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Silicon Laboratories Inc EFM32LG290F256G-F-BGA112 ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	EFM32LG290F256G-F-BGA112		271			1 $10.89 10 $10.01 100 $8.46 1000 $6.9 10000 $6.9	Buy Now
Silicon Laboratories Inc EFM32LG890F256G-F-BGA112 ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	EFM32LG890F256G-F-BGA112					1 - 10 - 100 - 1000 $7.23 10000 $7.23	Get Quote
Silicon Laboratories Inc EFM32LG290F256G-F-BGA112R ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	EFM32LG290F256G-F-BGA112R					1 - 10 - 100 - 1000 $6.9 10000 $6.9	Get Quote
Gowin LFBGA(1717-1)256 Programmable Logic IC Development Tools*
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	LFBGA(17*17-1)256					1 - 10 - 100 $10.07 1000 $8.96 10000 $8.96	Get Quote
Silicon Laboratories Inc EFM32LG990F256G-F-BGA112 ARM Microcontrollers - MCU Leopard Gecko MCU IC 256KB
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	EFM32LG990F256G-F-BGA112					1 - 10 - 100 - 1000 $7.69 10000 $7.69	Get Quote

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FBGA 256 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
ep2c20 Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64 Text: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced	Original	100-Pin 144-Pin 208-Pin 240-Pin 256-Pin 324-Pin 400-Pin 484-Pin 672-Pin ep2c20 EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64	PDF
vr7pu Abstract: VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F Text: DDR3 72bit Unbuffered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module	Original	72bit 128MX72 128Mx8 vr7pu VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F	PDF
SODIMM DDR3 Mechanical Dimensions Abstract: VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin Text: DDR3 72bit Registered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module	Original	72bit 128MX72 128Mx8 SODIMM DDR3 Mechanical Dimensions VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin	PDF
daewon tray Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA	Original	AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga	PDF
H5GQ4H24MFR-R2C Abstract: H5GQ2H24AFR-R0C H5GC4H24MFR-T2C H5GQ1H24BFR-R0C H5GQ1H24BFR-T2C H5GC2H24BFR-T2C H5TQ2G63DFR-11c H5GQ2H24AFR-T2C H5TC4G63AFR-11C H5TQ2G63FFR Text: Page 1 DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.1GHz 0.9ns H5TQ4G63AFR-N1C FBGA(96ball) 8Bank, 1.5V/ 1.5V Now 1.0GHz (1.0ns) H5TC4G63AFR-N0C FBGA(96ball) 8Bank, 1.35V/ 1.35V Now FBGA(96ball) 8Bank, 1.5V/ 1.5V Now FBGA(96ball) 8Bank, 1.35V/ 1.35V	Original	H5TQ4G63AFR-N1C 96ball) H5TC4G63AFR-N0C 256Mx16 H5TC4G63AFR-11C 900MHz H5GQ4H24MFR-R2C H5GQ2H24AFR-R0C H5GC4H24MFR-T2C H5GQ1H24BFR-R0C H5GQ1H24BFR-T2C H5GC2H24BFR-T2C H5TQ2G63DFR-11c H5GQ2H24AFR-T2C H5TC4G63AFR-11C H5TQ2G63FFR	PDF
RTAX2000S Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256 Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing	Original	AC274 CQ352 FG484 23x23 FG896 CQ256 RTAX2000S RTAX2000 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256	PDF
