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    EMP16 Search Results

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    EMP16 Price and Stock

    Silergy Corporation EV-EMP16-1-PSD

    EMP16 Evaluation Kit with 78M6610+PSD Pre-Calibrated - Boxed Product (Development Kits) (Alt: EV-EMP16-1-PSD)
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    Avnet Americas EV-EMP16-1-PSD Box 35 Weeks 1
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    Omega Engineering TEMP-1623

    Tc 11 Style N Type, 6Mm Inconel Sheath, Rohs Compliant: Yes |Omega TEMP-1623
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    Newark TEMP-1623 Bulk 1
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    Omega Engineering TEMP-1685

    Temp-1685 |Omega TEMP-1685
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    Newark TEMP-1685 Bulk 1
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    Omega Engineering TEMP-1605

    Temp-1605 |Omega TEMP-1605
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    Newark TEMP-1605 Bulk 1
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    Omega Engineering TEMP-1636

    Temp-1636 |Omega TEMP-1636
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    Newark TEMP-1636 Bulk 1
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    EMP16 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    EMP16-E2

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS EMP16-E2 0 ~ 8° 10.3±0.2 9 1 8 10.3±0.4 7.5±0.1 0.6 16 0.10 1.27 0.2±0.1 2.5±0.15 0.28±0.05 0.42±0.1 UNIT : mm


    Original     		PDF EMP16-E2 EMP16-E2

    EMP16-E2

    Abstract: No abstract text available
    Text: パッケージ外形図 EMP16-E2 0 ~8° 10.3±0.2 9 1 8 10.3±0.4 7.5±0.1 0.6 16 0.10 1.27 0.2±0.1 2.5±0.15 0.28±0.05 0.42±0.1 単位 : mm


    Original     		PDF EMP16-E2 EMP16-E2

    VQFN28

    Abstract: DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420
    Text: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 VQFN28 DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420

    EMP20-E2

    Abstract: QFP80 QFP64 package QFP80-C3 SSOP20
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF O-252 EMP20-E2 QFP80 QFP64 package QFP80-C3 SSOP20

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。


    Original     		PDF 50pcs/ 25pcs/ 20pcs/ 16pcs/ 10pcs/ DIP16 DIP18 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30

    JIS C 0806

    Abstract: ET710 L336 FFP16-C1 EMP14 ET-7101 SDMP30 JRC TE1 TE2 TE3
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


    Original     		PDF ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 JIS C 0806 ET710 L336 FFP16-C1 EMP14 ET-7101 SDMP30 JRC TE1 TE2 TE3

    crc8 st7

    Abstract: ST7267 TQFP48 TQFP64 overvoltage protection ttl FAG 29 diode
    Text: ST7267 USB 2.0 HIGH SPEED MASS STORAGE MICROCONTROLLER PRELIMINARY DATA • ■ ■ ■ ■ ■ USB 2.0 Interface compliant with Mass Storage Device Class – Integrated USB 2.0 PHY – Supports USB High Speed and Full Speed – 1 control endpoint with two 64-byte buffers


    Original     		PDF ST7267 64-byte 512-byte 16-bit crc8 st7 ST7267 TQFP48 TQFP64 overvoltage protection ttl FAG 29 diode

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2

    DIP18

    Abstract: DIP20 DIP40
    Text: スティックケース寸法図 ３．スティックケース寸法図 DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC パッケージ品はスティックケースでの出荷が可 能です。以下にスティックケースの寸法を示します。


    Original     		PDF 14/16pin) DIP14 DIP16 DIP14-D1 DIP14-D1 DIP16-D2/D3 DIP16-D2/D3 18/20pin) DIP18 DIP20 DIP40

    DMP14

    Abstract: DMP16 EMP14 SDMP30 SSOP10
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、はんだブリッジの発生の有無などを


    Original     		PDF OT-89 USB10-C3 USB12-E3 BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 SDMP30 SSOP10

    JRC 6001

    Abstract: JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2
    Text: テーピング寸法図 ４．テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法（ET-7101:粘着式）」に準じ、エンボスキャリアテーピングの規


    Original     		PDF EIAJET-7101: JISC-0806: 14pin 30pin 24pin 20pin 16pin 18pin JRC 6001 JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2

    "Motor Controller"

    Abstract: motor controller njm3517 stepper motor controller NJM12902 "operational Amplifier" "Stepper Motor" half step drive motor driver step stepper motor driver ICs
    Text: Stepper Motor Controller/Driver Stepper Motor Controller/Driver NJM3517 DATA SHEET • GENERAL DESCRIPTION Controller/Driver NJM3517 is a stepper motor controller/driver, which required minimum of external components and drive currents up to 500mA. The NJM3517 is suited for applications requiring leastpossible RFI. Operating in a bilevel drive mode can increase


