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    FDZ202P Price and Stock

    onsemi FDZ202P

    MOSFET P-CH 20V 5.5A 12BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FDZ202P Reel
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    Rochester Electronics LLC FDZ202P

    MOSFET P-CH 20V 5.5A 12BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FDZ202P Bulk 1,025
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    Fairchild Semiconductor Corporation FDZ202P

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics FDZ202P 1,962
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    Quest Components FDZ202P 2,529
    • 1 $0.5658
    • 10 $0.5658
    • 100 $0.5658
    • 1000 $0.2358
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    FDZ202P 1,569
    • 1 $0.943
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    • 100 $0.943
    • 1000 $0.3772
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    Rochester Electronics FDZ202P 155,615 1
    • 1 $0.2958
    • 10 $0.2958
    • 100 $0.2781
    • 1000 $0.2514
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    F FDZ202P

    5.5 A, 20 V, 0.045 ohm, P-CHANNEL, Si, POWER, MOSFET
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components FDZ202P 2,400
    • 1 $0.943
    • 10 $0.943
    • 100 $0.943
    • 1000 $0.3772
    • 10000 $0.3301
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    FDZ202P Datasheets (5)

    Part ECAD Model Manufacturer Description Curated Type PDF
    FDZ202P Fairchild Semiconductor P-Channel 2.5 V Specified PowerTrench BGA MOSFET Original PDF
    FDZ202P Fairchild Semiconductor P-Channel 2.5V Specified PowerTrench BGA MOSFET Original PDF
    FDZ202P Fairchild Semiconductor P-Channel 2.5V Specified PowerTrench BGA MOSFET Original PDF
    FDZ202P Fairchild Semiconductor P-Channel 2.5V Specified PowerTrench BGA MOSFET Original PDF
    FDZ202P Fairchild Semiconductor P-Channel 2.5V Specified PowerTrench BGA MOSFET Scan PDF

    FDZ202P Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    F202

    Abstract: FDZ202P F-202 AF202
    Text: FDZ202P P-Channel 2.5V Specified PowerTrenchTM BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P F202 F-202 AF202

    202P

    Abstract: F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P 202P F202

    202P

    Abstract: F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P 202P F202

    Untitled

    Abstract: No abstract text available
    Text: FDZ202P P-Channel 2.5V Specified PowerTrenchTM BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P

    202P

    Abstract: F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P 202P F202

    202P

    Abstract: F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P 202P F202

    JEDEC bga case outline

    Abstract: 202P F202 FDZ202P
    Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		PDF FDZ202P FDZ202P JEDEC bga case outline 202P F202

    FDC6331

    Abstract: fdp047an FDB045AN FQPF10N20 FQA70N15 FQPF*13N06L fdd5614p fqp50n06 TO252-DPAK FDC6305
    Text: Discrete Temperature range Software version Revision date 2N7002 SOT-23-3 Electrical/Thermal 25°C to 125°C N/A N/A 2N7002MTF SOT-23-3 Electrical/Thermal 25°C to 125°C N/A N/A BS170 TO-92-3 Electrical 25°C to 125°C Orcad 9.1 Mar 22, 2002 BSS123 SOT-23-3


    Original     		PDF 2N7002 2N7002MTF BS170 BSS123 BSS138 BSS84 FDB045AN08A0 FDB2532 FDB3632 FDB3652 FDC6331 fdp047an FDB045AN FQPF10N20 FQA70N15 FQPF*13N06L fdd5614p fqp50n06 TO252-DPAK FDC6305

    thermistor KSD201

    Abstract: IRF power mosfets catalog Complementary MOSFETs buz11 BZX85C6V8 SPICE MODEL Diode 1N4001 50V 1.0A DO-41 Rectifier Diode K*D1691 make SMPS inverter welding machine transistor KSP44 1N5402 spice model tip122 tip127 mosfet audio amp
    Text: Fairchild Semiconductor Product Catalog 2004 Microcontrollers Optoelectronics Across the board. Around the world. Analog Discrete Interface & Logic Interface & Logic Discrete Power Optoelectronics Analog & Mixed Signal Fairchild Semiconductor, The Power Franchise™


    Original     		PDF

    FLMP SuperSOT-6

    Abstract: Complementary MOSFETs buz11 FQD7P20 FDG6316 IRF650 FQP65N06 IRFS630 FDG329N FDP2532 fqpf6n80
    Text: 2003 Analog Discrete Interface & Logic Optoelectronics Power MOSFET Selection Guide Across the board. Around the world. Power MOSFET Selection Guide 2003 Table of Contents Product page BGA N-Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1


    Original     		PDF SC70-6 SC75-6 SuperSOTTM-3/SOT-23 Power247TM, FLMP SuperSOT-6 Complementary MOSFETs buz11 FQD7P20 FDG6316 IRF650 FQP65N06 IRFS630 FDG329N FDP2532 fqpf6n80

