Untitled
Abstract: No abstract text available
Text: AMPMODU Interconnection System Short Point Crimp Snap-In Receptacle Contacts Material and Finish .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp
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C7025,
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567297-2
Abstract: No abstract text available
Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A — Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin in crimp
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C7025,
567297-2
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104480-9 crimp tool
Abstract: No abstract text available
Text: AMPMODU Interconnection System Interchangeable Contacts, Wire Crimp Snap-In Material and Finish: Short Point Receptacles .068 [1.73] Copper alloy C7025, plated as follows: Plating A—Duplex plated .000030 [0.00076] min. gold on contact area, .000050 [0.00127] min. tin-lead in
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C7025,
104480-9 crimp tool
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TM 1222
Abstract: 1092-HTA m9625 quick disconnect terminal 4na11 M6112 1262TH st 6062 tape IPC-4-45 IPC-4-45T
Text: Part Number Cross Reference Part Number 7/16 632 BET SC 7/16 SEMS SCREW 348 731 792 798 834 835 836 / 836-TAPE 892 893 894 895 901 906 926 927 928-No Screw 928 934 ST.S 934 ST. SC 934 MSS 948 949 953 953-MOD 956 / 956-No Hole 957 972 972-TAB 983 984 990 1021
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836-TAPE
928-No
953-MOD
956-No
972-TAB
Termina15
TM 1222
1092-HTA
m9625
quick disconnect terminal
4na11
M6112
1262TH
st 6062 tape
IPC-4-45
IPC-4-45T
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Untitled
Abstract: No abstract text available
Text: 104480-4 Product Details - TE Page 1 of 2 TE Connectivity My Cart | Have a Question? What can we help you find? Chat with a Product Information Specialist Products Industries Resources About TE Support Center 104480-4 Product Details Active Print Email Check Pricing & Availability
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com/catalog/pn/en/104480-4
13-Jun-2012
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Untitled
Abstract: No abstract text available
Text: AMPMODU Interconnection System Short Point, Crimp Snap-In Wire-Applied Contacts and Housings Product Facts • Short point of contact mates with .169 [4.29] to .259 [6.58] long post ■ Double-row housings are end-to-end and side-to-side stackable ■ Terminates 32-20 AWG
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FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
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ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
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AN-772
Abstract: EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp
Text: AN-772 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com A Design and Manufacturing Guide for the Lead Frame Chip Scale Package LFCSP by Gary Griffin Table of Contents
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AN-772
EM-2000-011)
TM-00-11)
AN05425
AN-772
EM-99
C7025
IPC-SM-782
JESD51-5
MO220
MO-220
MO229
tssop 16 exposed pad stencil
20-lead lfcsp
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ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
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D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
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Tyco 108-25007
Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
Text: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold
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schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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C7025 strip specification
Abstract: 103960-1 tyco 108-25034 1307819 103672-3 103673-3 104480-9 crimp tool amp 20 pin shrouded header latches amp tyco applicator AMP Application Specification 114-25026
Text: Catalog 1307612 Revised 7-01 Product Facts • Receptacle assemblies mate with .025 [0.64] sq. posts; mating post length is .200 [5.08] min., .250 [6.35] max. ■ Proven AMPMODU receptacle contact design; dual cantilever beams, built-in antioverstress, completely
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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MO-83-AF
Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Text: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
MO-83-AF
PQFP moisture sensitive handling and packaging
footprint jedec MS-026 TQFP
schematic impulse sealer
BGA 11x11 junction to board thermal resistance
EIA standards 481
JEDEC MS-026 footprint
eftec 64
EFTEC-64
footprint jedec MS-026 TQFP 128
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PCB footprint cqfp 132
Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Text: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
PCB footprint cqfp 132
schematic impulse sealer
xc4010e-pq208
footprint pga 84
TSOP 54 PIN footprint 14mm x 20 mm
.65mm bga land pattern
QFP PACKAGE thermal resistance die down
XC4013E-PQ240
XC7272A
XC7318
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Text: Packages and Thermal Characteristics June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
JEDEC Package Code MS-026-AED
BGA 11x11 junction to board thermal resistance
QFP Package 128 lead .5mm
.65mm bga land pattern
MS-026-BGA
Shipping Trays 16x16
XC4010E-PQ208
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N20X DIODE
Abstract: A35355 TA8923 ta8872 ta8903 TA8782 ta7833 transistor 123 TA7811 ta8825
Text: Reliability Update Table of Contents Overview . 1 Organization of the Update . 1
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100LPQFP
160LPQFP
28LSOIC
N20X DIODE
A35355
TA8923
ta8872
ta8903
TA8782
ta7833
transistor 123
TA7811
ta8825
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
TSOP 86 land pattern
BAV 235
BGA and QFP Package
xc4010e-pq208
leadframe C7025
QFP PACKAGE thermal resistance
CB228
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567297-2
Abstract: No abstract text available
Text: Catalog 1307612 MTE Interconnection System Revised 7-01 In te rc h an g e ab le C o n tacts, W ire C rim p S nap -In Material and Finish: Short Point Receptacles .068 Copper alloy C7025, plated as follows: Plating A— Duplex plated .000030 [0.00076] min. gold on contact area,
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C7025,
567297-2
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Untitled
Abstract: No abstract text available
Text: 1 , 5 t ° 05 s^g 0.3 3.3to 1 9.0 CIRCUIT DIAGRAM _r | (|) tu . to co ^ © © d) HOLE LAYOUT, TOP VIEW ^ 0 05 I 6x 00.9 C: COMMON PIN Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:
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300mA,
70mOhm
50/60Hz,
200gf
C7025,
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Untitled
Abstract: No abstract text available
Text: 9.0 _r “L CO CO 1 = _ !_ _ = [ o ,1 .5 T csi oo +1 LO 3 ^ CO CO / ,0 .8 P.C.B. LAND DIMENSION Viewed from the switch mounting face CIRCUIT DIAGRAM C Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength:
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70mOhm
50/60HZ,
/-150gf
C7025,
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Untitled
Abstract: No abstract text available
Text: Catalog 296642 Focused Product Guide ampm odu .025 [0 .64] Revised 7-98 Printed Circuit Board Connectors Continued Interconnection System - Mod. IV Wire-Applied Housings, Double-Row,
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C7025,
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Untitled
Abstract: No abstract text available
Text: 9.0 HOLE LAYOUT 0.05 TOP VIEW 6x 0 O.9 r 1.5 t 0 . 05 -x.y -x 2.5 b . 2.5 a 2.0 LO 0.3 L 3.3 . CIRCUIT DIAGRAM Vr// -q C: COMMON PIN 0.25 Specifications: Contact rating: Contact resistance: Insulation resistance: Dielectric strength: Operating temperature:
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70mOhm
50/60HZ,
/-100gf
C7025,
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104480-9
Abstract: 567297-2
Text: AMPMODU .100 [2.54] Centerline Wire-to-Board Receptacles Catalog 1307612 Revised 7-01 Short Point Crimp Snap-In Receptacle Contacts Material and Finish: .068 [1.73] .060 [1.52] .460 [11.68] rv n . I t — Related Product Data: Performance Characteristics—
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C7025,
104480-9
567297-2
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