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    FBGA 160 Search Results

    FBGA 160 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy

    FBGA 160 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    vr7pu

    Abstract: VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F
    Text: DDR3 72bit Unbuffered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module


    Original     		PDF 72bit 128MX72 128Mx8 vr7pu VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F

    SODIMM DDR3 Mechanical Dimensions

    Abstract: VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin
    Text: DDR3 72bit Registered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module


    Original     		PDF 72bit 128MX72 128Mx8 SODIMM DDR3 Mechanical Dimensions VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    160-FBGA-1212

    Abstract: 160FBGA-1
    Text: 160-FBGA-1212 SAMSUNG SEMICONDUCTOR, INC.


    Original     		PDF 160-FBGA-1212 160-FBGA-1212 160FBGA-1

    MT41K256M32

    Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16
    Text: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA


    Original     		PDF MT41K256M32 MT41K256M16 MT41K256M32. 136-ball DDR3L-1600) DDR3L-1333) DDR3L-1066) 09005aef84ad0652 MT41K256M32 MT41K256M3 8Gb DDR3 SDRAM twindie

    H5TQ2G63FFR-RDC

    Abstract: H5TQ4G63MFRPBC H5TC8G83AMR-PBA HMT351U7EFR8C-PB H5TQ2G63DFR-PBC
    Text: Page 1 DDR3 SDRAM Solder- Dow n VDD DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.5V 2Gb 256Mx8 DDR3 1866 H5TQ2G83EFR-RDC FBGA 78ball 8Bank, 1.5V, CL13,13-13-13 Now DDR3 1600 H5TQ2G83CFR-PBC FBGA(78ball) 8Bank, 1.5V, CL11,11-11-11 Now H5TQ2G83EFR-PBC


    Original     		PDF 256Mx8 H5TQ2G83EFR-RDC 78ball) H5TQ2G83CFR-PBC H5TQ2G83EFR-PBC H5TQ2G83CFR-H9C H5TQ2G83EFR-H9C H5TQ2G63FFR-RDC H5TQ4G63MFRPBC H5TC8G83AMR-PBA HMT351U7EFR8C-PB H5TQ2G63DFR-PBC

    FBGA 12x12 TRAY

    Abstract: nec 1230 JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x20=160 135°C MAX. 16.40 A' 12.30 114.8 FBGA12×12B 10.55 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.35) (6.29) 12.30 12.00 7.62 135.9 PPE A Applied Package 209-pin Plastic FBGA (12×12) Quantity (pcs) 160 MAX. FBGA 12×12B


    Original     		PDF FBGA12 209-pin SSD-A-H7722-1 FBGA 12x12 TRAY nec 1230 JEDEC TRAY DIMENSIONS FBGA

    FBGA 152

    Abstract: JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.95) (5.62) 7.62 13.00 Applied Package 144-pin Plastic FBGA (13×13) 160-pin Plastic FBGA (13×13)


    Original     		PDF FBGA13 13ESP 144-pin 160-pin 161-pin 180-pin 197-pin 212-pin 225-pin 249-pin FBGA 152 JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA

    JEDEC FBGA

    Abstract: fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray
    Text: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 12.30 7 135°C MAX. A' 12.30 15.50 10.25 294.5 315.0 322.6 Section A – A' (6.29) 12.30 12.00 (6.35) 7.62 16.40 FBGA12×12ESP-1 10.55 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 12×12 ESP-1 121-pin Plastic FBGA (12×12)


    Original     		PDF FBGA12 12ESP-1 121-pin 144-pin 160-pin 180-pin 204-pin 209-pin 337-pin 397-pin JEDEC FBGA fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray

    JEDEC FBGA

    Abstract: FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray
    Text: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 135.9 PPE 12.30 7 A' 135°C MAX. 16.40 10.55 FBGA12×12ESP-1 A 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.29) (6.35) 7.62 12.30 12.00 Applied Package Quantity (pcs) FBGA 12×12ESP-1 Tray 121-pin Plastic FBGA (12×12)


