1152 BGA tray
Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
Text: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.
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Original
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FBGA14
117-pin
FBGA14
SSD-A-H7531
1152 BGA tray
tray datasheet bga
jedec bga tray
tray bga
JEDEC tray standard
JEDEC TRAY DIMENSIONS
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PDF
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36AB-180
Abstract: GS842Z18AB-180I GS842Z18A GS842Z36A
Text: Preliminary GS842Z18/36AB-180/166/150/100 119-Bump BGA Commercial Temp Industrial Temp MHz 4Mb Pipelined and Flow Through 180 MHz–100 3.3 V VDD Synchronous NBT SRAMs 2.5 V and 3.3 V VDDQ Features Functional Description • 256K x 18 and 128K x 36 configurations
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Original
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GS842Z18/36AB-180/166/150/100
119-Bump
842Z18A
36AB-180
GS842Z18AB-180I
GS842Z18A
GS842Z36A
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PDF
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dp 104c
Abstract: No abstract text available
Text: GS842Z18/36AB-180/166/150/100 4Mb Pipelined and Flow Through Synchronous NBT SRAMs 119-Bump BGA Commercial Temp Industrial Temp Features 180 MHz–100 MHz 3.3 V VDD 2.5 V and 3.3 V VDDQ Because it is a synchronous device, address, data inputs, and read/ write control inputs are captured on the rising edge of the
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Original
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GS842Z18/36AB-180/166/150/100
119-Bump
842Z18A
dp 104c
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PDF
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B180
Abstract: No abstract text available
Text: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application
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Original
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GS841E18AT/B-180/166/150/130/100
100-lead
119-BGA
GS841E18A
B180
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PDF
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GS841E18A
Abstract: GS841E18AT-180 256k x 18 119bga TS/103/02 B180
Text: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application
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Original
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GS841E18AT/B-180/166/150/130/100
GS841E18A
GS841E18AT-180
256k x 18 119bga
TS/103/02
B180
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PDF
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B180
Abstract: No abstract text available
Text: GS841E18AT/B-180/166/150/130/100 TQFP, BGA Commercial Temp Industrial Temp 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application
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Original
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GS841E18AT/B-180/166/150/130/100
seGS841E18A
GS841E18A
B180
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PDF
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B180
Abstract: GS841E18A GS841E18AT-180
Text: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application
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Original
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GS841E18AT/B-180/166/150/130/100
GS841E18A
B180
GS841E18AT-180
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PDF
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B180
Abstract: No abstract text available
Text: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application
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Original
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GS841E18AT/B-180/166/150/130/100
100-lead
119-BGA
GS841E18A
B180
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PDF
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Untitled
Abstract: No abstract text available
Text: GS76024AB BGA Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 24 6Mb Asynchronous SRAM Features 119-bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation: 260/210/180 mA at minimum cycle time
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Original
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GS76024AB
119-bump
119-bump,
GS76024A
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PDF
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tray datasheet bga
Abstract: tray bga
Text: 180°C MAX NX BG1422 2.0 0712 8 REV.A A' 18.40 12.75 A 14.2 110.4 135.9 UNIT : mm 22.2 24.40 268.4 23.30 315.0 322.6 SECTION A – A' 5.52 (6.35) 7.62 22.2 Applied Package Quantity (pcs) 119-pin Plastic BGA (14x22) MAX. 84 Tray Material NX BG1422 2.0 Carbon PES
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Original
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BG1422
119-pin
tray datasheet bga
tray bga
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PDF
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GS76024AB-12
Abstract: GS76024AB-8I 76024A
Text: GS76024AB BGA Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 24 6Mb Asynchronous SRAM Features 119-bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation: 260/210/180 mA at minimum cycle time
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Original
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GS76024AB
119-bump,
119-bump
GS76024A
GS76024AB-12
GS76024AB-8I
76024A
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PDF
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GS76024A
Abstract: GS76024AB
Text: GS76024AB BGA Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 24 6Mb Asynchronous SRAM Features 119-bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation: 260/210/180 mA at minimum cycle time
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Original
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GS76024AB
119-bump
119-bump,
GS76024A
TTLcompa/2005
GS76024AB
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PDF
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tray datasheet bga
Abstract: No abstract text available
Text: UNIT : mm A' 29.26 180°C MAX TBGA 29 x 29 × 1.7mm 31.40 20.85 29.26 31.60 31.10 252.8 315.0 322.6 SECTION A – A' 29.26 5.82 7.62 6.35 135.9 94.2 A Applied Package 272-pin • Plastic BGA ( Quantity (pcs) 29) MAX. 36 Tray Material Heat Proof Temp. Surface resistance
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Original
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272-pin
tray datasheet bga
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PDF
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Untitled
Abstract: No abstract text available
Text: Preliminary GS840H18/32/36AT/B-200/180/166 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.
