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    Siemens 6FX50025DS561CF0

    POWER CABLE PREASSEMBLED | Siemens 6FX50025DS561CF0
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    Siemens 6FX50025DS561CA0

    POWER CABLE PREASSEMBLED | Siemens 6FX50025DS561CA0
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    Siemens 6FX50025DS561EA0

    POWER CABLE PREASSEMBLED | Siemens 6FX50025DS561EA0
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    RS 6FX50025DS561EA0 Bulk 5 Weeks 1
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    Siemens 6FX80025DS561BB0 (ALTERNATE: 6FX80025DS561BB0)

    POWER CABLE PREASSEMBLED ; 335.24 | Siemens 6FX80025DS561BB0
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    RS 6FX80025DS561BB0 (ALTERNATE: 6FX80025DS561BB0) Bulk 2 Weeks 1
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    Siemens 6FX50025DS561BF0 (ALTERNATE: 6FX50025DS561BF0)

    POWER CABLE PREASSEMBLED ; 282.46 | Siemens 6FX50025DS561BF0
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    RS 6FX50025DS561BF0 (ALTERNATE: 6FX50025DS561BF0) Bulk 2 Weeks 1
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    DS561 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DIM400GCM33-A000

    Abstract: No abstract text available
    Text: DIM400GCM33-A000 DIM400GCM33-A000 IGBT Chopper Module DS5613-1.1 June 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES VCE sat *


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    PDF DIM400GCM33-A000 DS5613-1 DIM400GCM33-A000

    DIM800NSM33-F000

    Abstract: DIM800NSM33-F
    Text: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-6 DS5615-7 September 2012 LN29760 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM800NSM33-F000 DS5615-6 DS5615-7 LN29760) DIM800NSM33-F000 DIM800NSM33-F

    Untitled

    Abstract: No abstract text available
    Text: DIM400GCM33-A000 DIM400GCM33-A000 IGBT Chopper Module Replaces June 2003, version DS5613-1.1 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability DS5613-2.0 May 2004


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    PDF DIM400GCM33-A000 DS5613-1 DS5613-2 DIM400GCM33-A000

    DIM400GDM33-F000

    Abstract: DIM400GDM33-F
    Text: DIM400GDM33-F000 Dual Switch IGBT Module Replaces DS5616-2.1 DS5616-3 February 2014 LN31315 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM400GDM33-F000 DS5616-2 DS5616-3 LN31315) DIM400GDM33-F000 DIM400GDM33-F

    Untitled

    Abstract: No abstract text available
    Text: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-6 DS5615-7 September 2012 LN29760 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM800NSM33-F000 DS5615-6 DS5615-7 LN29760)

    DIM800NSM33-F000

    Abstract: chop ds5615
    Text: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-5 DS5615-6 October 2011 LN28810 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM800NSM33-F000 DS5615-5 DS5615-6 LN28810) DIM800NSM33-F000 chop ds5615

    DS5611-1

    Abstract: No abstract text available
    Text: DIM200WHS12-H000 DIM200WHS12-H000 Fast Half Bridge IGBT Module Target Infomation DS5611-1.4 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate KEY PARAMETERS VCES


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    PDF DIM200WHS12-H000 DS5611-1 20kHz DIM200WHS12-H000

    IEEE1394B

    Abstract: RCLED 2600C S100 S200 ZL60003
    Text: ZL60003 Plastic Optical Fiber Communications 125 to 250Mbps Data Sheet DS5612 Issue 1 June 2002 Ordering Information ZL60003/TBD TO-46 Package -20 to +700C Description This unique Resonant Cavity Surface-Emitting LED RCLED is designed for optical communications over


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    PDF ZL60003 250Mbps DS5612 ZL60003/TBD IEEE1394b ZL60003 IEEE1394B RCLED 2600C S100 S200

    SPC-03-XLR-xxCxA

    Abstract: DS-5611 SPC-03-XLR SPC-03-XLR-xxCDA 61-XX GR-468 transceiver DFB APD 155 DFB APD 155mbps
    Text: P/N: SPC-03-XLR-xxCxA 155 Mbps CWDM SFP Transceiver Features Single 3.3V supply 42.5dB Minimum Link Budget CWDM DFB Laser APD Receiver Commercial Temperature Available SFP MSA SFF-8074i Compliant Digital Diagnostic SFF-8472 Compliant GR-253/STM G.957 Compliant


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    PDF SPC-03-XLR-xxCxA SFF-8074i SFF-8472 GR-253/STM GR-468 DS-5611 SPC-03-XLR-xxCxA DS-5611 SPC-03-XLR SPC-03-XLR-xxCDA 61-XX transceiver DFB APD 155 DFB APD 155mbps