AX2000-CQ256 Abstract: RTAX2000S-CQ352 Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing	Original	AC274 CQ352 FG484 23x23 FG896 CQ256 AX2000-CQ256 RTAX2000S-CQ352	PDF
PCN0515 Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently	Original	PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC	PDF
DDR2-400 Abstract: DDR2-533 DDR2-667 DDR2-800 JEDEC tray standard 13 Text: Jun.2010 DDR2 Code Information Component K4TXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory K 11. "─" 2. DRAM : 4 12. Package Z : FBGA (Lead-Free) J : FBGA DDP (Lead-Free) H : FBGA (Lead-Free & Halogen-Free) M : FBGA DDP (Lead-Free & Halogen-Free)	Original	256Mb 512Mb DDR2-400 DDR2-533 DDR2-667 DDR2-800 JEDEC tray standard 13	PDF
H9ccnnn Abstract: H9CKNNNB H5MS1G22AFRE3M H5MS2G22MFR-J3M H5MS2G62 H55S2622JFR-60M H9TKNNN2GDMP-LRNDM DDR333 H5MS2G62AFR-J3M H5MS1G22AFR-E3M Text: Page 1 DENSI TY ORG. SPEED PART NUMBER Package FEATURE Availability 2Gb 64M x 16 166MHz H55S2G62MFP-60M FBGA 54ball 4Bank, 1.8V/ 1.8V Now 133MHz H55S2G62MFP-75M FBGA(54ball) 4Bank, 1.8V/ 1.8V Now 166MHz H55S2G22MFP-60M FBGA(90ball) 4Bank, 1.8V/ 1.8V Now 133MHz	Original	166MHz H55S2G62MFP-60M 54ball) 133MHz H55S2G62MFP-75M H55S2G22MFP-60M 90ball) H9ccnnn H9CKNNNB H5MS1G22AFRE3M H5MS2G22MFR-J3M H5MS2G62 H55S2622JFR-60M H9TKNNN2GDMP-LRNDM DDR333 H5MS2G62AFR-J3M H5MS1G22AFR-E3M	PDF
MR0D08BMA35 Abstract: 128Kbx8 MR0A08B FBGA thermal resistance Text: Thermal Resistance – 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Applicable Products: 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Temperature Grade Commercial Industrial Operating Temperature Products Part Numbers 256Kb Density 1 32Kbx8 Single VDD	Original	256Kb 32Kbx8) 128Kbx8) MR0D08BMA35 128Kbx8 MR0A08B FBGA thermal resistance	PDF
MT41K256M32 Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16 Text: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA	Original	MT41K256M32 MT41K256M16 MT41K256M32. 136-ball DDR3L-1600) DDR3L-1333) DDR3L-1066) 09005aef84ad0652 MT41K256M32 MT41K256M3 8Gb DDR3 SDRAM twindie	PDF
package tsop1 Abstract: 16G nand AG01000 NCE 6G memory 4g onenand Text: One-NAND Code Information 1/2 Last Updated : August 2009 KFXXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 12. Package (AG01000 PKG SPEC Reference) A : FBGA (Lead-Free, Halogen-Free) B : FBGA (Lead-Free, Halogen-Free, OSP) D : FBGA (Lead-Free)	Original	AG01000 package tsop1 16G nand NCE 6G memory 4g onenand	PDF
Untitled Abstract: No abstract text available Text: PRN256M8V69AG8GKF-15E DDR3 SDRAM PRN256M8V69AG8GKF-15E PRN256M8 – 32 Meg x 8 x 8 Banks Options Marking Configuration -256MX8 256M8 Product Code -DDR3 Density 2Gb Vx 8x Voltage/ Refresh 1.5V/8K Refresh FBGA Package PB-free x8 78/117B 9x11.5MM FBGA Package (Leaded)	Original	PRN256M8V69AG8GKF-15E PRN256M8 -256MX8 256M8 78/117B 667MHz PRN256M8V69AG8GKF-15E	PDF

