sumitomo epoxy
Abstract: C7025 Compound c7025 heraeus 4851025 SUMITOMO 7351 140C 8361H JESD22 CF-2071 sumitomo
Text: Cypress Semiconductor Qualification Report QTP# 99302 VERSION 1.0 November, 1999 32L Small Thin Small Outline Package Sumitomo 7351 Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
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7351LS
C7025
85C/85%
CY62128V-ZAIB
sumitomo epoxy
C7025
Compound c7025
heraeus
4851025
SUMITOMO 7351
140C
8361H
JESD22
CF-2071 sumitomo
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ABLEBOND
Abstract: No abstract text available
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086L,
JESD78,
ABLEBOND
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077L,
JESD78,
G700K
Nitto MP8000
Sumitomo G600
Sumitomo G700K
JESD78
sumitomo 6600h
Compound c7025
JESD-78
BCB4026
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077,
JESD78,
Sumitomo G700K
sumitomo 6600h
Compound c7025
JESD22-B101
Nitto MP8000
G700K
SUMITOMO-G600
epoxy 8290
ablebond ablestik 8290
SUMITOMO g600 UL
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086,
JESD78,
Nitto MP8000
Sumitomo G700K
g700k
JESD78
JESD-78
sumitomo 6600h
ablebond ablestik
BCB4026
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Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1094L,
JESD78,
Sumitomo G700K
SUMITOMO g600
Ablestik 84-1
sumitomo 6600h
G700K
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sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com
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DS1685,
LMISR4
J-STD20A
J-STD-20A
ablebond
copper bond wire
copper bond wire amkor
ti 9841
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JESD78
Abstract: Sumitomo 6730B Compound c7025 RH-1750
Text: 05/04/2004 RELIABILITY REPORT FOR DS2770, Rev A4 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS2770,
reliabilit50C
JESD78
Sumitomo 6730B
Compound c7025
RH-1750
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QMI519
Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
Text: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
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epax02
Ext686
MM74HCT00MTCX
MM74HCT05MTC
MM74HCT08MTCX
MM74HCT14MTC
MM74HCT240MTCX
QMI519
KEG3000D
QMI-519
ra3906
GR828FC
Kyocera mold compound
Hitachi Datecode
KE-G300
KE-G3000
Henkel
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS80C310,
JESD78,
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7320CR
Abstract: Eftec 64t
Text: 03/06/2003 RELIABILITY REPORT FOR DS21552, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS21552,
JESD78,
7320CR
Eftec 64t
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tanaka wire
Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL
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G9911-05
KMC184
KMC184VA
EME-6730
EME-9730
Mil-Std-883,
tanaka wire
MAC-3070
shinetsu
tanaka au wire
EME-6730UC
Ablestik
KMC-184
g991
tanaka wire 10 mils
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ALLOY leadframe C7025 material property
Abstract: smd code marking 56L 20L SMD SOT-23 9l marking sot23 ALLOY leadframe C7025 lead frame cu C194 marking code 56l 100L C194 C7025
Text: A Structured Approach To Lead-Free IC Assembly Transitioning L. Nguyen, R. Walberg, Z. Lin*, T. Koh*, YY Bong*, MC Chua*, S. Chuah*, JJ Yeoh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore
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J-STD-020
Abstract: S0309
Text: 08/02/2004 RELIABILITY REPORT FOR DS1267, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1267,
J-STD-020
S0309
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9936
Abstract: 9938 BPSG Ablebond 84-1 LMISR4 9626 Transistors mark 9936 b
Text: 11/05/2003 RELIABILITY REPORT FOR DS1780, Rev A4, 24 TSSOP 4.4mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292
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DS1780,
9936
9938
BPSG
Ablebond 84-1 LMISR4
9626
Transistors mark
9936 b
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9936
Abstract: 9936 b EFTEC 64T Epoxy
Text: 12/04/2002 RELIABILITY REPORT FOR DS21Q42 & DS21Q44 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS21Q42
DS21Q44
30C/60%
9936
9936 b
EFTEC 64T Epoxy
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Ablestik 84-1
Abstract: KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester
Text: TM Fairchild Semiconductor Salt Lake 3333 West 9000 South West Jordan, UT 84088-8838 Fax: 1.801.562.7500 CS100HEE MICROWIRE INTERFACE EEPROM QUALIFICATION PACKAGE 1.0um CMOS technology Advanced Semiconductor Manufacturing Corp. of Shanghai Product: .Serial EEPROM
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CS100HEE
CS100HEE
200mA
200mA)
200mA
FM93C46EA
FM93C56CA
FM93C66BA
FM93C86AA
FM93CS46AA
Ablestik 84-1
KMC-184
sumitomo epoxy
olin 7025
Sumitomo 7351T
eme6600cs
SUMITOMO EME6600cs
74std
kmc184-7
megatest tester
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CDA 194
Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Text: Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.
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D2863-77,
CDA 194
jedec mo-142 footprint
jedec ms-024
D2863-77
leadframe C7025
ALJ- 1300
footprint WSON
leadframe Cu C7025
MO-052
MO-108
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FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
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ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
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AN-772
Abstract: EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp
Text: AN-772 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com A Design and Manufacturing Guide for the Lead Frame Chip Scale Package LFCSP by Gary Griffin Table of Contents
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AN-772
EM-2000-011)
TM-00-11)
AN05425
AN-772
EM-99
C7025
IPC-SM-782
JESD51-5
MO220
MO-220
MO229
tssop 16 exposed pad stencil
20-lead lfcsp
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ph44
Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark
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G9911-04
Mil-Std-883,
S-7390)
S-7383
ph44
Tanaka GL2
tanaka wire
Ablebond 8340
tanaka au wire
tanaka epoxy
Compound c7025
Ablebond
tanaka
C7025
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Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
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D-93009
F-38019
Infineon diffusion solder
Cu6Sn5
C1870
equivalent transistor of C1870
Olin-194
C70250
C19400
C14415
OLIN194
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10190N
Abstract: tsmc Activation Energy
Text: Cypress Semiconductor Technology Qualification Report QTP# 99285 VERSION 1.3 July, 2000 L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor L28-TSMC Technology in TSMC-2A
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L28-TSMC
CY2280
CY2280PVC
100-MHz
CY2280-OC
85C/85
10190N
tsmc Activation Energy
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