    FQPF*7N65C APPLICATIONS

    Abstract: bc548 spice model bf494 spice model spice model bf199 LM3171 BC517 spice model bc547 spice model BF494 spice MOC3043-M spice model SPICE model BC237
    Text: Fairchild PSG.book Page i Wednesday, July 28, 2004 11:12 AM Fairchild Semiconductor Product Catalog Rev. 1 Analog & Mixed Signal Discrete Power Interface & Logic Microcontrollers Optoelectronics RF Power Front Matter.fm Page ii Monday, August 2, 2004 10:09 AM


    Original     		PDF UF4003. UF4004. UF4005. UF4006. UF4007. USB10H. USB1T1102 USB1T11A. vKA75420M W005G FQPF*7N65C APPLICATIONS bc548 spice model bf494 spice model spice model bf199 LM3171 BC517 spice model bc547 spice model BF494 spice MOC3043-M spice model SPICE model BC237

    Loctite 3567

    Abstract: underfill Kester FDZ202P fbga Substrate design guidelines reflow hot air BGA fine BGA thermal profile reball INTEL underfill SMT
    Text: Application Note 7001 March 2002 Guidelines for Mounting Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling capability, ultra-low profile


    Original     		PDF

    MC0628R

    Abstract: mc0628 MC0628R replacement FAIRCHILD SEMICONDUCTOR Fairchild cross KA3846 FDD8896 "drop-in replacement" FQPF3N60C FQP50N06 equivalent FDS8884
    Text: Discontinued Product s 4296_ST42091 5092_F50188E 5FS1_NB5F009 73282 74ABT646CMSA 74ABT646CMSAX 74ABT646CMTC 74ABT646CSC 74AC251SJ 74AC299SJX 74AC74CW 74ACT151SJ 74ACT16646SSC 74ACTQ08SJX Replacement Product(s) NONE NONE FDS3580 None 74ABT646ADB 74ABT646ADB


    Original     		PDF ST42091 F50188E NB5F009 74ABT646CMSA 74ABT646CMSAX 74ABT646CMTC 74ABT646CSC 74AC251SJ 74AC299SJX 74AC74CW MC0628R mc0628 MC0628R replacement FAIRCHILD SEMICONDUCTOR Fairchild cross KA3846 FDD8896 "drop-in replacement" FQPF3N60C FQP50N06 equivalent FDS8884

    Quasi-resonant Converter for induction cooker

    Abstract: IGBT 60A spice model 1000V igbt dc to dc buck converter CAR IGNITION WITH IGBTS 10 kw schematic induction heating Quasi-resonant Converter induction cooker applications FQPF18N50 1 kw schematic induction heating 600V igbt dc to dc buck converter pwm igbt based ac-dc converter
    Text: The Power Franchise Summer - 2002 FEATURED IN THIS ISSUE 1200V Stealth fast/soft recovery avalanche energy rated diodes . . . Page 4 Trench MOSFETs for 42V automotive applications . . . Page 5 Bottomless SO-8 Package PowerTrench family . . . Page 6 .And More! . . . Page 7 and 8


    Original     		PDF Semiconducto01 Quasi-resonant Converter for induction cooker IGBT 60A spice model 1000V igbt dc to dc buck converter CAR IGNITION WITH IGBTS 10 kw schematic induction heating Quasi-resonant Converter induction cooker applications FQPF18N50 1 kw schematic induction heating 600V igbt dc to dc buck converter pwm igbt based ac-dc converter

    MC0628R

    Abstract: 40373 74hc14n equivalent 4046 application note philips HCF4060BE HCF4017BE SN74121 application note MC74HC373DW mc0628 HCF4053BE
    Text: R E L I A B L E . L O G I C . I N N O V A T I O N . Logic Cross-Reference Logic Cross-Reference 2003 Texas Instruments Printed in the U.S.A. by Texoma Business Forms, Durant, Oklahoma Printed on recycled paper. SCYB017A NEW First Revision Logic Cross-Reference


    Original     		PDF SCYB017A T74ALVC32374 74CBTLV16211 SN74CBTD16211 SN74SSTV16859 SN74CBTLV16211GRDR SN74ALVC16245AGRDR -SN74SSTV16859GKER MC0628R 40373 74hc14n equivalent 4046 application note philips HCF4060BE HCF4017BE SN74121 application note MC74HC373DW mc0628 HCF4053BE

    thermistor KSD201

    Abstract: pin configuration NPN transistor BC548 pin configuration transistor BC547 smd packaging FQPF*7N65C APPLICATIONS BC547 sot package sot-23 pin configuration pnp smd transistor BC557 DIODE 1N4148 LL-34 pin configuration NPN transistor BC547 BC557 sot-23 BC547 smd
    Text: Fairchild PSG.book Page i Wednesday, July 28, 2004 11:12 AM Fairchild Semiconductor Product Catalog Rev. 1 Analog & Mixed Signal Discrete Power Interface & Logic Microcontrollers Optoelectronics RF Power Front Matter.fm Page ii Monday, August 2, 2004 10:09 AM


