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    EV Z 151 Search Results

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    EV Z 151 Price and Stock

    Renesas Electronics Corporation ISL15102AIRZ

    Buffers & Line Drivers ISL15102AIRZ Pb-Free Single Port PLC Differential Line Drive
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics ISL15102AIRZ 256
    • 1 $2.97
    • 10 $2.6
    • 100 $2.18
    • 1000 $1.86
    • 10000 $1.43
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    Analog Devices Inc ADM7151CP-02-EVALZ

    Power Management IC Development Tools Eval Board
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    Mouser Electronics ADM7151CP-02-EVALZ 9
    • 1 $59.42
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    Analog Devices Inc EV-ADF41510SD1Z

    RF Development Tools EVB for ADF41510 (External VCO)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EV-ADF41510SD1Z 8
    • 1 $500.97
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    Analog Devices Inc EV-ADF41510SD2Z

    RF Development Tools EVB for ADF41510 (On board VCO)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EV-ADF41510SD2Z 7
    • 1 $633.89
    • 10 $633.89
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    Analog Devices Inc EV-ADF41513SD3Z

    Clock & Timer Development Tools EB 26.5GHz PLL with ultra low FOM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EV-ADF41513SD3Z 5
    • 1 $529.78
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    EV Z 151 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    9668e

    Abstract: SR 13009 BY284 455e 2246 09 06 232 6843 9826e MAR 618 transistor MS1324 RX3 0633
    Text: Product Characterization Report for the SP3243 Family of Products Prepared By: Velvet Doung & Greg West Date: Aug 17, 2006 SP3243 Product Family Characterization Report Table of Contents Section Introduction Characterization Procedure Data Summary for Key Parameters


    Original     		PDF SP3243 SP3243 084E03 059E03 000E03 SP3243EBEA_ MS1324 9668e SR 13009 BY284 455e 2246 09 06 232 6843 9826e MAR 618 transistor MS1324 RX3 0633

    L-1513SRC-E

    Abstract: L-1513-SRC-E
    Text: T-1 3/4 5mm SOLID STATE LAMP L-1513SRC-E SUPER BRIGHT RED Features Description z IMPROVED z LOW The Super Bright Red source color devices are made with POWER CONSUMPTION. z VERSATILE z T-1 INTENSITY. MOUNTING ON P.C. BOARD OR PANEL. Gallium Aluminum Arsenide Red Light Emitting Diode.


    Original     		PDF L-1513SRC-E DSAA3387 AUG/24/2001 L-1513SRC-E L-1513-SRC-E

    w32 smd transistor

    Abstract: rtax250sl RTAX2000S w32 smd transistor 143 41-bit Carry Look-ahead Adder RTAX2000SL RTAX4000S BY415 RTAX4000D LG1152
    Text: Revision 14 RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Radiation Performance Specifications • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeVcm2/mg – SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)


    Original     		PDF TM1019 MIL-STD-883B w32 smd transistor rtax250sl RTAX2000S w32 smd transistor 143 41-bit Carry Look-ahead Adder RTAX2000SL RTAX4000S BY415 RTAX4000D LG1152

    RTAX2000D

    Abstract: LG1152 CDB 455 C34
    Text: Revision 14 RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Radiation Performance Specifications • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeVcm2/mg – SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)


    Original     		PDF TM1019 RTAX2000D LG1152 CDB 455 C34

    624 CCGA

    Abstract: CQ352 transistor prc 606 j rtax250 RTAX2000 rtax4000
    Text: Revision 14 RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Radiation Performance Specifications • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeVcm2/mg – SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)


    Original     		PDF TM1019 624 CCGA CQ352 transistor prc 606 j rtax250 RTAX2000 rtax4000

    RTAX2000

    Abstract: RTAX2000S RTAX1000SL rtax250 RTAX250SL RTAX4000SL RTAX1000 RTAX-S RTAX1000S-SL rtax250s
    Text: Rev ision 13 RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Radiation Performance Specifications • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeVcm2/mg – SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)


    Original     		PDF TM1019 MIL-STD-883B Extended600 RTAX2000 RTAX2000S RTAX1000SL rtax250 RTAX250SL RTAX4000SL RTAX1000 RTAX-S RTAX1000S-SL rtax250s

    RTAX250

    Abstract: RTAX4000DL RTAX4000D CG624 RTAX4000S LG1152 TRANSISTOR TB 772 SL RTAX2000S ACTEL CCGA 624 mechanical transistor prc 606 j
    Text: Revision 15 RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Radiation Performance Specifications • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeVcm2/mg – SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)


