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    BGA 31X31 PCB DRAWING Search Results

    BGA 31X31 PCB DRAWING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 31X31 PCB DRAWING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SF-BGA432B-B-11

    Abstract: 31X31 BGA 31X31 PCB DRAWING BGA432
    Text: D Package Code: BGA432B C See BGA pattern code to the right for actual pattern layout Y 0.025" dia. pad .0225 dia. tooling holes X2 non plated (optional) 38.1mm X 1.27mm [0.050"] Top View (reference only) 2 9.119mm 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA432B 119mm 169mm FR4/G10 SF-BGA432B-B-11 31X31 BGA 31X31 PCB DRAWING BGA432

    LS-BGA520A-31

    Abstract: No abstract text available
    Text: Top View 0.95mm [0.037"] 0.95mm [0.037"] 40.00mm [1.575"] 1.27mm typ. 38.10mm [1.500"] Side View 40.00mm [1.575"] 1.68mm [0.066"] 1 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 38.10mm [1.500"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		PDF FR4/G10 31x31 LS-BGA520A-31

    BGA432

    Abstract: LS-BGA432B-31
    Text: Top View 0.95mm [0.037"] 0.95mm [0.037"] 40.00mm [1.575"] 1.27mm typ. 40.00mm [1.575"] Side View 1.68mm [0.066"] 1 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 38.10mm [1.500"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		PDF FR4/G10 31x31 LS-BGA432B-31 BGA432

    bga96

    Abstract: LS-BGA961A-31 BGA 31X31 PCB DRAWING
    Text: Top View 0.95mm [0.037"] 0.95mm [0.037"] 40.00mm [1.575"] 1.27mm typ. 40.00mm [1.575"] Side View 1.68mm [0.066"] 1 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 38.10mm [1.500"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		PDF FR4/G10 31x31 LS-BGA961A-31 bga96 BGA 31X31 PCB DRAWING

    SG-BGA-6205

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 3625mm 025mm 725mm SG-BGA-6205 125mm.

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    SG-BGA-6244

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 37.725mm Ball guide prevents over compression of elastomer


    Original     		PDF 725mm 725mm. 613mm 025mm 225mm SG-BGA-6244 125mm.

    SG-BGA-6121

    Abstract: BGA 31X31 PCB DRAWING
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 3625mm 025mm 725mm SG-BGA-6121 125mm. BGA 31X31 PCB DRAWING

    SG-BGA-6097

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 38.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 8625mm 025mm 725mm SG-BGA-6097 125mm.

    SG-BGA-6039

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45.225mm Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 3625mm 025mm 725mm SG-BGA-6039 SG-MGA-6039 125mm.

    12x12 bga thermal resistance

    Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
    Text: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations


    Original     		PDF UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 12x12 bga thermal resistance XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB

    emmc pcb layout

    Abstract: oled display 96x16 flashpro3 schematic silicon sculptor 3 actel smart fusion fpga JTAG Programmer Schematics microcontroller based temperature control fan avr M1A3PL-DEV-KIT A3PE3000L FG484 96x16
    Text: Product Catalog November 2009 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart from


    Original     		PDF

    tec driver peltier

    Abstract: No abstract text available
    Text: R Chapter 4 PCB Design Considerations Summary This chapter covers the following topics: • • • • • • • • • • Pinout Information Pinout Diagrams Package Specifications Flip-Chip Packages Thermal Data Printed Circuit Board Considerations Board Routability Guidelines


    Original     		PDF FG256 FG456: FF672, FF896, FF1152, FF1517: BF957: FG456 FF672 tec driver peltier

    emmc pcb layout

    Abstract: oled display 96x16 fpga JTAG Programmer Schematics FLASHPRO4 A3PE1500-PQ208 ACTEL flashpro A2F200M3F-FGG484 96x16 oled A2F500 VQ100
    Text: Product Catalog March 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power FPGAs and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart


    Original     		PDF

    on digital code lock using vhdl mini pr

    Abstract: XC2V3000-BG728 ternary content addressable memory VHDL XC2V6000-ff1152 TRANSISTOR 841 toshiba smd marking code transistor land pattern BGA 0,50 XC2V3000-FG676 BT 342 project smd marking code mfw
    Text: Virtex-II Platform FPGA User Guide R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. ASYL, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Spartan, Timing Wizard, TRACE, Virtex, XACT, XILINX, XC2064, XC3090, XC4005, XC5210, and XC-DS501 are registered trademarks of Xilinx, Inc.


