Untitled
Abstract: No abstract text available
Text: 0.650" 0.100" typ. 0.750" 1 3 0.421" 4 0.207" 0.050" typ. 0.472" 1 3 4 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;
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PC-PGA/PLCC32-01
PC-PGA/PLCC032-01
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DIP52
Abstract: C1494
Text: Top View 2.600" 1 2 3 0.900" Side View Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact
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C1494
PC-PLCC/DIP52-01
C1494
DIP52
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PA-QFE160SC-C-N-01
Abstract: No abstract text available
Text: 2.000" Socket holes 0.5 mm pitch 2.295" 0.100" pitch typ. 1 0.250" 3 0.128" 0.018"±0.002" typ. 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .
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FR4/G10
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20X23
PA-QFE160SC-C-N-01
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c1869
Abstract: sf 1020 ZIF pga 84
Text: 2.400" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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SF-QFJ84SE-L-01
C1869
PC-PGA/QFP-1020-M-Z-T-02
c1869
sf 1020
ZIF pga 84
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SOIC-08
Abstract: SOIC08 BOX21151
Text: RoHS COMPLIANT 0.400" 1 0.400" 0.100" typ. 1 Adapter PCB - Substrate: 2.38mm ±0.18mm [0.094" ±0.007"] per IPC 4101/21, silver surface finish. 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;
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PC-DIP/SOIC08-03F
BOX21151
SOIC-08
SOIC08
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DIP14
Abstract: DIP-14
Text: 0.700" 0.200" 0.025" 0.088" 0.400" 0.125" 0.325" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)
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FR4/G10
PC-SOIC/DIP14-01
PC-SOIC/DIP14-01W
PC-SOR/DIP14-01
PC-SOIC/DIP14-01
DIP14
DIP-14
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SF-QFE100SC-L-01
Abstract: No abstract text available
Text: 3 0.100 typ. 1.400 Top View 1.400 0.321 3 1 0.421" Plugged 2 0.250 1 Side View 0.5mm pitch 0.600 0.550 Bottom View (emulator foot only) 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" gold over 50µ" nickel (min.).
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SF-QFE100SC-L-01.
PC-PGA/QFP-80C186EC-L-03
SF-QFE100SC-L-01
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PLCC 32 TO DIP32 SOCKET pinout
Abstract: shell
Text: 0.700" PGA pin 1 RoHS COMPLIANT PLCC pin 1 1.600" 4 0.600" 0.554" 0.679" 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHs HASL plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .
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PC-PLCC/DIP32-01
PLCC 32 TO DIP32 SOCKET pinout
shell
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CA-QFE44SE-L-Z-T-01
Abstract: SF-QFE44SE-L-01
Text: 0.100 Typ. 2.000 Top View 2.500 3 1.2" assembled 1 2 See SF-QFE44SE-L-01 1 Side View 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)
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FR4/G10
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CA-QFE44SE-L-Z-T-01
SF-QFE44SE-L-01
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DIP08
Abstract: DIP-08 DIP08-01
Text: 0.400" 0.125" 0.025" 0.063" 0.400" 0.175" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHS plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard;
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FR4/G10
PC-SOIC/DIP8-01
PC-SOIC/DIP8-01W
PC-SOR/DIP08-01
PC-SOIC/DIP08-01
DIP08
DIP-08
DIP08-01
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DIP-16
Abstract: DIP16
Text: 0.800" 0.225" 0.025" 0.062" 0.500" 0.275" 0.475" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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FR4/G10
PC-SOIC/DIP16-02
PC-SOIC/DIP16-02W
PC-SOL/DIP16-02
PC-SOIC/DIP16-02
DIP-16
DIP16
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CA-SOJ40A-S-P-01
Abstract: No abstract text available
Text: 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 4 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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SOJ40A
CA-SOJ40A-S-P-01
CA-SOJ40A-S-P-01
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PA-QFE128SD-P-S-01
Abstract: QFE128SD
Text: 1.400" 0.4mm pitch 0.670" 1.400" 0.550" Top View 1 0.250" 3 0.128" 2 0.100" typ. Side View 0.018" dia. typ. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .