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Original
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GS840H18/32/36AT/B-200/180/166
poH18/32/36A1
GS840H18/32/36A1
2000G
032/2000G;
840H18A
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PDF
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GS840E18A
Abstract: GS840E32A GS840E36A
Text: Preliminary GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation
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Original
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GS840E18/32/36AT/B-190/180/166/150/100
840E18A
GS840E18A
GS840E32A
GS840E36A
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PDF
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GS840E18A
Abstract: GS840E32A GS840E36A B180
Text: Preliminary GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation
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Original
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GS840E18/32/36AT/B-180/166/150/100
100-lea
840E18A
GS840E18A
GS840E32A
GS840E36A
B180
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PDF
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GS840E18A
Abstract: GS840E32A GS840E36A
Text: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation
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Original
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GS840E18/32/36AT/B-200/180/166/150/100
100table,
840E18A
GS840E18A
GS840E32A
GS840E36A
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PDF
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GS84018A
Abstract: GS84018AT-190 GS84032A GS84036A
Text: Preliminary GS84018/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation
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Original
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GS84018/32/36AT/B-190/180/166/150/100
10018A
84018A
GS84018A
GS84018AT-190
GS84032A
GS84036A
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PDF
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Untitled
Abstract: No abstract text available
Text: Preliminary GS840H18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipeline operation • Single Cycle Deselect SCD Operation
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Original
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GS840H18/32/36AT/B-200/180/166/150/100
Automatic32/36A1
2000G;
840H18A
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PDF
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Untitled
Abstract: No abstract text available
Text: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation
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Original
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GS840E18/32/36AT/B-200/180/166/150/100
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PDF
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GS840H18A
Abstract: GS840H32A GS840H36A
Text: Preliminary GS840H18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipeline operation • Single Cycle Deselect SCD Operation
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Original
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GS840H18/32/36AT/B-200/180/166/150/100
840H18A
840E18
GS840H18A
GS840H32A
GS840H36A
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PDF
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Untitled
Abstract: No abstract text available
Text: Preliminary GS88418/36B-200/180/166 512K x 18, 256K x 36 8Mb S/DCD Sync Burst SRAMs 119-Bump BGA Commercial Temp Industrial Temp Features LBO input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance.
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Original
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GS88418/36B-200/180/166
119-Bump
x18/x36
512Komply
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PDF
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GS842Z18A
Abstract: GS842Z36A
Text: Preliminary GS842Z18/36AB-200/180/166/150/100 119-Bump BGA Commercial Temp Industrial Temp MHz 4Mb Pipelined and Flow Through 200 MHz–100 3.3 V VDD Synchronous NBT SRAMs 2.5 V and 3.3 V VDDQ Features Functional Description • 256K x 18 and 128K x 36 configurations
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Original
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GS842Z18/36AB-200/180/166/150/100
119-Bump
842Z18A
GS842Z18A
GS842Z36A
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PDF
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180I
Abstract: GS842Z18A GS842Z18AB-166 GS842Z18AB-180 GS842Z36A
Text: GS842Z18/36AB-180/166/150/100 119-Bump BGA Commercial Temp Industrial Temp 4Mb Pipelined and Flow Through Synchronous NBT SRAMs Features • 256K x 18 and 128K x 36 configurations • User configurable Pipeline and Flow Through mode • NBT No Bus Turn Around functionality allows zero wait
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Original
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GS842Z18/36AB-180/166/150/100
119-Bump
842Z18A
180I
GS842Z18A
GS842Z18AB-166
GS842Z18AB-180
GS842Z36A
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PDF
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