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    CPG56 Price and Stock

    AMD XC2C64A-7CPG56C

    IC CPLD 64MC 6.7NS 56CSBGA
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    DigiKey XC2C64A-7CPG56C Tray 1,040 1
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    AMD XC2C64A-7CPG56I

    IC CPLD 64MC 6.7NS 56CSBGA
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    DigiKey XC2C64A-7CPG56I Tray 346 1
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    AMD XC2C32A-4CPG56C

    IC CPLD 32MC 3.8NS 56CSBGA
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    DigiKey XC2C32A-4CPG56C Tray 21 1
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    AMD XC2C64A-5CPG56C

    IC CPLD 64MC 4.6NS 56CSBGA
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    AMD XC2C32A-6CPG56I

    IC CPLD 32MC 5.5NS 56CSBGA
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    DigiKey XC2C32A-6CPG56I Tray 720
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    CPG56 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CPG56

    Abstract: CP56
    Text: R Chip Scale BGA CP56/CPG56 Package PK013 (v1.3) July 9, 2008 56-BALL CHIP SCALE BGA 0.50mm PITCH (CP56/CPG56) 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF CP56/CPG56) PK013 56-BALL CPG56 CP56

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    qfg48 dimensions

    Abstract: XC2C64A-7CPG56I XC2C64A-7QFG48I XC2C64A-7VQG100C XC2C64A-7VQG44C LVCMOS33 XAPP427 XC2C64A DS092 LVCMOS25
    Text: R DS311 v1.3 November 8, 2004 XC2C64A CoolRunner-II CPLD Advance Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF DS311 XC2C64A 64-macrocell VQ100 qfg48 dimensions XC2C64A-7CPG56I XC2C64A-7QFG48I XC2C64A-7VQG100C XC2C64A-7VQG44C LVCMOS33 XAPP427 DS092 LVCMOS25

    DS092

    Abstract: LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XC2C64 XC2C64A VQ1001 5VQ10 G1142
    Text: R DS092 v2.1 March 7, 2005 XC2C64 CoolRunner-II CPLD Note: This product is no longer recommended for new designs. It has been superseded by the XC2C64A, a device with I/O Banking and Pb-free package options. • • • Refer to the CoolRunner -II family data sheet for architecture description.


    Original     		PDF DS092 XC2C64 XC2C64A, 44-pin VQ100 XC2C64A DS092 LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 VQ1001 5VQ10 G1142

    Untitled

    Abstract: No abstract text available
    Text: XC2C32A CoolRunner-II CPLD R DS310 v1.8 March 20, 2006 Product Specification Features Description • The CoolRunner -II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF XC2C32A DS310 32-land 44-pin 56-ball IEEE1149 tSLEW25, tSLEW33 TIN25,

    xcr3064xl

    Abstract: MARKING CODE E5 xcr3064xl vq44 XCR3064XL-10VQ44I
    Text: R XCR3064XL 64 Macrocell CPLD DS017 v2.2 April 4, 2005 14 Product Specification Features Description • • • • • The CoolRunner XPLA3 XCR3064XL device is a 3.3V, 64-macrocell CPLD targeted at power sensitive designs that require leading edge programmable logic solutions. A


    Original     		PDF XCR3064XL DS017 44-pin 48-ball 56-ball 100-pin 64-macrocell MARKING CODE E5 xcr3064xl vq44 XCR3064XL-10VQ44I

    Untitled

    Abstract: No abstract text available
    Text: R DS311 v1.6 January 18, 2005 XC2C64A CoolRunner-II CPLD Advance Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF DS311 XC2C64A 64-macrocell tOUT25 tOUT33, tSLEW25, tSLEW33

    Untitled

    Abstract: No abstract text available
    Text: R DS091 v2.8 January 30, 2005 XC2C32 CoolRunner-II CPLD Note: This product is no longer recommended for new designs. It has been superseded by the XC2C32A, a device with I/O Banking and Pb-free package options. Features • • • • Optimized for 1.8V systems


    Original     		PDF DS091 XC2C32 XC2C32A, 44-pin 56-ball XC2C32A

    xc2c64a vqg44

    Abstract: xc2c32a vqg44 XC2C32A qfg48 COOLRUNNER-II examples VQG44 interfacing 8051 XC9500 XAPP784 XC2C256 XC2C64A
    Text: R DS090 v2.7 July 24, 2006 CoolRunner-II CPLD Family Product Specification Features • • • - Optimized for 1.8V systems - Industry’s fastest low power CPLD - Densities from 32 to 512 macrocells Industry’s best 0.18 micron CMOS CPLD - Optimized architecture for effective logic synthesis


    Original     		PDF DS090 IEEE1149 XC2C128. xc2c64a vqg44 xc2c32a vqg44 XC2C32A qfg48 COOLRUNNER-II examples VQG44 interfacing 8051 XC9500 XAPP784 XC2C256 XC2C64A

    xc2c64a package being vq44

    Abstract: XC2C64A-7QFG48C qfg48 dimensions XC2C64A-7CPG56I XC2C64A-7VQG44I XC2C64A-7VQG44C XC2C64A-7QFG48I XC2C64A-7VQG100C XC2C64A LVCMOS15
    Text: R DS311 v1.8 June 28, 2005 XC2C64A CoolRunner-II CPLD Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF DS311 XC2C64A 64-macrocell tOUT25 tOUT33, tSLEW25, tSLEW33 TIN25, OUT25, TIN33, xc2c64a package being vq44 XC2C64A-7QFG48C qfg48 dimensions XC2C64A-7CPG56I XC2C64A-7VQG44I XC2C64A-7VQG44C XC2C64A-7QFG48I XC2C64A-7VQG100C LVCMOS15

