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    BGA 400 Search Results

    BGA 400 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 400 Price and Stock

    Thomas & Betts BGA400-6-40

    4In Grnd Bush 6-4/0Wire Range Al |Abb Thomas & Betts BGA400-6-40
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark BGA400-6-40 Bulk 1
    • 1 $199.12
    • 10 $184.9
    • 100 $164.11
    • 1000 $164.11
    • 10000 $164.11
    		Buy Now
    Master Electronics BGA400-6-40
    • 1 $142.05
    • 10 $125.32
    • 100 $113.2
    • 1000 $113.2
    • 10000 $113.2
    		Buy Now

    Thomas & Betts BGA400-14-20

    4In Grnd Bush 14-2/0Wire Range Al |Abb Thomas & Betts BGA400-14-20
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark BGA400-14-20 Bulk 1
    • 1 $199.12
    • 10 $184.9
    • 100 $164.11
    • 1000 $164.11
    • 10000 $164.11
    		Buy Now
    Master Electronics BGA400-14-20
    • 1 $142.05
    • 10 $125.32
    • 100 $113.2
    • 1000 $113.2
    • 10000 $113.2
    		Buy Now

    T&B Fittings BGA400-6-40

    Grounding Bushing, 4", Aluminum, Galvanized, Wire Range 6 to 4/0, Black | T&B Fittings by ABB BGA400-6-40
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BGA400-6-40 Bulk 1
    • 1 $202.9
    • 10 $188.7
    • 100 $182.61
    • 1000 $182.61
    • 10000 $182.61
    		Get Quote

    T&B Fittings BGA400-14-20

    Grounding Bushing, 4", Alum., Wire Range 14-2/0Awg, For use w/ Rigid/IMC Condu | T&B Fittings by ABB BGA400-14-20
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BGA400-14-20 Bulk 1
    • 1 $199.12
    • 10 $181.2
    • 100 $181.2
    • 1000 $181.2
    • 10000 $181.2
    		Get Quote

    ABB Group BGA400-6-40

    Thomas & Betts
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Sager BGA400-6-40 1
    • 1 $193.07
    • 10 $182.34
    • 100 $175.05
    • 1000 $175.05
    • 10000 $175.05
    		Buy Now
    Find more BGA 400 price and stock on Findchips.com

    BGA 400 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    reflow soldering profile BGA

    Abstract: reflow temperature bga BGA PROFILING bga rework
    Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already


    Original     		PDF

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    reflow soldering profile BGA

    Abstract: BGA PROFILING solder joint bga warpage bga rework
    Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed


    Original     		PDF

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 2 Gigabit Stacked DDR2 SDRAM DD53E 256Mb x 8 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls


    Original     		PDF DD53E 256Mb 2D256M82U4BA DD53E

    U48B

    Abstract: DDR2 Mechanical Dimensions
    Text: 2 Gigabit Stacked DDR2 SDRAM DD52E 512Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls


    Original     		PDF DD52E 512Mb 2D512M42U4BA DD52E U48B DDR2 Mechanical Dimensions

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


    Original     		PDF BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07

    202P

    Abstract: F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P 202P F202

    202P

    Abstract: F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P 202P F202

    FDZ204P

    Abstract: No abstract text available
    Text: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ204P FDZ204P

    Untitled

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ206P FDZ206P

    DIODE A46

    Abstract: No abstract text available
    Text: FDZ293P P-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ293P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ293P FDZ293P DIODE A46

    FDZ294N

    Abstract: No abstract text available
    Text: FDZ294N N-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ294N minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ294N FDZ294N

    FDZ204P

    Abstract: No abstract text available
    Text: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ204P FDZ204P

    gk 7031

    Abstract: No abstract text available
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		PDF W2637A, W2638A W2639A 5990-3892EN gk 7031

    Untitled

    Abstract: No abstract text available
    Text: FDZ293P P-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ293P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ293P FDZ293P

    Untitled

    Abstract: No abstract text available
    Text: FDZ299P P-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ299P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ299P FDZ299P

    FDZ206P

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ206P FDZ206P

    JEDEC bga case outline

    Abstract: 202P F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P JEDEC bga case outline 202P F202

    FDZ206P

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ206P FDZ206P

    FC-09A

    Abstract: F63TNR FDZ204P FDZ6966
    Text: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ204P FDZ204P FC-09A F63TNR FDZ6966

    FDZ27296

    Abstract: FDZ7296
    Text: FDZ7296 30V N-Channel PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced PowerTrench process with state-of-the-art BGA packaging, the FDZ7296 minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		PDF FDZ7296 FDZ27296 FDZ7296

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 15X15