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    iNRCORE LLC 31023-NT

    CHIP INDUCTO(QPL M83446/09-71)
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    AN9047 Datasheets Context Search

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    ipc 610D

    Abstract: IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D
    Text: Application Note AN9047 Assembly Guidelines for MicroFET-6 Packaging By Dennis Lang INTRODUCTION The Fairchild MicroFET-6 is a 2mm x 2mm package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related


    Original     		PDF AN9047 IPC-SM-7525A, JESD22-B102D, FPF1007, FPF1008, FPF1009, FPF2140, FPF2142, FPF2143, FPF2144, ipc 610D IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D