1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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K9HDG08U1A
Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks
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BR-11-ALL-001
K9HDG08U1A
K9LCG08U0A
k4g10325fe-hc04
KLM2G1DEHE-B101
K9WAG08U1B-PIB0
k9gag08u0e
Ltn140at
SAMSUNG HD502HJ
hd204ui
klm2g1dehe
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RISC-Processor s3c2410
Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH
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BR-04-ALL-005
BR-04-ALL-004
RISC-Processor s3c2410
MR16R1624DF0-CM8
arm9 samsung s3c2440 architecture
chip 3351 dvd
sp0411n
K9W8G08U1M
sandisk micro SD Card 2GB
arm9 s3c2440
K9F1G08U0A
K6X8008C2B
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taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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IC 50061
Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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DS90CF365
Abstract: DS90C385MTD DS90CF365MTD DS90C385 DS90C385SLCX
Text: DS90C385/DS90C365 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link-85 MHz, +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link-85 MHz General Description The DS90C385 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.
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DS90C385/DS90C365
24-Bit
Link-85
18-Bit
DS90CF365
DS90C385MTD
DS90CF365MTD
DS90C385
DS90C385SLCX
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OF4337
Abstract: 90CR288A 90CR288 DS101087-6 90CR287 DS90CR287MTD
Text: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.
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DS90CR287/DS90CR288A
28-Bit
Link-85
DS90CR287
DS90CR288A
DS90CR288ASLC
5-Dec-2000]
OF4337
90CR288A
90CR288
DS101087-6
90CR287
DS90CR287MTD
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NATIONAL RX F2
Abstract: No abstract text available
Text: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data
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DS90C383/DS90CF384
24-Bit-Color
24-Bit
DS90C383
DS90CF384
DS90CF384SLC
DS90CF384SLCX
AN-1085:
NATIONAL RX F2
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Untitled
Abstract: No abstract text available
Text: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data
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DS90C383/DS90CF384
24-Bit-Color
24-Bit
DS90C383
DS90CF384
AN-1085:
11-Sep-2000]
24-Jun-99
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IC51-128
Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials
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G 3352 K
Abstract: S71PL127JB0BAW9U S71PL127JB0BAW9Z S71PL127JB0BFW9U S71PL127JB0BFW9Z S71PL129JB0BAW9Z A19T a19to
Text: S71PL127/129JB0 Stacked Multi-Chip Package MCP Flash Memory and pSRAM 128 Megabit (8M x 16-Bit) CMOS 3.0 Volt-only Simultaneous Operation Flash Memory and 32 Megabit (2M x 16-Bit) CMOS Pseudo Static RAM with Page Mode ADVANCE Distinctive Characteristics
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S71PL127/129JB0
16-Bit)
64-Ball
S71PL127/129JB0
G 3352 K
S71PL127JB0BAW9U
S71PL127JB0BAW9Z
S71PL127JB0BFW9U
S71PL127JB0BFW9Z
S71PL129JB0BAW9Z
A19T
a19to
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PT740 AB
Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher
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September/2000
PT740 AB
diode AE 84A
KS74
FP64E
hitachi FET
EDR-7316
Hitachi DSAUTAZ006
IC51-2084-1052
OTS-48
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Untitled
Abstract: No abstract text available
Text: SCAN921025 and SCAN921226 30-80 MHz 10 Bit Bus LVDS Serializer and Deserializer with IEEE 1149.1 JTAG and at-speed BIST General Description The SCAN921025 transforms a 10-bit wide parallel LVCMOS/LVTTL data bus into a single high speed Bus LVDS serial data stream with embedded clock. The
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SCAN921025/SCAN921226
SCAN921025
SCAN921226
10-bit
49-lead
AN-1217:
30-May-02
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PT740 AB
Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher
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March/2001
standard-856-8650
PT740 AB
PM351
transistor 9726 126
EDR-7313
ED-7402
texas instruments data guide manual
Hitachi DSAUTAZ006
DO-35 land pattern
Silicon Point Contact Mixer Diodes
ED-7311
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Untitled
Abstract: No abstract text available
Text: S29AL008D 8 Megabit 1 M x 8-Bit/512 K x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Data Sheet PRELIMINARY Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of
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S29AL008D
8-Bit/512
16-Bit)
S29AL008D
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Abstract: No abstract text available
Text: S29AL008D 8 Megabit 1 M x 8-Bit/512 K x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion LLC deems the
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S29AL008D
8-Bit/512
16-Bit)
s29al008d
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Untitled
Abstract: No abstract text available
Text: This document has not been approved. Sharing this document with non-Spansion employees violates QS9000/TS16949 requirements. S29AL008D 8 Megabit 1 M x 8-Bit/512 K x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Data Sheet DATASHEET Distinctive Characteristics
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QS9000/TS16949
S29AL008D
8-Bit/512
16-Bit)
200nm
230nm
Am29LV160
S29AL008D
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PT740 AB
Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher
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ADE-410-001J
March/2002
PT740 AB
095G
Unitechno
rfpak
fuji semiconductors manual
652B0082211-002
BP-108
EDR7315
QP4-064050-002-A
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Untitled
Abstract: No abstract text available
Text: S29AL008D 8 Megabit 1 M x 8-Bit/512 K x 16-Bit CMOS 3.0 Volt-only Boot Sector Flash Memory Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion LLC deems the
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S29AL008D
8-Bit/512
16-Bit)
s29al008d
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