DPV3232VA Search Results

DPV3232VA Price and Stock

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Dense-Pac Microsystems DPV3232VA-70M
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	DPV3232VA-70M		16			1 $574.4792 10 $492.4107 100 $492.4107 1000 $492.4107 10000 $492.4107	Buy Now
WSI DPV3232VA-55C
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	DPV3232VA-55C		1			1 $12.2454 10 $12.2454 100 $12.2454 1000 $12.2454 10000 $12.2454	Buy Now

DPV3232VA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.	OCR Scan	DPV3232VA DPV3232VA 66-pin 32Kx32 250ns 128KX8, 64KX16 275R41S	PDF
12 SQ 045 JF Abstract: No abstract text available Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.	OCR Scan	DPV3232VA DPV3232VA 66-pin 250ns 128KX8, 64KX16 32KX32 E75R415 12 SQ 045 JF	PDF
Untitled Abstract: No abstract text available Text: □PM DPV3232VA Dense-Pac Microsystems. Inc. 32K X 3 2 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.	OCR Scan	DPV3232VA DPV3232VA 66-pin 250ns 128KXS, 64KX16 32KX32 30A014-60	PDF
Untitled Abstract: No abstract text available Text: DPV3232VA Dense-Pac Microsystems. Inc. ^ 32K X 32 UVEPROM VERSAPAC DESCRIPTION: The D P V 3 2 3 2 V A is a 66-pin Pin Grid Array PG A consisting of four 32K X 8 U V E P R O M devices in ceramic L C C packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.	OCR Scan	DPV3232VA 66-pin 250ns I/O20	PDF
Untitled Abstract: No abstract text available Text: □PM * r ~ T DPV3232VA Dense-Pac Microsystems. Inc. 32K X 32 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.	OCR Scan	DPV3232VA DPV3232VA 66-pin 120ns 150ns 170ns 200ns 250ns DPV12832V 128KX8,	PDF
Untitled Abstract: No abstract text available Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPRO M DPV3232VA D ESC R IP T IO N : The D PV 3232V A is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.	OCR Scan	DPV3232VA 66-pin 250ns 170ns 200ns 250ns 30A014-60	PDF
48-PIN Abstract: No abstract text available Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead	OCR Scan	PS128M PS3232V DPS128X16CJ3/BJ3 PS128X16CH DPS128X16Y3 PS128X16H PS128X24BH PS512S8BN PS512S8N 48-PIN	PDF