Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CPGA WEIGHT Search Results

    CPGA WEIGHT Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    DLP5500FYAT Texas Instruments 0.55 XGA DMD 149-CPGA Visit Texas Instruments
    DLP6500BFYE Texas Instruments DLP® 0.65 1080p s600 DMD 350-CPGA Visit Texas Instruments Buy
    TMS320C40GFL60 Texas Instruments Digital Signal Processors 325-CPGA Visit Texas Instruments

    CPGA WEIGHT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFN108

    Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
    Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3


    Original     		PDF 84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch

    ms-029

    Abstract: FBGA1152
    Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    Theta JC of FBGA

    Abstract: cpga dimensions cpga weight 84 pin plcc ic base
    Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		PDF AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1

    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


    Original     		PDF

    MO-143

    Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
    Text: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22


    Original     		PDF PBGA329 51xxxxx-x/1 MO-143 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP

    TMDS00510M

    Abstract: 181-pin SMQ320C32PCMM60 TMDS324063 PCM-144 LC31 SMJ320C30 SMJ320C31GFAM40 TMDS3243555-08 320C30
    Text: Fact Sheet M i l i t a r y S e m i c o n d u c t o r P r o d u c t s SMJ320C3x SGYV004G December 2002 SMJ320C30 / 320C31 / 320LC31 / 320C32 HIGHLIGHTS The SMJ320C30, C31, LC31, and C32 can perform parallel multiply and ALU operations on integer or floatingpoint data in a single cycle. Each processor also possesses a general-purpose register file, a program cache,


    Original     		PDF SMJ320C3x SGYV004G SMJ320C30 320C31 320LC31 320C32 SMJ320C30, TMDS00510M 181-pin SMQ320C32PCMM60 TMDS324063 PCM-144 LC31 SMJ320C31GFAM40 TMDS3243555-08 320C30

    kic 125

    Abstract: ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: 2 4 Performance Characteristics of IC Packages 1/22/97 10:05 AM CH04WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES 4.1. IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages:


    Original     		PDF CH04WIP kic 125 ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES

    A1013 equivalent

    Abstract: HSP45116 harris HSP45116 HSP45116GC-15 HSP45116GC-25 HSP45116GC-33 HSP45116GI-15 HSP45116GI-25 HSP45116GI-33 HSP45116VC-15
    Text: HSP45116 S E M I C O N D U C T O R Numerically Controlled Oscillator/Modulator May 1996 Features Description • NCO and CMAC on One Chip The Harris HSP45116 combines a high performance quadrature numerically controlled oscillator NCO and a high speed 16-bit Complex Multiplier/Accumulator (CMAC)


    Original     		PDF HSP45116 HSP45116 16-bit 1-800-4-HARRIS A1013 equivalent HSP45116 harris HSP45116GC-15 HSP45116GC-25 HSP45116GC-33 HSP45116GI-15 HSP45116GI-25 HSP45116GI-33 HSP45116VC-15

    A1013 equivalent

    Abstract: HSP45116 HSP45116GC-15 HSP45116GC-25 HSP45116GC-33 HSP45116GI-15 HSP45116GI-25 HSP45116GI-33 HSP45116VC-15 HSP45116VC-25
    Text: HSP45116 Data Sheet May 1999 File Number Numerically Controlled Oscillator/Modulator Features The Intersil HSP45116 combines a high performance quadrature Numerically Controlled Oscillator NCO and a high speed 16-bit Complex Multiplier/Accumulator (CMAC)


    Original     		PDF HSP45116 HSP45116 16-bit A1013 equivalent HSP45116GC-15 HSP45116GC-25 HSP45116GC-33 HSP45116GI-15 HSP45116GI-25 HSP45116GI-33 HSP45116VC-15 HSP45116VC-25

    A1013 equivalent

    Abstract: HSP45116 HSP45116GC-15 HSP45116GC-25 HSP45116GC-33 HSP45116GI-15 HSP45116GI-25 HSP45116GI-33 HSP45116VC-15 HSP45116VC-25
    Text: HSP45116 TM Data Sheet May 1999 FN2485.7 Numerically Controlled Oscillator/Modulator Features The Intersil HSP45116 combines a high performance quadrature Numerically Controlled Oscillator NCO and a high speed 16-bit Complex Multiplier/Accumulator (CMAC)