    Original     		PDF FBGA12 12ESP-1 121-pin 144-pin 160-pin 180-pin 209-pin 337-pin 397-pin JEDEC FBGA FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray

    FBGA

    Abstract: FBGA121 FBGA-12
    Text: HEAT PROOF 7 12.2 10.55 16.40 A' 8x20=160 A 135°C MAX. NEC PPE 114.8 FBGA12×12×1.26 15.50 10.25 12.2 294.5 315.0 322.6 SECTION A-A' 6.32 (6.35) 12.2 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 121-pin Plastic FBGA ( 12) MAX. 160 Material 148-pin Plastic FBGA ( 12)


    Original     		PDF FBGA12 121-pin 148-pin FBGA FBGA121 FBGA-12

    MTFC4G

    Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
    Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)


    Original     		PDF MTFC16GKQDI, MTFC32GKQDH 153-ball 169-ball 41-compliant 84-A441) 09005aef838eabba j534q567r MTFC4G MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI

    m312l

    Abstract: No abstract text available
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM


    Original     		PDF 512MB, DDR400 60FBGA) 184pin 512Mb 125mil/1 200mil m312l

    H5TQ2G63BFR-H9C

    Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR
    Text: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9


    Original     		PDF 256Mx4 H5TQ1G43BFR-H9C 78ball) H5TQ1G43TFR-H9C H5TQ1G43BFR-G7C H5TQ1G43TFR-G7C H5TQ1G83BFR-H9C H5TQ2G63BFR-H9C H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR

    M312L2920BG0-CCC

    Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
    Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM


    Original     		PDF 512MB, DDR400 60FBGA) 184pin 512Mb 125mil/1 200mil M312L2920BG0-CCC M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 M312L2923BG0-CCC

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications Features • Density: 2G bits • Organization — 8M words × 32 bits × 8 banks • Data rate: 800Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm


    Original     		PDF 168-ball EDB2432BCPE 800Mbps M01E1007 E1881E20

    MT41K256M32

    Abstract: MT41K 256M32 MT41K256M16 MT41K256M32SGB-125M MT41K256M3 MT41K256M MT41K256 MT41K256M16 SPD FBGA DDR3 x32
    Text: Preliminary‡ 8Gb: x32 TwinDie DDR3Lm SDRAM Description TwinDie 1.35V DDR3Lm SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (10mm x 14mm x 1.2mm) Rev. E


    Original     		PDF MT41K256M32 MT41K256M16 MT41K256M32. SAC305 09005aef84ab372c MT41K256M32 MT41K 256M32 MT41K256M32SGB-125M MT41K256M3 MT41K256M MT41K256 MT41K256M16 SPD FBGA DDR3 x32

    MT41K512M16

    Abstract: 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON
    Text: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)


    Original     		PDF MT41K512M16 MT41K256M16 MT41K512M16. 96-ballw 09005aef84ccb467 MT41K512M16 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 128Mb HYMD512G726BF 157max

    Untitled

    Abstract: No abstract text available
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 128Mb HYMD512G726CFP4N 157max

    hynix module suffix

    Abstract: DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431
    Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a


    Original     		PDF 184pin 512Mb 184-pin 157max hynix module suffix DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431

    Untitled

    Abstract: No abstract text available
    Text: 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package – 121-ball FBGA 6.5mm x 8mm


    Original     		PDF 512Mb: MT42L32M16D1 09005aef8467caf2

    Untitled

    Abstract: No abstract text available
    Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz


    Original     		PDF STM32F205xx STM32F207xx 32-bit 150DMIPs, Flash/128

    DDR266

    Abstract: DDR266B DDR333 DDR400 DDR400B HYMD512M646D
    Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb D ver. FBGA This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb D ver. DDR SDRAMs in 60 ball FBGA packages on a 200pin glass-epoxy substrate. This Hynix 512Mb D ver. based unbuffered


    Original     		PDF 200pin 512Mb 200-pin DDR400, DDR333 HYMD512M646D DDR266 DDR266B DDR400 DDR400B