    Original     		PDF TM1019 RTAX250 RTAX4000DL RTAX4000D CG624 RTAX4000S LG1152 TRANSISTOR TB 772 SL RTAX2000S ACTEL CCGA 624 mechanical transistor prc 606 j

    Untitled

    Abstract: No abstract text available
    Text: Revision 16 RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Radiation Performance Specifications • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeVcm2/mg – SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)


    Original     		PDF TM1019 MIL-STD-883B

    smd transistor device marking p18

    Abstract: 25 smd fuse marking code 25NSG vq80 42mx16 CQ208 A42MX36 marking
    Text: Revision 11 40MX and 42MX FPGA Families Features HiRel Features High Capacity • Commercial, Industrial, Automotive, Temperature Plastic Packages • Commercial, Military Temperature, and MIL-STD-883 Ceramic Packages • Single-Chip ASIC Alternative • 3,000 to 54,000 System Gates


    Original     		PDF 35-Bit MIL-STD-883 smd transistor device marking p18 25 smd fuse marking code 25NSG vq80 42mx16 CQ208 A42MX36 marking

    Untitled

    Abstract: No abstract text available
    Text: Revision 12 40MX and 42MX FPGA Families Features HiRel Features High Capacity • Commercial, Industrial, Automotive, Temperature Plastic Packages • Commercial, Military Temperature, and MIL-STD-883 Ceramic Packages • Single-Chip ASIC Alternative • 3,000 to 54,000 System Gates


    Original     		PDF MIL-STD-883

    64x4-bit

    Abstract: transistor J17 SMD
    Text: Revision 10 40MX and 42MX FPGA Families Features HiRel Features High Capacity • Commercial, Industrial, Automotive, Temperature Plastic Packages • Commercial, Military Temperature, and MIL-STD-883 Ceramic Packages • Single-Chip ASIC Alternative • 3,000 to 54,000 System Gates


    Original     		PDF 35-Bit MIL-STD-883 64x4-bit transistor J17 SMD

    D 1413 transistor

    Abstract: SiGe POWER TRANSISTOR
    Text: I = = = = •= IBMSGRF0100 IBMSGRF0100 EV Advance SiGe High Dynamic Range Low Noise Transistor Features • Low Noise Figure: N Fm in « 0.8dB @ 2.0G H z • Low O perating Voltage • Input IIP3 C apability: * Package: SO T353 ~ + 10dBm @ 2.0G H z, V q q = 2V, lc =5m A


    OCR Scan     		PDF IBMSGRF0100 10dBm sgrf0100 D 1413 transistor SiGe POWER TRANSISTOR

    Untitled

    Abstract: No abstract text available
    Text: HB56A272E-5/6/7 2,097,152-wordx72-bit High Density Dynamic RAM Module HITACHI A D E -2 0 3 -7 4 3 A Z R ev. 1.0 F e b .2 0 ,1 9 9 7 Description The HB56A272E belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56A272E is a 2M


    OCR Scan     		PDF HB56A272E-5/6/7 152-wordx72-bit HB56A272E 16-Mbit HM5117800) 16-bit 74ABT16244) 168-pin

    IC 2073

    Abstract: D1590 D 2073 MO-211 k2225 k 2225
    Text: R E V REV SYMM 1 S 1 O N S D E SC R IP T IO N A RELEASE TO B DIM 0 .2 6 5 / 0 . 2 1 5 WAS 0 .2 3 5/ 0 . 2 05 ; DIM 0 .1 2 5/ 0 .0 5 0 WAS 0 .0 7 5 / 0 . 0 50 ; R EV I S E NOTE 2; ADD T 1463 & ' 1 ' 1488 TO X I AND ' V 1 945 & ' 1 ' 1970 TO X2 COLUMNS; CHANGE TO B S I Z E FORMAT.


    OCR Scan     		PDF BUMP2098 IC 2073 D1590 D 2073 MO-211 k2225 k 2225

    Untitled

    Abstract: No abstract text available
    Text: v* * -m am # if A V350EPC Rev. AO LOCAL BUS TO PCI BRIDGE FOR MULTIPLEXED A/D PROCESSORS T „v * '« IC O * 1Glueless ¡960Jx/Sx processors interface 1120 ready hardware messaging unit 1Large, 640-byte FIFOs using V3’s unique D y n a m ic B a n d w i d t h A l l o c a t i o n architecture