    DS561

    Abstract: No abstract text available
    Text: SENSITRON SEMICONDUCTOR 2000 CATALOG Transient VoltageSuppressor SurfaceMount InlineArrayPackage INLINE-5 Size A TheInline-2 through Inline-10 series can be constructed withanynumber of TVSdie from 2 to10 withcommonanode. Ifa common contact isalsorequired to bebrought out, the


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    PDF line-10 40x40 a89mil 500Wand 400Wrespe PHP24 PHP30 PHP60 PHP120 PHP206 DS561

    Untitled

    Abstract: No abstract text available
    Text: SENSITRON SEMICONDUCTOR 2000 CATALOG Transient VoltageSuppressor SurfaceMount InlineArrayPackage INLINE-5 Size A TheInline-2 through Inline-10 series can be constructed withanynumber of TVSdie from 2 to10 withcommonanode. Ifa common contact isalsorequired to bebrought out, the


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    PDF line-10 40x40 a89mil 500Wand 400Wrespe PHP24 PHP30 PHP60 PHP120 PHP206

    XC6SLX16-CSG324

    Abstract: ch7301 DVI VHDL DVI VHDL xilinx ch7301 CHRONTEL 7301 Xilinx XPS Thin Film Transistor(TFT) Controller TFT controller XC4VLX25-FF668-10 a/ch7301 DVI VHDL DS695
    Text: XPS Thin Film Transistor TFT Controller (v2.00a) DS695 September 16, 2009 Product Specification 0 0 Introduction LogiCORE Facts The XPS Thin Film Transistor (TFT) controller is a hardware display controller IP core capable of displaying 256k colors. The XPS TFT controller


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    PDF DS695 CH-7301 XC6SLX16-CSG324 ch7301 DVI VHDL DVI VHDL xilinx ch7301 CHRONTEL 7301 Xilinx XPS Thin Film Transistor(TFT) Controller TFT controller XC4VLX25-FF668-10 a/ch7301 DVI VHDL

    uart vhdl

    Abstract: XC5VLX50-FF676
    Text: LogiCORE IP XPS SYSMON ADC v3.00.b DS620 October 19, 2011 Product Specification Introduction LogiCORE IP Facts Table The Xilinx Platform Studio (XPS) System Monitor (SYSMON) Analog-to-Digital Converter (ADC) Intellectual Property (IP) core is a 32-bit slave


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    PDF DS620 32-bit uart vhdl XC5VLX50-FF676

    XC5VLX50-FF676

    Abstract: XC4VFX12-FF668-10 xc5vlx50-ff676-1 XC6VLX130TFF1156 XC3S700A VIRTEX-5 DDR2 controller DS570 AT45DB161D M25P16 PLBV46
    Text: XPS Serial Peripheral Interface SPI (v2.01b) DS570 September 16, 2009 Product Specification 0 0 Introduction LogiCORE Facts The XPS Serial Peripheral Interface (SPI) connects to the PLB V4.6 (Processor Local Bus with Xilinx simplifications) and provides a serial interface to SPI


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    PDF DS570 M68HC11 XC5VLX50-FF676 XC4VFX12-FF668-10 xc5vlx50-ff676-1 XC6VLX130TFF1156 XC3S700A VIRTEX-5 DDR2 controller AT45DB161D M25P16 PLBV46

    CLC560

    Abstract: CLC561
    Text: Wideband, Low Distortion APPLICA TIO NS: output amplification arbitrary waveform generation ATE systems cable/line driving function generators • SAW drivers • flash A /D driving and testing FEATURES: • 150MHz bandwidth at + 24dB m output • low distortion 2nd/3rd:


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    PDF LC561 CLC561 24dBm 150MHz. 10dBm 18dBm 24dBm 20MHz 50MHz 100MHz CLC560

    Untitled

    Abstract: No abstract text available
    Text: 2mm Interconnect TEMPUS C B C 20 M ale Pow er Modules — W ide W all - - Solder or Pressfit Term ination — 4 Row "I Features • Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order • Stackable with other TEMPUS modules, with


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    PDF 48b237, EIAis64, P1596 E8572 LR85691 4772b5c

    Untitled

    Abstract: No abstract text available
    Text: Comlinear Corporation Wideband, Low Distortion D r i \$ L - a m p s 1111 APPLICATIONS: • output amplification • arbitrary waveform generation • ATE systems • cable/line driving • function generators • SAW drivers • flash A /D driving and testing


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    PDF 150MHz 24dBm -59/-62dBc 20MHz 10dBm) CLC561 24dBm 10Vpp 150MHz. CLC561