Untitled Abstract: No abstract text available Text: BCM2132 PRODUCT Brief EDGE/GPRS/GSM SINGLE-CHIP MULTIMEDIA BASEBAND PROCESSOR FEATURES SUMMARY OF BENEFITS • Comprehensive EDGE/GPRS/GSM system design • Single mixed-signal package options: • 256 pin FBGA @ 14 x 14 mm • 276 pin FBGA @ 12 x 12 mm	Original	BCM2132 GSM850, E-GSM900, GSM1800, GSM1900 ARM926EJ CCIR-656 2132-PB01-R	PDF
H5TQ2G63BFR-H9C Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR Text: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9	Original	256Mx4 H5TQ1G43BFR-H9C 78ball) H5TQ1G43TFR-H9C H5TQ1G43BFR-G7C H5TQ1G43TFR-G7C H5TQ1G83BFR-H9C H5TQ2G63BFR-H9C H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR	PDF
IEC60730 Abstract: CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM Text: ARM9 Microcontroller TMPA900CMXBG Memory Features ADC 10-bit Ch. 16-bit Timer RTC / WDT 32 FBGA 289 √ √ H/D 2 3 2 1 8 6 √ 91 1.7~3.6 TMPA901CMXBG 2 ARM926EJ-S 200* - 32 FBGA 177 √ √ H/D 1 2 1 1 4 6 √ 43 1.7~3.6 ARM926EJ-S 200* - 56 FBGA 361 √	Original	TMPA900CMXBG 10-bit 16-bit TMPA901CMXBG ARM926EJ-S TMPA911CRAXBG TMPA912CMAXBG IEC60730 CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM	PDF
H5TQ2G63FFR-RDC Abstract: H5TQ4G63MFRPBC H5TC8G83AMR-PBA HMT351U7EFR8C-PB H5TQ2G63DFR-PBC Text: Page 1 DDR3 SDRAM Solder- Dow n VDD DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.5V 2Gb 256Mx8 DDR3 1866 H5TQ2G83EFR-RDC FBGA 78ball 8Bank, 1.5V, CL13,13-13-13 Now DDR3 1600 H5TQ2G83CFR-PBC FBGA(78ball) 8Bank, 1.5V, CL11,11-11-11 Now H5TQ2G83EFR-PBC	Original	256Mx8 H5TQ2G83EFR-RDC 78ball) H5TQ2G83CFR-PBC H5TQ2G83EFR-PBC H5TQ2G83CFR-H9C H5TQ2G83EFR-H9C H5TQ2G63FFR-RDC H5TQ4G63MFRPBC H5TC8G83AMR-PBA HMT351U7EFR8C-PB H5TQ2G63DFR-PBC	PDF
Untitled Abstract: No abstract text available Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a	Original	DS550R	PDF
Untitled Abstract: No abstract text available Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a	Original	184pin 256Mb 184-pin 128Mb HYMD212G726DF 157max	PDF
sdram dimm layout hynix Abstract: 6050 DDR333 DDR400 DDR400B 256mb ddr333 200 pin hynix module suffix DM U23 Text: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a	Original	184pin 256Mb 184-pin 157max sdram dimm layout hynix 6050 DDR333 DDR400 DDR400B 256mb ddr333 200 pin hynix module suffix DM U23	PDF
MTFC4G Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)	Original	MTFC16GKQDI, MTFC32GKQDH 153-ball 169-ball 41-compliant 84-A441) 09005aef838eabba j534q567r MTFC4G MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI	PDF
dax6 Abstract: Mobile SDRAM Text: V55C1256164MG 256Mbit MOBILE SDRAM 1.8 VOLT, TSOP II / FBGA PACKAGE 16M X 16 75 9 10 System Frequency fCK 133 MHz 111 MHz 100MHz Clock Cycle Time (tCK3) 7.5ns 9.0 ns 10 ns Clock Access Time (tAC3) CAS Latency = 3 6.0 ns 7.0 ns 8.0ns • Available in 54-ball FBGA (with 9x6 ball array	Original	V55C1256164MG 256Mbit 100MHz dax6 Mobile SDRAM	PDF
m312l Abstract: No abstract text available Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM	Original	512MB, DDR400 60FBGA) 184pin 512Mb 125mil/1 200mil m312l	PDF

FBGA 256 Search Results

FBGA 256 Price and Stock

Silicon Laboratories Inc EFM32LG290F256G-F-BGA112

Silicon Laboratories Inc EFM32LG890F256G-F-BGA112

Silicon Laboratories Inc EFM32LG290F256G-F-BGA112R

Gowin LFBGA(17*17-1)256

Silicon Laboratories Inc EFM32LG990F256G-F-BGA112

FBGA 256 Datasheets Context Search

ep2c20

vr7pu

SODIMM DDR3 Mechanical Dimensions

daewon tray

H5GQ4H24MFR-R2C

RTAX2000S

AX2000-CQ256

PCN0515

DDR2-400

H9ccnnn

MR0D08BMA35

MT41K256M32

package tsop1

Untitled

Untitled

H5TQ2G63BFR-H9C

IEC60730

H5TQ2G63FFR-RDC

Untitled

Untitled

sdram dimm layout hynix

MTFC4G

dax6

m312l