AN10343
Abstract: No abstract text available
Text: AN10343 MicroPak soldering information Rev. 01 — 19 April 2005 Application note Document information Info Content Keywords MicroPak, footprint, Fairchild, BGA Abstract The recommended solder land pattern for mounting the MicroPak package AN10343 Philips Semiconductors
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AN10343
AN10343
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Solder Paste, Indium 5.8
Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land
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Original
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PDF
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AN10343
Solder Paste, Indium 5.8
SOT996-2
VSSOP8
MICROPAK XX
SOT103
WLCSP stencil design
J-STD-020D
SOT996
sot1049
XQFN10U
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