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    BCC36 Price and Stock

    PFLITSCH GmbH & Co KG BCC-36-BK

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    DigiKey BCC-36-BK Bag 10
    • 1 -
    • 10 $4.105
    • 100 $4.105
    • 1000 $4.105
    • 10000 $4.105
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    PFLITSCH GmbH & Co KG BCC-36-BG

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    DigiKey BCC-36-BG Bag 10
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    • 10 $3.283
    • 100 $3.283
    • 1000 $3.283
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    Banner Engineering Corp MBCC-366RA

    Sensor Cables / Actuator Cables Cordset: Single Ended 7/8 in; 3-pin Right-Angle Female Shielded; 20.12 m 3x18 Black PVC Jacket; Nylon Black Coupling Nut
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    Mouser Electronics MBCC-366RA
    • 1 $237
    • 10 $237
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    Newark MBCC-366RA Bulk 1
    • 1 $237
    • 10 $237
    • 100 $237
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    FASTRON GmBH XHBCC-362K-02

    RF Inductors - Leaded Leaded Inductor - Fixed Choke Coil
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    Mouser Electronics XHBCC-362K-02
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    • 1000 $0.572
    • 10000 $0.505
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    NAC XHBCC-362K-02 300
    • 1 $0.51
    • 10 $0.51
    • 100 $0.51
    • 1000 $0.4269
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    FASTRON GmBH XHBCC-362J-02

    RF Inductors - Leaded 3600uH 20kHz 5%
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics XHBCC-362J-02
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    • 1000 $0.534
    • 10000 $0.487
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    Find more BCC36 price and stock on Findchips.com

    BCC36 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: パッケージ外形図 BCC36 0.75±0.05 4.40±0.07 Mounting height 19 28 INDEX AREA 4.40±0.07 0.05 1 10 < TOP VIEW > 0.075±0.025 (Stand off) < SIDE VIEW > 3.80±0.10 2.80±0.10 1 10 Details of 0.40±0.10 "A" Details of "C" 0.40±0.06 0.40±0.06 "B" 2.80±0.10


    Original     		PDF BCC36 GD-J03601F-1

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS BCC36 0.75±0.05 4.40±0.07 Mounting height 19 28 INDEX AREA 4.40±0.07 0.05 1 10 < TOP VIEW > 0.075±0.025 (Stand off) < SIDE VIEW > 3.80±0.10 2.80±0.10 1 10 Details of 0.40±0.10 "A" Details of "C" 0.40±0.06 0.40±0.06 "B" 2.80±0.10


    Original     		PDF BCC36 GD-J03601F-1

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2

    DMP14

    Abstract: DMP16 EMP14 SDMP30 SSOP10
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、はんだブリッジの発生の有無などを


    Original     		PDF OT-89 USB10-C3 USB12-E3 BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 SDMP30 SSOP10

    JRC 6001

    Abstract: JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2
    Text: テーピング寸法図 ４．テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法（ET-7101:粘着式）」に準じ、エンボスキャリアテーピングの規


    Original     		PDF EIAJET-7101: JISC-0806: 14pin 30pin 24pin 20pin 16pin 18pin JRC 6001 JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2

    rg82855pm

    Abstract: RG82855PM 855PM SL752 subwoofer preamp diagram SL752 Intel RG82855pm wistron BC547 audio WISTRON power sequence Intel 855PM Odem ICH4-M B220LFA
    Text: Mobil CPU Banias uFCPGA CRT TV OUT 16 CARDBUS & 1394 TI 4510 ATI M10-CSP64 LVDS LCD 12 VGA 16 dual channel 31 LAN L4:VCC L5:Signal 2 L6:GND L7:Signal 3 L8:Component ATA 66/100 left side ICH4-M RTL 8101L PRIMARY IDE 3/5V DC/DC TXFM 17,18,19 USB2.0 PORT*3


    Original     		PDF M10-CSP64 66MHz 400MHz 855PM 266/333MHz 44K01 33MHz 11b/a 66MHz 8101L rg82855pm RG82855PM 855PM SL752 subwoofer preamp diagram SL752 Intel RG82855pm wistron BC547 audio WISTRON power sequence Intel 855PM Odem ICH4-M B220LFA

    B7 SOT-89

    Abstract: DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF EQFN14-D7 QFN12-11 QFN16-21 QFN16-44 QFN24-T2 QFN24-34 QFN28-N2 QFN48-Q1 PCSP14-C3 PCSP16-E4 B7 SOT-89 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2

    JIS C 0806

    Abstract: EIAJ-RRM-08-B EMP14 EMP16-E2 EMP20-E2 SC-82AB
    Text: TAPING DIMENSIONS Taping Dimensions Emboss carrier taping in accordance with JIS standard C-0806 ”Packaging of Electronic Components on Continuous Tapes Surface Mounting Device ”. Emboss Taping Table PKG Item Reel Diameter (mm) Tape Width (mm) Pitch (mm)


    Original     		PDF C-0806 14pin 16pin 20pin 24pin 30pin 18pin 22pin 28pin 40pin JIS C 0806 EIAJ-RRM-08-B EMP14 EMP16-E2 EMP20-E2 SC-82AB

    50PCS

    Abstract: DIP18 DIP20 DIP32 DIP40 SDIP22 SDIP24 SDIP28
    Text: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、エンボステーピング、トレイ及び ビニール袋にて出荷しております。


    Original     		PDF DIP14 DIP16 DIP18 DIP20 DIP22 DIP24 DIP32 DIP40 SDIP22 SDIP24 50PCS DIP18 DIP20 DIP32 DIP40 SDIP22 SDIP24 SDIP28

