Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    FBGA 320 Search Results

    FBGA 320 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy

    FBGA 320 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: DDR400 SDRAM 512Mb B-die FBGA x4, x8, x16 DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60Ball FBGA Revision 1.2 November, 2004 Revision 1.2 November, 2004 DDR400 SDRAM 512Mb B-die FBGA (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (September, 2003)


    Original     		PDF DDR400 512Mb 60Ball

    K4H510438B-ZC

    Abstract: No abstract text available
    Text: DDR400 SDRAM 512Mb B-die FBGA x4, x8, x16 DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant) Revision 1.1 March, 2004 Revision 1.1 March, 2004 DDR400 SDRAM 512Mb B-die FBGA (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History


    Original     		PDF DDR400 512Mb 200MHz K4H510438B-ZC

    IEC60730

    Abstract: CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM
    Text: ARM9 Microcontroller TMPA900CMXBG Memory Features ADC 10-bit Ch. 16-bit Timer RTC / WDT 32 FBGA 289 √ √ H/D 2 3 2 1 8 6 √ 91 1.7~3.6 TMPA901CMXBG 2 ARM926EJ-S 200* - 32 FBGA 177 √ √ H/D 1 2 1 1 4 6 √ 43 1.7~3.6 ARM926EJ-S 200* - 56 FBGA 361 √


    Original     		PDF TMPA900CMXBG 10-bit 16-bit TMPA901CMXBG ARM926EJ-S TMPA911CRAXBG TMPA912CMAXBG IEC60730 CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM

    Signetics

    Abstract: 19X19 19X19MM
    Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This


    Original     		PDF 19x19MM 168hr, 192hr, C/-55 C/100% 15PSIG, 168hrs Signetics 19X19 19X19MM

    MTFC4G

    Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
    Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)


    Original     		PDF MTFC16GKQDI, MTFC32GKQDH 153-ball 169-ball 41-compliant 84-A441) 09005aef838eabba j534q567r MTFC4G MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI

    m312l

    Abstract: No abstract text available
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM


    Original     		PDF 512MB, DDR400 60FBGA) 184pin 512Mb 125mil/1 200mil m312l

    Untitled

    Abstract: No abstract text available
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 184pin Registered Module based on 512Mb B-die x4, x8 with 1,125mil/1,200mil Height 60 FBGA with Pb-Free (RoHS compliant) Revision 1.2 Nov. 2004 Revision 1.2 November. 2004


    Original     		PDF 512MB, DDR400 184pin 512Mb 125mil/1 200mil

    M312L2920BG0-CCC

    Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM


    Original     		PDF 512MB, DDR400 60FBGA) 184pin 512Mb 125mil/1 200mil M312L2920BG0-CCC M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 M312L2923BG0-CCC

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications Features • Density: 2G bits • Organization — 8M words × 32 bits × 8 banks • Data rate: 800Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm


    Original     		PDF 168-ball EDB2432BCPE 800Mbps M01E1007 E1881E20

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 128Mb HYMD512G726BF 157max

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 128Mb HYMD512G726CFP4N 157max

    hynix module suffix

    Abstract: DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 157max hynix module suffix DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431

    Untitled

    Abstract: No abstract text available
    Text: 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package – 121-ball FBGA 6.5mm x 8mm


    Original     		PDF 512Mb: MT42L32M16D1 09005aef8467caf2

    Untitled

    Abstract: No abstract text available
    Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz


    Original     		PDF STM32F205xx STM32F207xx 32-bit 150DMIPs, Flash/128

    EDB4432BAPA

    Abstract: No abstract text available
    Text: DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB4432BAPA Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm


    Original     		PDF 168-ball EDB4432BAPA 1066Mbps M01E1007 E1775E40 EDB4432BAPA

    NAND sample code for stm32f2xx

    Abstract: DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG
    Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ FBGA FBGA Core: ARM 32-bit Cortex -M3 CPU 120 MHz


    Original     		PDF STM32F205xx STM32F207xx 32-bit 150DMIPs, Flash/128 NAND sample code for stm32f2xx DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG

    hynix module suffix

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin DDR400 DDR333 HYMD525G726CFP4-D43/J hynix module suffix

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a


    Original     		PDF 184pin 256Mb 184-pin 128Mb HYMD212G726DF 157max

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin HYMD525G726CFP4-D43/J

    dual fet q51

    Abstract: DDR333 DDR400 DDR400B HYMD512G726CFP4N-D43 hynix module suffix dc-dc 8030
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin HYMD525G726CFP4-D43/J dual fet q51 DDR333 DDR400 DDR400B HYMD512G726CFP4N-D43 hynix module suffix dc-dc 8030

    sdram dimm layout hynix

    Abstract: 6050 DDR333 DDR400 DDR400B 256mb ddr333 200 pin hynix module suffix DM U23
    Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a


    Original     		PDF 184pin 256Mb 184-pin 157max sdram dimm layout hynix 6050 DDR333 DDR400 DDR400B 256mb ddr333 200 pin hynix module suffix DM U23

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4432BAPC Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm


    Original     		PDF 216-ball EDB4432BAPC 1066Mbps M01E1007 E1891E10

    Untitled

    Abstract: No abstract text available
    Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ ■ ■ ■ ■ ■ ■ ■ Core: ARM 32-bit Cortex -M3 CPU with


    Original     		PDF STM32F205xx STM32F207xx 32-bit 150DMIPs, Flash/128

    Untitled

    Abstract: No abstract text available
    Text: W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  42% I/O reduction vs FBGA


    Original     		PDF W3H32M64EA-XSBX