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QFE128SD)
14x14
PA-QFE128SD-P-S-01
QFE128SD
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SF-QFE128SA-L-01
Abstract: No abstract text available
Text: Pin 1 0.8mm pitch 1.190" 1.090" Sqr. Sqr. PAD DETAIL 32x.8mm=25.6mm dia.0.018"±0.001" 0.050" 0.018" 0.050" 2 0.008" rad. 0.250" 3 1 A 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .
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SF-QFE128SA-L-01
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dip16
Abstract: DIP-16
Text: 0.800" 0.225" 0.025" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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PC-SOIC/DIP16-03
PC-SOR/DIP16-01
PC-SOIC/DIP16-03
dip16
DIP-16
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Untitled
Abstract: No abstract text available
Text: RoHS COMPLIANT 15.2mm [0.600"] 17.8mm [0.700"] 1 2.54mm typ. Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] per IPC 4101/21, RoHS finish. 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard;
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846mm
508mm
937mm
PC-DIP/SOIC28-08F
SOIC28-08F
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CA-QFE80RB-L-D-T-01
Abstract: 08mm
Text: Top View 1.800" 2.100" 2 Side View 1 1.100" 0.688" 3 0.8mm Pitch 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 0.870" 2 Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . 3 Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact
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CA-QFE80RB-L-D-T-01
CA-QFE080RB-L-D-T-01
08mm
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PLCC-20
Abstract: No abstract text available
Text: 0.550" 0.550" 3 0.421" 4 0.386" 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . Contact material- BeCu; finish 10µ" Au over 100µ" Ni (min.) 4 Leads: material- BeCu Alloy 194; plating- 60/40 SnPb (150-400µ") Description: Package Converter (PC)
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PC-PGA/PLCC20-02
PLCC-20
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Untitled
Abstract: No abstract text available
Text: 1.000" 1.600" 1 0.900" 0.297" 0.173" 3 0.018" 0.600" 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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PC-DIP/DIP32-06
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Untitled
Abstract: No abstract text available
Text: 0.500" 1.200" 1 0.400" 0.297" PC-DIP/DIP24-05 0.173" 2 0.300" PC-DIP/DIP24-05W 0.200" 0.700" 0.4" Female-0.3" Male End Views 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;
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PC-DIP/DIP24-05
PC-DIP/DIP24-05W
FR4/G10
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PC-DIP/DIP24-05
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DIP28
Abstract: No abstract text available
Text: 1.400" 0.375" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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PC-SOIC/DIP28-01
PC-SOIC/DIP28-01W
PC-SOJ/DIP28-01
PC-SOIC/DIP28-01
DIP28
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DIP32 package
Abstract: DIP32
Text: 1.600" 0.425" 0.030" typ. 0.400" 0.175" 0.375" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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FR4/G10
PC-SOIC/DIP32-03
PC-SOIC/DIP32-03W
PC-SOJ/DIP32-03
PC-SOIC/DIP32-03
DIP32 package
DIP32
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DIP40
Abstract: DIP-40 pc 525
Text: 2.000" 0.525" 0.025" 0.163" 0.700" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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FR4/G10
PC-SOIC/DIP40-01
PC-SOIC/DIP40-01W
PC-SOJ/DIP40-01
PC-SOIC/DIP40-01
DIP40
DIP-40
pc 525
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CA-SO20A-Z-M-T-01
Abstract: No abstract text available
Text: 1 Top View 0.895" 1.062" 0.295" 1.000" 0.406" 1.604" 5 0.649" 0.412" 3 0.229" 0.200" Side View End View 1 3 5 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;
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CA-SO20A-Z-M-T-01
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