Hyundai 9944
Abstract: nseb ds1000m-100 DS2165Q
Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1000M-100
DS1000
DH927108AJC
DS87C520
DN901118AAB
Hyundai 9944
nseb
DS2165Q
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DS1233 a5
Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC
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DS1621
DK815282AAB
DK906731AAC
DS1869
DJ821534ABB
DJ824252AAC
DJ824247ABA
DS1233 a5
e8 sot223
9915
dallas 25010
DN819
densit
DS1232L
ds1232l datasheet
DS1869
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74 HTC 192
Abstract: DS2165Q
Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS1000M-100
DS1000
DH833179ADA
HOUR99
DS87C520
DN825394AAB
J-STD-020
30C/60%
74 HTC 192
DS2165Q
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fds5002
Abstract: dallas E8 24715
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC
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DS1621
DS1869
DK815282AAB
DK906731AAC
DJ821534ABB
DJ824252AAC
DJ824247ABA
fds5002
dallas E8
24715
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ti 9919
Abstract: No abstract text available
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA
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DM846764AA
DM842206AL
DM849359AC
DS2502
DM849359AC
ti 9919
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DM92
Abstract: DM-92 472E-06
Text: RELIABILITY MONITOR DS1232L APR '99 MONITOR-CHIPPAC,KOREA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232L C2 SOIC 150 CPK ChipPac, K 9848 PROCESS Single Poly, Single Metal DL829603AAC 8 0.8 µm Standard Process JOB NO DESCRIPT
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DS1232L
DL829603AAC
DM92
DM-92
472E-06
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218E-08
Abstract: ti 9919
Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C2 MAR '99 24153 9913 Carsem S DM842206AL
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DM842206AL
DM846764AA
DS2502
DM846764AA
DM842206AL
218E-08
ti 9919
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