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    BGA SOLDER BALL SHEAR Search Results

    BGA SOLDER BALL SHEAR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    BGA SOLDER BALL SHEAR Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BGA Solder Ball compressive force

    Abstract: bga solder ball shear
    Text: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA


    Original     		10067807-101LF 10076728-101LF 10067811-101LF ELXAIRMXBGA0109ELT BGA Solder Ball compressive force bga solder ball shear PDF

    AM2 socket bga

    Abstract: Socket AM2 Design Specification bga solder ball shear am2 specification am2 socket specification foxconn
    Text: SPECIFICATIONS BGA 940 AM2 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 940 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 25 mΩ max.


    Original     		13kgf 750gf 240gf 1000m 31X31 AM2 socket bga Socket AM2 Design Specification bga solder ball shear am2 specification am2 socket specification foxconn PDF

    socket 939

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 939 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”]Pitch 939 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 20 mΩ max.


    Original     		13kgf 750gf 240gf 1000m Type50 31X31 socket 939 foxconn PDF

    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 DT BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF

    500gf

    Abstract: BGA package tray 40 x 40 foxconn
    Text: SPECIFICATIONS BGA 959 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 959 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 500gf min. Electrical Contact Resistance : 25 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 500gf 1000m 959Pos. 32X32 BGA package tray 40 x 40 foxconn PDF

    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF

    BGA754

    Abstract: Solder ball shear bga solder ball shear foxconn
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754PoV-0 754Pos. 29X29 BGA754 Solder ball shear bga solder ball shear foxconn PDF

    bga solder ball shear

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos 754Pos. 29X29 bga solder ball shear foxconn PDF

    foxconn mPGA478

    Abstract: MPGA478 SOCKET 94-V0 MPGA478 SOCKET retention 94V-0 m 94v-0 mPGA478
    Text: SPECIFICATIONS mPGA478 Socket BGA Series CPU Socket Vertical, SMT Type 1.27mm [.050”] Pitch 478 Pos. Mechanical Socket Engagement/Disengagement Force: 4.5Kg max. Durability: 50 Cycles min. Socket Retention Force: 10g min. Solder Ball Shear Force: 500g min.


    Original     		mPGA478 26X26 foxconn mPGA478 MPGA478 SOCKET 94-V0 MPGA478 SOCKET retention 94V-0 m 94v-0 PDF

    AMD socket s1

    Abstract: Foxconn socket amd "socket s1" socket s1 BGA638 638 amd foxconn z638 amd socket s1 mechanical
    Text: SPECIFICATIONS BGA638 Socket BGA Series CPU Socket Vertical, SMT Type 1.27 mm [.05”] Pitch 638 Pos. Mechanical Socket Engagement/Disengagement Force: 3.3Kg max. Durability: 30 Cycles min. Socket Retention Force: 65g/Pos. min. Solder Ball Shear Force: 750g min.


    Original     		BGA638 65g/Pos. 1000M AMD socket s1 Foxconn socket amd "socket s1" socket s1 638 amd foxconn z638 amd socket s1 mechanical PDF

    Solder ball shear

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 Solder ball shear PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 PDF

    BGA754

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max.


    Original     		13kgf 1000gf 1000m 754Pic, 754Pos. BGA754 foxconn PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 PDF

    BGA775

    Abstract: CPU 775 PE0775 foxconn 94V-0 LG
    Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.


    Original     		500gf 12pin/chian) 33X30 15X14 BGA775 CPU 775 PE0775 foxconn 94V-0 LG PDF

    94V-0 LG

    Abstract: socket 775 Foxconn BGA775
    Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.


    Original     		500gf 12pin/chian) 33X30 15X14 94V-0 LG socket 775 Foxconn BGA775 PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS BGA 939 BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05 X.05”] Pitch 939 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. Electrical Contact Resistance : 20 mΩ max.


    Original     		13kgf 750gf 240gf 1000m PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS BGA 700 BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05 X.05”] Pitch 700 Pos. Mechanical Contact Rentention Force: 65gf min. Durability: 50 Cycles min. Solder Ball Shear Force: 500 gf min. Electrical Contact Resistance : 35 mΩ max. Insulation Resistance: 800mΩ min.


    Original     		003-S 700Pos. Sn/Ag/Cu800m PDF

    94v-0 lf

    Abstract: Solder ball shear foxconn cpu socket 940
    Text: SPECIFICATIONS Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 750gf min. Unlatch Force: 240gf min. BGA 940 AM2 T2 BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 940 Pos. Electrical Contact Resistance : 25 mΩ max.


    Original     		13kgf 750gf 240gf 1000m 94v-0 lf Solder ball shear foxconn cpu socket 940 PDF

    foxconn

    Abstract: BGA754
    Text: SPECIFICATIONS BGA 754 DT BG A CPU Socket BG A SM T Type 1.27X1.27mm[.05X. 05”]Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 foxconn BGA754 PDF

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


    Original     		PDF

    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack PDF

    spst reed relay

    Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
    Text: BGA Series BGA SERIES MEDER electronic CRF Series High Frequency Reed Relays CRR Series SPST Reed Relays RM Series 4pol Relay Module RM Series 6pol Relay Module 2 bga.p65 www.meder.com Europa # +49- 0 7733-94870, USA # 800-870-5385 2 22.09.2004, 14:59 MEDER electronic


    Original     		CH-8197 F-91971 CZ-10400 spst reed relay Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile PDF