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP-20-C3
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF OT-23-6-1 FLP10-C1 SSOP10 SSOP14 SSOP16 SSOP20 SSOP20-B2 SSOP20-C3 SSOP20-F1 SSOP24 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP-20-C3

    DMP8 pcb pattern

    Abstract: BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC32 BCC36 PCSP20-CC DMP8 pcb pattern BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2

    EIAJ-RRM-08-B

    Abstract: EMP14 EMP16-E2 EMP20-E2 SC-82AB SC8-2 EIAJRRM08B
    Text: テーピング寸法図 ４．テーピング寸法図 エンボスキャリアテーピングの規格はJIS「電子部品のテーピング寸法（C-0806:表面実装部品）」に準じております。 各テーピングでの IC の包装方向、1 リール当りの数量は下記一覧表のようになります。


    Original     		PDF JISC-0806: 14pin 16pin 20pin 24pin 30pin 18pin 22pin 28pin 40pin EIAJ-RRM-08-B EMP14 EMP16-E2 EMP20-E2 SC-82AB SC8-2 EIAJRRM08B

    JRC 8002

    Abstract: EIAJ-RRM-08-B JRC 6001 EMP14 ET-7101 SDMP30 JRC 2105 JRC TE1 TE2 TE3 TE1 JRC EIAJ-RRM-08B
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


    Original     		PDF ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 JRC 8002 EIAJ-RRM-08-B JRC 6001 EMP14 ET-7101 SDMP30 JRC 2105 JRC TE1 TE2 TE3 TE1 JRC EIAJ-RRM-08B

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 TO-252 njrc
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


    Original     		PDF 25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube 20pcs/pcs/tray 50pcs/tray DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 TO-252 njrc

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。


    Original     		PDF 50pcs/ 25pcs/ 20pcs/ 16pcs/ 10pcs/ DIP16 DIP18 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30

    QFN-28P

    Abstract: QFP80-C3 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP14 SSOP20-F1
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC32 BCC36 PCSP20-CC QFN-28P QFP80-C3 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP14 SSOP20-F1

    EIAJ-RRM-08-B

    Abstract: EIAJ-RRM-08B EMP14 EMP16-E2 EMP20-E2 SC-82AB EIAJRRM08B JISC0806 W140mm sot23 1303
    Text: テーピング寸法図 ４．テーピング寸法図 エンボスキャリアテーピングの規格はJIS「電子部品のテーピング寸法（C-0806:表面実装部品）」に準じております。 各テーピングでの IC の包装方向、1 リール当りの数量は下記一覧表のようになります。


    Original     		PDF JISC-0806: 14pin 16pin 20pin 24pin 30pin 18pin 22pin 28pin 40pin EIAJ-RRM-08-B EIAJ-RRM-08B EMP14 EMP16-E2 EMP20-E2 SC-82AB EIAJRRM08B JISC0806 W140mm sot23 1303

    EIAJ-RRM-08-B

    Abstract: EIAJ-RRM-08B EIAJRRM08B JIS C 0806 EMP14 EMP16-E2 EMP20-E2 SC-82AB TVSP8 eiaj-rrm08
    Text: TAPING DIMENSIONS Taping Dimensions Emboss carrier taping in accordance with JIS standard C-0806 ”Packaging of Electronic Components on Continuous Tapes Surface Mounting Device ”. Emboss Taping Table PKG Item Reel Diameter (mm) Tape Width (mm) Pitch (mm)


    Original     		PDF C-0806 14pin 16pin 20pin 24pin 30pin 18pin 22pin 28pin 40pin EIAJ-RRM-08-B EIAJ-RRM-08B EIAJRRM08B JIS C 0806 EMP14 EMP16-E2 EMP20-E2 SC-82AB TVSP8 eiaj-rrm08

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP20-C
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF OT-23-6-1 SON10 FLP10-C1 SSOP10 SSOP14 SSOP16 SSOP20 SSOP20-B2 SSOP20-C3 SSOP20-F1 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP20-C

    LQFP144

    Abstract: QFN24 tray qfp32 QFN tray QFP52-A2 QFP52-S1 SSOP20 DIP18 DIP20 DIP32
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


    Original     		PDF DIP14 DIP16 DIP18 DIP20 DIP22 DIP24 DIP32 DIP40 SDIP22 SDIP24 LQFP144 QFN24 tray qfp32 QFN tray QFP52-A2 QFP52-S1 SSOP20 DIP18 DIP20 DIP32

    Foxconn L S-36

    Abstract: wistron rc71 MH187 BC643 b1535 foxconn Wistron Corporation BCC-11 BC148 pin configuration
    Text: CPU TV OUT LCD VGA LVDS PG.18 PG. 14,15,16,17 PG.26 PG.29,30 CARDBUS PORT 802.11b 1394 PORT LAN LAYER 5 SIGNAL LAYER 6 GND RJ45 RJ11 PRIMARY IDE TXFM LAYER 7 SIGNAL ATA 66/100 LAYER 8 COMPONENT MDC PG.21 PG.32 PG.28 LPC DEBUG CONN 1st HDD CD ROM PG.38 FIR


    Original     		PDF 66MHz 100MHz 266MHz MAP-17 33MHz 44T01 33MHz uPD720100 48Mb/S 8100BL Foxconn L S-36 wistron rc71 MH187 BC643 b1535 foxconn Wistron Corporation BCC-11 BC148 pin configuration