    Original     		PDF NJM3517 NJM3517 500mA. 2x350mA DIP16/EMP16 NJM12902 "Motor Controller" motor controller stepper motor controller NJM12902 "operational Amplifier" "Stepper Motor" half step drive motor driver step stepper motor driver ICs

    NJM3517

    Abstract: NJM3517D2 1N4001 NJM3517E2 NJM3770A 3517D2 OB83
    Text: NJM3517 STEPPER MOTOR CONTROLLER / DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE NJM3517 is a stepper motor controller/driver, which requires minimum of external components and drive currents up to 500mA. The NJM3517 is suited for applications requiring least-possible RFI.


    Original     		PDF NJM3517 NJM3517 500mA. NJM3517D2 NJM3517E2 350mA NJM3517D2 1N4001 NJM3517E2 NJM3770A 3517D2 OB83

    B7 SOT-89

    Abstract: DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF EQFN14-D7 QFN12-11 QFN16-21 QFN16-44 QFN24-T2 QFN24-34 QFN28-N2 QFN48-Q1 PCSP14-C3 PCSP16-E4 B7 SOT-89 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2

    DIP18

    Abstract: DIP20 DIP40 702 mini transistor
    Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as fillows. 1. Plastic Tube Container for dual-in-line plastic mold


    Original     		PDF 50pcs/tube DIP14/16 O-220F O-220F-4 25pcs/tube PLCC28-M2 DIP18 DIP20 DIP40 702 mini transistor

    ET-7101

    Abstract: jrc 4001 EMP14 EMP16-E2 EMP20-E2 SDMP30
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


    Original     		PDF ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 ET-7101 jrc 4001 EMP14 EMP16-E2 EMP20-E2 SDMP30

    QFP-144L

    Abstract: VSP8 Package EMP8
    Text: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 0.51M IN 1.0±0.2 0.46±0.1 2.54 2.8M IN 0.74MAX 4.7M AX 1.5±0.2 +0.15 0.25 -0.05 ~ 15º UNIT: mm 19.0±0.3 DIP14 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8M IN 0.51M IN 4.7M AX 2.03MAX +0.15


    Original     		PDF 74MAX DIP14 03MAX DIP16 51MIN 76MAX DIP16-D2 25MAX 84MAX 33MAX QFP-144L VSP8 Package EMP8

    EMP24-E3

    Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF O-252 EMP24-E3 EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10

    DMP24 JRC

    Abstract: kw2j JRC 8002 EMP14 SDMP30
    Text: テーピング寸法図 ３．テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法（ET-7101:粘着式）


    Original     		PDF EIAJET-7101: JISC-0806: 14pin 20pin 24pin 30pin 16pin 18pin DMP24 JRC kw2j JRC 8002 EMP14 SDMP30

    SSOP10

    Abstract: DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


    Original     		PDF 25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube SSOP10 SSOP10 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30

    NJM2675D

    Abstract: NJM2675 2675D NJM2675E2
    Text: NJM2675 H BRIDGE DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE The NJM2675 is a general-purpose 60V single H-bridge drive IC. It consists of a H-bridge, a thermal shut down circuit and its alarm output. The alarm output can detect application problems and the system reliability will be significantly


    Original     		PDF NJM2675 NJM2675 NJM2675D NJM2675E2 1200mA DIP16 EMP16 NJM2675D 2675D NJM2675E2

    emp8 Package dimension

    Abstract: TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16
    Text: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by


    Original     		PDF OT23-5 OT23-6 SC88A SC82AB emp8 Package dimension TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16

    DIP18

    Abstract: DIP20 TO-220F-4
    Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold


    Original     		PDF 50pcs/tube DIP14/16 DIP14 25pcs/tube DIP16 25ype) O-220F O-220F-4 DIP18 DIP20 TO-220F-4

    P2671

    Abstract: NP2671 "Stepping Motor" stepping motor
    Text: NPM NP2671 STEPPER MOTOR CONTROLLER I DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE N P 2671 is a two-phase unipolar stepping motor driver with a motor output of a maximum of 60 V and a maximum cunent of 500 mA. The Puise&Oir Pulse Input system of the motor controller


    OCR Scan     		PDF P2671 NP2671 NP2671 P2671 "Stepping Motor" stepping motor