Untitled
Abstract: No abstract text available
Text: 16 Megabit FLASH EEPROM DPZ1MX16Nn3 DESCRIPTION: The DPZ1MX16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded
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PDF
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DPZ1MX16Nn3
50-pin
16-Megabits
DPZ1MX16NY3
DPZ1MX16Nn3
30A117-02
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Untitled
Abstract: No abstract text available
Text: 16 Megabit FLASH EEPROM DPZ1MX16NV3 DESCRIPTION: The DPZ1MX16NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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DPZ1MX16NV3
DPZ1MX16NV3
30A123-01
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Untitled
Abstract: No abstract text available
Text: 16 Megabit FLASH EEPROM DPZ1MX16Nn3 D E S C R IP T IO N : The DPZ1MX16Nn3 "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable LeadlessChip Carriers SLCC . Available in straight leaded, "J" leaded or gull wing leaded
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OCR Scan
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PDF
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DPZ1MX16Nn3
50-pin
16-Megabits
120ns
150ns
30A117-02
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ERA3E
Abstract: No abstract text available
Text: 16 Megabit FLASH EEPROM DPZ1MX16NV3 M IC R O S Y S T H M S DESCRIPTION: The D PZ 1M X 16 N V 3 "V E R S A - S T A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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OCR Scan
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MX16NV3
30A123-01
DPZ1MX16NV3
MIL-PR0CE55ED
100ns
120ns
150ns
ERA3E
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 16 Megabit FLASH EEPROM DPZ1MX16NV3 MICROSYSTEMS PRELIM INARY DESCRIPTION: The D PZ 1 M X 1 6 N V 3 "V ER S A - S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers
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OCR Scan
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PDF
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DPZ1MX16NV3
DPZ1MX16NV3
100ns
120ns
150ns
30A123-01
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 16 Megabit FLASH EEPROM DPZ1MX16Nn3 DESCRIPTION: T h e D P Z lM X 1 6 N n 3 " S T A C K " m o d u le s are a re vo lu tio n ary n e w m em ory subsystem u sin g D en se-P ac M icro syste m s' ce ra m ic Stackable L e a d le ss C h ip
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OCR Scan
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PDF
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50-pin
100ns
120ns
150ns
-f-125
3QA117-02
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 16 Megabit FLASH EEPROM MICROSYSTEMS DPZ1MX16NV3 DESCRIPTION: T h e D P Z 1 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a re v o lu tio n a ry n e w m e m o ry su b syste m u sin g D en se-P ac M ic ro sy ste m s' c e ra m ic Stackab le Le ad le ss C h ip C a rrie rs
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DPZ1MX16NV3
-t-85
125-C
30A12M
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DPZ1MX16n
Abstract: 30A117 DPZ1M
Text: DENSE-PAC 32 M EGABIT FLASH EEPROM MICROSYSTEMS DPZ2M X16Nn3 PRELIMINARY D E S C R IP T IO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded
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OCR Scan
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DPZ2MX16Nn3
50-pin
32-Megabits
DPZ2MX16Nn3
120ns
30A117-04
0001S7Ã
DPZ1MX16n
30A117
DPZ1M
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Untitled
Abstract: No abstract text available
Text: „ ^ f[/ J}L I DENSE-PAC S* rty V 1v M I C R O S Y S T E M S 32 MEGABIT FLASH EEPROM \\ DPZ2MX16Nn3 PRELIMINARY D ESC RIPT IO N : The DPZ2MX16Nn3 “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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OCR Scan
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PDF
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DPZ2MX16Nn3
50-pin
32-Megabits
DPZ2MX16Nn3
120ns
30A117-04
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