-06 PDF

    Untitled

    Abstract: No abstract text available
    Text: 0.500" 1.200" 1 0.400" 0.297" PC-DIP/DIP24-05 0.173" 2 0.300" PC-DIP/DIP24-05W 0.200" 0.700" 0.4" Female-0.3" Male End Views 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;


    Original     		PC-DIP/DIP24-05 PC-DIP/DIP24-05W FR4/G10 finish10µ PC-DIP/DIP24-05 PDF

    DIP28

    Abstract: No abstract text available
    Text: 1.400" 0.375" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		finish10µ FR4/G10 PC-SOIC/DIP28-01 PC-SOIC/DIP28-01W PC-SOJ/DIP28-01 PC-SOIC/DIP28-01 DIP28 PDF

    DIP32 package

    Abstract: DIP32
    Text: 1.600" 0.425" 0.030" typ. 0.400" 0.175" 0.375" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		finish10µ FR4/G10 PC-SOIC/DIP32-03 PC-SOIC/DIP32-03W PC-SOJ/DIP32-03 PC-SOIC/DIP32-03 DIP32 package DIP32 PDF

    DIP40

    Abstract: DIP-40 pc 525
    Text: 2.000" 0.525" 0.025" 0.163" 0.700" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;


    Original     		finish10µ FR4/G10 PC-SOIC/DIP40-01 PC-SOIC/DIP40-01W PC-SOJ/DIP40-01 PC-SOIC/DIP40-01 DIP40 DIP-40 pc 525 PDF

    CA-SO20A-Z-M-T-01

    Abstract: No abstract text available
    Text: 1 Top View 0.895" 1.062" 0.295" 1.000" 0.406" 1.604" 5 0.649" 0.412" 3 0.229" 0.200" Side View End View 1 3 5 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;


    Original     		FR4/G10 finish10µ CA-SO20A-Z-M-T-01 PDF