    Original     		PDF HSP45116 FN2485 HSP45116 16-bit 15MHz, A1013 equivalent HSP45116GC-15 HSP45116GC-25 HSP45116GC-33 HSP45116GI-15 HSP45116GI-25 HSP45116GI-33 HSP45116VC-15 HSP45116VC-25

    Ablebond 71-1

    Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
    Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or


    Original     		PDF 93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board

    QL3012

    Abstract: QL3025 QL3040 QL3060 QL4016 QL4090 footprint pqfp 208 QuickLogic Military FPGA Introduction
    Text: QuickLogic Military FPGA Introduction Military FPGA Combining High Performance and High Density Military FPGA Introduction DEVICE HIGHLIGHTS Device Highlights Military FPGA • Mil Std 883 and Mil Temp Ceramic ■ Mil Temp Plastic Guaranteed -55 to +125oC


    Original     		PDF 125oC 152-bit 16-bit -55oC, QL3012 QL3025 QL3040 QL3060 QL4016 QL4090 footprint pqfp 208 QuickLogic Military FPGA Introduction

    schottky k04

    Abstract: EL7571 LT1435 MAX798 RISC86 switching power supply design Socket-7 321 AJ29 DIODE schottky HP54720 amd socket 940 PIN LAYOUT
    Text: Mobile AMD-K6 -2 Processor ® Power Supply Design Application Note Publication # 22495 Rev: A Issue Date: January 1999 Amendment/0 1999 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro


    Original     		PDF MAX798 MAX1630/31/32 MAX1710/11 ML4880 SC1401 UCC3870-1 schottky k04 EL7571 LT1435 MAX798 RISC86 switching power supply design Socket-7 321 AJ29 DIODE schottky HP54720 amd socket 940 PIN LAYOUT

    HSP43220

    Abstract: HSP43220GC-25 HSP43220GC-33 HSP43220JC-15 HSP43220JC-25 HSP43220JC-33 HSP43220VC-33 HSP43220GI-25
    Text: HSP43220 S E M I C O N D U C T O R Decimating Digital Filter December 1996 Features Description • Single Chip Narrow Band Filter with up to 96dB Attenuation The HSP43220 Decimating Digital Filter is a linear phase low pass decimation filter which is optimized for filtering


    Original     		PDF HSP43220 HSP43220 33MHz 16-Bit 20-Bit 24-Bit 1-800-4-HARRIS HSP43220GC-25 HSP43220GC-33 HSP43220JC-15 HSP43220JC-25 HSP43220JC-33 HSP43220VC-33 HSP43220GI-25

    schottky k04

    Abstract: AJ29 DIODE schottky elna RJH LT1435 220v ac mobile charger AMD k6 data mallory capacitor date codes elantech EL7571 RISC86
    Text: Mobile AMD-K6 ® Processor Power Supply Design Application Note Publication # 21677 Rev: D Issue Date: September 1998 Amendment/0 This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you evaluate this product. AMD reserves the


    Original     		PDF right/32 ML4880 SC1401 UCC3870-1 21677D/0--September schottky k04 AJ29 DIODE schottky elna RJH LT1435 220v ac mobile charger AMD k6 data mallory capacitor date codes elantech EL7571 RISC86

    Untitled

    Abstract: No abstract text available
    Text: ^ c te l -m Package Characteristics and Mechanical Drawings P a c k a g e T h e rm a l C h a ra c te ris tic s Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Plastic Quad Flatpack (PQFP)


    OCR Scan     		PDF PBGA272 PBGA313

    Untitled

    Abstract: No abstract text available
    Text: S M * « » H S P 4 5 1 16 Numerically Controlled Oscillator/Modulator May1996 Features Description • NCO and CMAC on One Chip The Harris HSP45116 combines a high performance quadrature numerically controlled oscillator NCO and a high speed 16-bit Complex Multiplier/Accumulator (CMAC)


    OCR Scan     		PDF HSP45116 16-bit 5MT982.