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    XC2C32 jtag

    Abstract: COOLRUNNER-II examples COOLRUNNER-II test circuit XC2C32A COOLRUNNER-II T-Flip-Flop XC2C32 XC2C32-6VQ44C LVCMOS25 LVCMOS33
    Text: R DS091 v2.6 October 7, 2004 XC2C32 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF DS091 XC2C32 32-macrocell XC2C32A XC2C32 jtag COOLRUNNER-II examples COOLRUNNER-II test circuit COOLRUNNER-II T-Flip-Flop XC2C32-6VQ44C LVCMOS25 LVCMOS33

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    CSG484

    Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
    Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D

    XC2C64A-7CPG56I

    Abstract: K8/50 xc2c64a package being vq44 XC2C64A-7QFG48C XC2C64A-7QFG48I XC2C64A-7VQG44C XC2C64A-7VQG44I DS092 LVCMOS15 LVCMOS25
    Text: R DS311 v2.3 November 19, 2008 XC2C64A CoolRunner-II CPLD Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF DS311 XC2C64A 64-macrocell LVCMOS18; LVCMOS33. xcn07022 XC2C64A-7CPG56I K8/50 xc2c64a package being vq44 XC2C64A-7QFG48C XC2C64A-7QFG48I XC2C64A-7VQG44C XC2C64A-7VQG44I DS092 LVCMOS15 LVCMOS25

    XC2C32A

    Abstract: S090P COOLRUNNER-II examples XAPP393 xc2c64a vqg44 DS090 VQ100 XC2C128 XC2C256 XC2C384
    Text: R CoolRunner-II CPLD Family DS090 v3.1 September 11, 2008 Product Specification Features • • • - Optimized for 1.8V systems - Industry’s fastest low power CPLD - Densities from 32 to 512 macrocells Industry’s best 0.18 micron CMOS CPLD - Optimized architecture for effective logic synthesis


    Original     		PDF DS090 IEEE1149 XC2C32 XC2C64 xcn05017 PCG44 xcn07022 XC2C32A S090P COOLRUNNER-II examples XAPP393 xc2c64a vqg44 DS090 VQ100 XC2C128 XC2C256 XC2C384

    IO33

    Abstract: No abstract text available
    Text: R DS092 v1.7 October 1, 2004 XC2C64 CoolRunner-II CPLD Notes: This product is no longer recommended for new designs. It has been superseded by the XC2C64A, a pin compatible part with I/O Banking and Pb-free package options. Features • • • • Optimized for 1.8V systems


    Original     		PDF XC2C64 DS092 XC2C64A, 44-pin 56-ball VQ100 XC2C64A IO33

    Untitled

    Abstract: No abstract text available
    Text: R DS092 v1.9 November 8, 2004 XC2C64 CoolRunner-II CPLD Note: This product is no longer recommended for new designs. It has been superseded by the XC2C64A, a device with I/O Banking and Pb-free package options. • • • Refer to the CoolRunner -II family data sheet for architecture description.


    Original     		PDF XC2C64 DS092 XC2C64A, 44-pin 56-ball 100-pinV VQ100 XC2C64A

    Untitled

    Abstract: No abstract text available
    Text: R DS091 v3.0 November 30, 2005 XC2C32 CoolRunner-II CPLD Note: This product is being discontinued. You cannot order this part after April 24, 2006. Xilinx recommends replacing the XC2C32 device with the XC2C32A device in all designs as soon as possible. The XC2C32A device is


    Original     		PDF XC2C32 DS091 XC2C32A XCN05017 32-macrocell

    XC2C

    Abstract: No abstract text available
    Text: R DS310 v1.6 March 7, 2005 XC2C32A CoolRunner-II CPLD Advance Product Specification Features Description • The CoolRunner-II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF XC2C32A DS310 32-land 44-pin 56-ball IEEE1149 tSLEW25, tSLEW33 XC2C

    xc2c64a package being vq44

    Abstract: XC2C64A-4VQ44C XC2C64A-7QFG48I XC2C64A-7VQG100I XC2C64A-7VQG44C XC2C64A XC2C64A-4CP56C K8/50 VQ44 xc2c64a 7cp56i
    Text: R DS311 v1.1 August 30, 2004 XC2C64A CoolRunner-II CPLD Advance Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF DS311 XC2C64A 64-macrocell VQ100 xc2c64a package being vq44 XC2C64A-4VQ44C XC2C64A-7QFG48I XC2C64A-7VQG100I XC2C64A-7VQG44C XC2C64A-4CP56C K8/50 VQ44 xc2c64a 7cp56i

    Lead Free reflow soldering profile BGA

    Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
    Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160

    XC2C64A-7VQ100C

    Abstract: XC2C64A XC2C64A-7QFG48I DS092 LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XC2C64A-7VQG100C
    Text: XC2C64A CoolRunner-II CPLD R DS311 v2.2 March 8, 2007 Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		PDF XC2C64A DS311 64-macrocell TIN25, OUT25, TIN33, OUT33. LVCMOS18; LVCMOS33. XC2C64A-7VQ100C XC2C64A-7QFG48I DS092 LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XC2C64A-7VQG100C

    Untitled

    Abstract: No abstract text available
    Text: R DS092 v2.0 January 30, 2005 XC2C64 CoolRunner-II CPLD Note: This product is no longer recommended for new designs. It has been superseded by the XC2C64A, a device with I/O Banking and Pb-free package options. • • • Refer to the CoolRunner -II family data sheet for architecture description.


    Original     		PDF DS092 XC2C64 XC2C64A, 44-pin VQ100 XC2C64A