CT3513-1
Abstract: MV3010 PCBAN111 MV30101 SCAMP
Text: THIS DOCUMENT IS FOR MAINTENANCE PURPOSES ONLY AND IS NOT RECOMMENDED FOR NEW DESIGNS CT3513-1 ADVANCE INFORMATION DS3801-1.0 PCBAN111 MV3010-1 SLAC EVALUATION PACKAGE Now available from GPS is a complete evaluation package for the MV3010-1 Subscriber Line Audio Circuit SLAC . The
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CT3513-1
DS3801-1
PCBAN111
MV3010-1
AN111-2
CT3513-1
MV3010
PCBAN111
MV30101
SCAMP
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR DS1230Y-100 JAN '01 MONITOR DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 A1-Y 0045 720 305435 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 26427 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 26428 PHYSICAL DIMENSIONS MIL-STD-883-2016
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DS1230Y-100
DS1230
MIL-STD-883-2003
MIL-STD-883-2016
60C/90%
DS3801
DS3816
-C501
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25814
Abstract: No abstract text available
Text: RELIABILITY MONITOR DS1230Y-200 APR '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-Y 0005 720 118511 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25412 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 25413 PHYSICAL DIMENSIONS MIL-STD-883-2016
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DS1230Y-200
DS1230
MIL-STD-883-2003
MIL-STD-883-2016
60C/90%
DS1230AB-200
DS5000T
DS5000
25814
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DS3802
Abstract: DS3816C-512
Text: DS3816C-512 16Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 5V operation ±10% Surface-mount NV RAM BGA module construction 512k x 32 NV SRAM memory space and separate 64 x 8 real-time clock memory
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DS3816C-512
150ns
DS3816C-512
50mil
DS3802
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dallas date code ds1230
Abstract: No abstract text available
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00
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DH046190AAI
DS1620
DS1869
DH833210AAB
DS5002
DN028766AAD
DN030363AAA
J-STD-020
DS1302
dallas date code ds1230
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2-5779
Abstract: No abstract text available
Text: RELIABILITY MONITOR DS1230AB-200 JUL '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-A 0019 720 117143 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25775 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 2 2 25776 PHYSICAL DIMENSIONS MIL-STD-883-2016
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DS1230AB-200
DS1230
MIL-STD-883-2003
MIL-STD-883-2016
60C/90%
DS3816
DS3801
-C501
2-5779
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dallas date code ds1230
Abstract: dallas ds1230 25919 DS1230
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:
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DS1621
DE940040AAC
DS5002
DS87C520
DM925587AAF
DK935356AAB
DK933191AAJ
DE952427AAD
DE014522ADB
dallas date code ds1230
dallas ds1230
25919
DS1230
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Untitled
Abstract: No abstract text available
Text: DS3832C-311 3.3V, 32Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 3.0V to 3.6V operation Surface-mount nonvolatile NV RAM ball-grid array (BGA) module construction 1024k x 32 NV SRAM memory space and
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DS3832C-311
1024k
100ns
200ns
tDS3832C-311
DS3832C-311
50mil
DS3802
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DS3802
Abstract: DS3832C-311 DS3801
Text: DS3832C-311 3.3V, 32Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 3.0V to 3.6V operation Surface-mount nonvolatile NV RAM ball-grid array (BGA) module construction 1024k x 32 NV SRAM memory space and
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DS3832C-311
1024k
100ns
200ns
DS3832C-311
50mil
DS3802
DS3801
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25821
Abstract: dallas date code ds12887 25854
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC
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DS1621
DS1869
DE940040AAC
DH833210AAB
DS2181A
DS5002
DE004552ABD
DN012259AAL
DN028766AAD
25821
dallas date code ds12887
25854
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DF 331 TRANSISTOR
Abstract: No abstract text available
Text: MOTOROLA sc -c xstrs /r f > 13E D I t,3 b ? E S 4 □Df l TSt . T T -n -ty 1 | Order this data sheet by MG100BZ100/D MOTOROLA I SEMICONDUCTOR • 8 9 TECHNICAL DATA MG100BZ100 Isolated Gate Bipolar Power Transistor Module Energy M anagem ent Series D U A L N-CH ANN EL
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OCR Scan
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MG100BZ100/D
MG100BZ100
MK145BP,
C56937
DF 331 TRANSISTOR
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