    Original     		PDF XC2064, XC3090, XC4005, XC5210, XC-DS501 on digital code lock using vhdl mini pr XC2V3000-BG728 ternary content addressable memory VHDL XC2V6000-ff1152 TRANSISTOR 841 toshiba smd marking code transistor land pattern BGA 0,50 XC2V3000-FG676 BT 342 project smd marking code mfw

    datasheet transistor said horizontal tt 2222

    Abstract: interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out
    Text: Virtex-II Platform FPGA User Guide UG002 v2.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG002 datasheet transistor said horizontal tt 2222 interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out

    DSLAM drawing

    Abstract: DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT
    Text: VORTEX CHIPSET RELEASED DSLAM APPS NOTE PMC-1990816 ISSUE 1 SIGNAL INTEGRITY AND TIMING SIMULATION DSLAM DSLAM APPS NOTE: SIGNAL INTEGRITY AND TIMING SIMULATION FOR THE VORTEX CHIPSET S/UNI-DUPLEX, S/UNI-VORTEX, S/UNI-APEX AND S/UNI-ATLAS Released Issue 1


    Original     		PDF PMC-1990816 DSLAM drawing DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT

    RAM16X8

    Abstract: verilog hdl code for triple modular redundancy 37101 verilog/verilog code for lvds driver xc2v3000fg sot 23-5 marking code H5 BT 342 project xc2v250cs144 XC2V3000FF1152 fpga JTAG Programmer Schematics
    Text: Virtex-II Platform FPGA Handbook R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. The shadow X shown above is a trademark of Xilinx, Inc. "Xilinx" and the Xilinx logo are registered trademarks of Xilinx, Inc. Any rights not expressly granted herein are reserved.


    Original     		PDF XC2064, XC3090, XC4005, XC5210 RAM16X8 verilog hdl code for triple modular redundancy 37101 verilog/verilog code for lvds driver xc2v3000fg sot 23-5 marking code H5 BT 342 project xc2v250cs144 XC2V3000FF1152 fpga JTAG Programmer Schematics

    apple ipad schematic drawing

    Abstract: xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller
    Text: Virtex-II Pro and Virtex-II Pro X FPGA User Guide UG012 v4.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG012 apple ipad schematic drawing xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller

    wireless power transfer using em waves matlab simulink

    Abstract: PCB mounted 230 V relay Virtex-II FF1152 Prototype Board sot 23-5 marking code H5 BT 342 project Chirp modulation ber performance vhdl code for TRAFFIC LIGHT CONTROLLER using stat Motorola diode SMD code B13 xilinx vhdl code for 555 timer MARKING SMD IC CODE 8-pin
    Text: Virtex-II Pro Platform FPGA Handbook UG012 v1.0 January 31, 2002 R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. The shadow X shown above is a trademark of Xilinx, Inc. "Xilinx" and the Xilinx logo are registered trademarks of Xilinx, Inc. Any rights not expressly granted herein are reserved.


    Original     		PDF UG012 XC2064, XC3090, XC4005, XC5210 B-1972 wireless power transfer using em waves matlab simulink PCB mounted 230 V relay Virtex-II FF1152 Prototype Board sot 23-5 marking code H5 BT 342 project Chirp modulation ber performance vhdl code for TRAFFIC LIGHT CONTROLLER using stat Motorola diode SMD code B13 xilinx vhdl code for 555 timer MARKING SMD IC CODE 8-pin

    LE79Q2281

    Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
    Text: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 1 THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF ACTEL. THE INFORMATION. DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PROPRIETARY. SHALL BE MAINTAINED IN STRICT CONFIDENCE, AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS


    OCR Scan     		PDF 329--31x31

    Untitled

    Abstract: No abstract text available
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]


    OCR Scan     		PDF 16X16 17X17

    16X16

    Abstract: bga 576 socket bga 24x24 576
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00


    OCR Scan     		PDF 16X16 C-1640240 bga 576 socket bga 24x24 576