    Original     		PDF TS-16949 ISO-14001, thermistor KSD201 pin configuration NPN transistor BC548 pin configuration transistor BC547 smd packaging FQPF*7N65C APPLICATIONS BC547 sot package sot-23 pin configuration pnp smd transistor BC557 DIODE 1N4148 LL-34 pin configuration NPN transistor BC547 BC557 sot-23 BC547 smd

    bz71

    Abstract: BZ5.2 AZ51 FDZ201N FDZ204P FDZ206P FDZ209N FDZ2551N FDZ2553NZ Fairchild wafer fab
    Text: Date Created: 4/20/2004 Date Issued: 5/10/2004 PCN # 20040502-A DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


    Original     		PDF 0040502-A 300um 200um FDZ201N FDZ204P FDZ209N FDZ2551N FDZ2553NZ FDZ2555NZ FDZ3547N bz71 BZ5.2 AZ51 FDZ201N FDZ204P FDZ206P FDZ209N FDZ2551N FDZ2553NZ Fairchild wafer fab

    Eftec

    Abstract: FDZ197 FDZ203N FDZ206P FDZ208P FDZ226P FDZ2553N FDZ2554PZ FDZ299P gem 65
    Text: Date Created: 1/29/2004 Date Issued: 3/2/2004 PCN # 20040502 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will


    Original     		PDF 02XD24 FDZ197P FDZ203N FDZ208P FDZ226P FDZ2553N FDZ2554PZ FDZ298N FDZ5047N FDZ201N Eftec FDZ197 FDZ203N FDZ206P FDZ208P FDZ226P FDZ2553N FDZ2554PZ FDZ299P gem 65

    FDZ201N

    Abstract: FDZ202P FDZ204P FDZ206P FDZ209N FDZ2551N FDZ2553N FDZ2553NZ FDZ2554PZ FDZ5047N
    Text: Date Created: 12/30/2003 Date Issued: 2/2/2004 PCN # 20040001 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will


    Original     		PDF FDZ201N FDZ204P FDZ209N FDZ2553N FDZ2554PZ FDZ5047N FDZ202P FDZ206P FDZ2551N FDZ2553NZ FDZ201N FDZ202P FDZ204P FDZ206P FDZ209N FDZ2551N FDZ2553N FDZ2553NZ FDZ2554PZ FDZ5047N

    FDZ201N

    Abstract: FDZ202P FDZ203N FDZ204P FDZ208P FDZ2551N FDZ2552P FDZ2553N FDZ2554P FDZ5047N
    Text: Discrete MOSFET BGA RDS ON Max (Ohms) @ VGS = Products VDS Min. (V) 10V 4.5V 2.5V 1.8V Qg (nC) Typ. @VGS=5V (Note) Config. Maximum Rating ID (A) PD (W) BGA N-Channel 2.0x2.0 mm FDZ203N 20 Single - 0.018 0.03 - 11 7.5 1.6 20 Single - 0.018 0.03 - 11 9 2 FDZ2553N


    Original     		PDF FDZ203N FDZ2553N FDZ2551N FDZ2554P FDZ2552P FDZ208P FDZ206P FDZ201N FDZ7064N FDZ5047N FDZ201N FDZ202P FDZ203N FDZ204P FDZ208P FDZ2551N FDZ2552P FDZ2553N FDZ2554P FDZ5047N

    FQPf10N60C

    Abstract: FQPF*10n20c FQPF10N20C FQP17P06 fqpf6n80 FQP630 equivalent FQU17P06 FQPF*5n50c IRF650 FQA90N08
    Text: Discrete BGA BVDSS Min. V Config. 20 RDS(ON) Max (Ω) @ VGS = 10V 4.5V 2.5V 1.8V Qg Typ. (nC) @VGS = 5V Single – 0.027 0.039 – 7 6 1.7 20 Single – 0.018 0.03 – 11 7.5 1.6 FDZ201N 20 Single – 0.018 0.03 – 11 9 2 FDZ209N 60 Single – 0.08@5V


    Original     		PDF FDZ201N FDZ209N FDZ2553N FDZ2553NZ FDZ2551N FDZ7064N SFF9140 FQAF47P06 SSF10N60B SSF7N60B FQPf10N60C FQPF*10n20c FQPF10N20C FQP17P06 fqpf6n80 FQP630 equivalent FQU17P06 FQPF*5n50c IRF650 FQA90N08

    underfill

    Abstract: rework reflow hot air BGA Loctite PCB design for very fine pitch csp package thick bga die size Loctite 3567 Intel BGA Solder FDZ202P Fairchild, BGA fbga Substrate design guidelines
    Text: Application Note 7001 March 2004 Guidelines for Using Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling


    Original     		PDF

    F202

    Abstract: FDZ202P
    Text: November 1999 ADVANCE INFORMATION FAIRCHILD S E M IC O N D U C T O R tm FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space


    OCR Scan     		PDF FDZ202P FDZ202P 300ns, F202

    Untitled

    Abstract: No abstract text available
    Text: S E M IC O N D U C T O R tm FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space


    OCR Scan     		PDF FDZ202P FDZ202P 300ps, 30RECOMMENDED