    OCR Scan     		PDF V350EPC 960Jx/Sx 640-byte 64-byte 2348G

    Untitled

    Abstract: No abstract text available
    Text: V961PBC Rev. B2 LOCAL BUS TO PCI BRIDGE FOR MUTLTELEXED A/D PROCESSORS • Glueless interface between Intel ¡960Jx, IBM PPC401Gx, processors and PCI bus • Fully compliant with PCI 2.1 specification • Configurable for primary master, bus master, or target operation


    OCR Scan     		PDF V961PBC 960Jx, PPC401Gx, 8/16-bit V961PBC 234SG

    STKK

    Abstract: tvp ul 137 AD12 AD14 V350EPC V350EPC-33 V350EPC-40 V960PBC V961PBC V96BMC
    Text: V‘ 5f V350EPC Rev. AO LOCAL BUS TO PCI BRIDGE FOR MULTIPLEXED A/D PROCESSORS &M|£ 0 * 1Glueless ¡960Jx/Sx processors interface l20 ready hardware messaging unit 1Large, 640-byte FIFOs using V3’s unique D y n a m ic B a n d w i d t h A l l o c a t i o n architecture


    OCR Scan     		PDF V350EPC 960Jx/Sx 640-byte 64-byte 32-bit 16-bit 960Jx 960Sx STKK tvp ul 137 AD12 AD14 V350EPC-33 V350EPC-40 V960PBC V961PBC V96BMC

    AMD2930

    Abstract: LDO, ld12
    Text: V360EPC Rev. AO LOCAL BUS TO PCI BRIDGE FOR DE-MULTIPLEXED A/D PROCESSORS Glueless interface to ¡960Cx/Hx and AMD29030/40 processors Configurable for primary master, bus master or target operation. On-the-fly byte order endian conversion l20 ATU and messaging unit including


    OCR Scan     		PDF V360EPC 960Cx/Hx AMD29030/40 640-byte 64-byte 8/16-bit 234SG AMD2930 LDO, ld12

    Untitled

    Abstract: No abstract text available
    Text: V962PBC S LOCAL BUS TO PCI BRIDGE FOR DE-MULTIPLEXED A/D PROCESSORS • Glueless interface between Intel ¡960 Cx/Hx processors and PCI bus • Fully compliant with PCI 2.1 specification • Configurable for primary master, bus master, or target operation


    OCR Scan     		PDF V962PBC 234SG

    Untitled

    Abstract: No abstract text available
    Text: V360EPC v -mam* * # if T Rev. AO LOCAL BUS TO PCI BRIDGE FOR DE-MULTIPLEXED A/D PROCESSORS A „v * ' « I C O * 1Glueless ¡960Cx/Hx and AMD29030/40 processors interface 1120 ready hardware messaging unit 12 channel DMA controller plus Multiprocessor DMA chaining and demand mode DMA


    OCR Scan     		PDF V360EPC 960Cx/Hx AMD29030/40 640-byte 64-byte 2348G

    Untitled

    Abstract: No abstract text available
    Text: V960PBC Rev. B2 LOCAL BUS TO PCI BRIDGE FOR ¡960 Sx PROCESSORS • Glueless interface between Intel ¡960Sx, processors and PCI bus • Fully compliant with PCI 2.1 specification • Configurable for primary master, bus master, or target operation • Up to 1 Kbyte burst access support on both local


    OCR Scan     		PDF V960PBC 960Sx, 8/16-bit V960PBC LAD24â V961PBC.

    Untitled

    Abstract: No abstract text available
    Text: W f f g i * « % llr £ V 3 7 0 P D C Rev. AO High Performance PCI SDRAM Controller with Integrated Peripheral Control Unit j, v f »KO * • Fully compliant with PCI 2.2 specification target interface • Hot Swap Ready PICMG Hot Swap Specification • Multiplexed or Non-multiplexed 8-, 16-, or 32-bit


    OCR Scan     		PDF 32-bit 168-pin 32-bit 2348G

    48lc16m

    Abstract: 48LC
    Text: ADVANCE 16 MEG x 72 R E G I S T E R E D SDRA M DIMM MICRON I TECHNOLOGY, INC. SYNCHRONOUS DRAM M O D U L E M T 1 8 L S D T 1 6 7 2 For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES


    OCR Scan     		PDF 168-p 168-Pin 48lc16m 48LC

    Untitled

    Abstract: No abstract text available
    Text: V292PBC S LOCAL BUS TO PCI BRIDGE FOR DE-MULTIPLEXED A/D PROCESSORS • Glueless interface between AMD’s Am29030/ 40 processors and PCI bus • Fully compliant with PCI 2.1 specification • Configurable for primary master, bus master, or target operation


    OCR Scan     		PDF V292PBC Am29030/ 234SG