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    BGA225

    Abstract: MS-034
    Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA225: plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm SOT648-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C R P e N M L K J H G F E D C


    Original     		BGA225: OT648-1 MS-034 ED-7311-9A BGA225 MS-034 PDF

    BGA225

    Abstract: MO-151 sot648
    Text: PDF: 2000 Sep 21 Philips Semiconductors Package outline BGA225: plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm SOT648-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e y y1 C ∅w M v M A R P N e M L K J e1 H G F E


    Original     		BGA225: OT648-1 MO-151 BGA225 MO-151 sot648 PDF