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    Amphenol Aerospace 348-40E18-85P6

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    Amphenol Aerospace 348-40E18-85S1

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    840E18 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    840E18A GIGA Synchronous Burst SRAMs, 4Meg, 256K x 18,3.3 V Original PDF

    840E18 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    GS840E18A

    Abstract: GS840E32A GS840E36A
    Text: Preliminary 840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation


    Original     		PDF GS840E18/32/36AT/B-190/180/166/150/100 840E18A GS840E18A GS840E32A GS840E36A

    TS 100-12

    Abstract: GS840H18A GS840H18AT-150 GS840H18AT-166 GS840H18AT-180 GS840H32A GS840H36A B180
    Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840H18/32/36AT/B-180/166/150/100 100-lead 840H18A 840E18 840H18 TS 100-12 GS840H18A GS840H18AT-150 GS840H18AT-166 GS840H18AT-180 GS840H32A GS840H36A B180

    Untitled

    Abstract: No abstract text available
    Text: 840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840E18/32/36AT/B-190/180/166/150/100 100-lead 119-Bump GS840E18/32/362 1999E

    Untitled

    Abstract: No abstract text available
    Text: Preliminary 840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation


    Original     		PDF GS840E18/32/36AT/B-200/180/166/150/100 200MHzâ 100MHz control2/362 2000G GS840E18/32/362 032/2000G; 840E18

    B180

    Abstract: V/GS840E18A
    Text: 840E18/32/36AGT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840E18/32/36AGT/B-180/166/150/100 840E18A B180 V/GS840E18A

    B180

    Abstract: No abstract text available
    Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840H18/32/36AT/B-180/166/150/100 840H18A B180

    B180

    Abstract: No abstract text available
    Text: 840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840E18/32/36AT/B-180/166/150/100 840E18A B180

    GS840E18A

    Abstract: GS840E32A GS840E36A B180
    Text: Preliminary 840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation


    Original     		PDF GS840E18/32/36AT/B-180/166/150/100 100-lea 840E18A GS840E18A GS840E32A GS840E36A B180

    GS840E18A

    Abstract: GS840E32A GS840E36A
    Text: Preliminary 840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation


    Original     		PDF GS840E18/32/36AT/B-200/180/166/150/100 100table, 840E18A GS840E18A GS840E32A GS840E36A

    180i

    Abstract: GS840E18A GS840E18AT-166 GS840E18AT-180 GS840E32A GS840E36A B180
    Text: 840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840E18/32/36AT/B-180/166/150/100 100-lead 119Code: 840E18A 180i GS840E18A GS840E18AT-166 GS840E18AT-180 GS840E32A GS840E36A B180

    GS840E18A

    Abstract: GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A
    Text: 840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840E18/32/36AT/B-190/180/166/150/100 100-lead 840E18A GS840E18A GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A

    Untitled

    Abstract: No abstract text available
    Text: 840E18/32/36AGT/B*-180/166/150/100 Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and bump 5R in the BGA . Holding the FT mode pin/bump low


    Original     		PDF GS840E18/32/36AGT/B GS840E18/32/36A 840E18A

    B180

    Abstract: No abstract text available
    Text: 840E18/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation. • 3.3V +10%/-5% Core power supply


    Original     		PDF GS840E18/32/36T/B-180/166/150/100 100-lead GS840E18/32/362 1999E 2000G 032/2000G; B180

    B180

    Abstract: No abstract text available
    Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840H18/32/36AT/B-180/166/150/100 100-lead 119-Bump package80/166/150/100 840H18A B180

    180I

    Abstract: GS840E18A GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A GS840E18AGT-100
    Text: 840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840E18/32/36AT/B-190/180/166/150/100 100-lead orGS840E18/32/36AT/B-190/180/166/150/100 840E18A 180I GS840E18A GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A GS840E18AGT-100

    Untitled

    Abstract: No abstract text available
    Text: Preliminary 840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation


    Original     		PDF GS840E18/32/36AT/B-200/180/166/150/100

    B180

    Abstract: No abstract text available
    Text: GS840H18/32/36AGT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840H18/32/36AGT/B-180/166/150/100 JEDE66/150/100 840H18A B180

    GS840H18A

    Abstract: GS840H32A GS840H36A
    Text: Preliminary GS840H18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipeline operation • Single Cycle Deselect SCD Operation


    Original     		PDF GS840H18/32/36AT/B-200/180/166/150/100 840H18A 840E18 GS840H18A GS840H32A GS840H36A

    B180

    Abstract: No abstract text available
    Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840H18/32/36AT/B-180/166/150/100 100-lead 119-Bump GS84018/32/36 1999E GS84018/32/3610-11/ B180

    GS840H18A

    Abstract: GS840H32A GS840H36A B180
    Text: Preliminary GS840H18/32/36AT/B180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipeline operation • Single Cycle Deselect SCD Operation


    Original     		PDF GS840H18/32/36AT/B180/166/150/100 840E18 840H18A GS840H18A GS840H32A GS840H36A B180

    B180

    Abstract: No abstract text available
    Text: 840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS840E18/32/36AT/B-180/166/150/100 100-lead 119-Bump 840E18A B180