camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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PCN0404
Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
Text: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by
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PCN0404
G700L
PCN0404
SUMITOMO g700l
sumitomo EME G700L
TQFP 144 PACKAGE
Compound
SUMITOMO
mold compound
TQFP 144 PACKAGE altera
G700
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JEDEC J-STD-020d.1
Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
Text: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow
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AN-353-2
JEDEC J-STD-020d.1
GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
pcb warpage in ipc standard
Soldering guidelines
J-STD-020D
pcb warpage* in smt reflow
Lead Free reflow soldering profile BGA
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AUS308
Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Text: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that
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pcb warpage in ipc standard
Abstract: pcb warpage* in smt reflow GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE Lead Free reflow soldering profile BGA reflow soldering profile BGA Altera lead free BGA PROFILING leaded AN-081
Text: Reflow Soldering Guidelines for Lead-Free Packages Application Note 353 July 2004, ver. 1.0 Introduction Reflow Soldering Process Considerations The recent directives and legislations by nations around the world have mandated elimination of lead usage in some sectors of the electronics
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ADV0501
Abstract: JESD97 JESD-97 marking tm altera marking advisory E2- marking marking code e3 marking code E4 JEDEC Code e3 MARKING CODE E2
Text: CUSTOMER ADVISORY ADV0501 Implementing Pb-Free Marking Codes and Indication on Labels Change Description: Altera will implement the RoHS compliant Pb-free eN category code device marking and revise the moisture-barrier bag and shipping-box label to contain eN category codes and
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ADV0501
JESD-97.
JESD-97,
EBE9B00741
301LA4B0G
ADV0501
JESD97
JESD-97
marking tm
altera marking advisory
E2- marking
marking code e3
marking code E4
JEDEC Code e3
MARKING CODE E2
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JEDEC J-STD-020d.1
Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
Text: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow
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AN-353-3
JEDEC J-STD-020d.1
paste profile
J-STD-020d.1
JEDEC SMT reflow profile
Altera ROHS
AN81
J-STD-020D
J-STD-033
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7128s
Abstract: jam player
Text: In-System Programmability Guidelines August 1998, ver. 1.01 Introduction Application Note 100 As time-to-market pressures increase, design engineers require advanced system-level products to ensure problem-free development and manufacturing. Programmable logic devices PLDs with in-system
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jam player
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BYTEBLASTER
Abstract: 7128s ByteBlasterMV EPM7064S EPM7128S EPM7256S max 7128S programmer jam player 7128AE
Text: In-System Programmability Guidelines May 1999, ver. 3 Introduction Application Note 100 As time-to-market pressures increase, design engineers require advanced system-level products to ensure problem-free development and manufacturing. Programmable logic devices PLDs with in-system
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embedded c programming examples
Abstract: Agilent 3070 Tester ByteBlasterMV IN SYSTEM PROGRAMMING DATASHEET SPECIFICATION CAN ISP JTAG series termination resistors jam player
Text: 11. In-System Programmability Guidelines for MAX II Devices MII51013-1.7 Introduction As time-to-market pressure increases, design engineers require advanced systemlevel products to ensure problem-free development and manufacturing. Programmable logic devices PLDs with in-system programmability (ISP) can help
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MII51013-1
embedded c programming examples
Agilent 3070 Tester
ByteBlasterMV
IN SYSTEM PROGRAMMING DATASHEET
SPECIFICATION CAN ISP
JTAG series termination resistors
jam player
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Agilent 3070 Tester
Abstract: jam player altera usb blaster
Text: Chapter 11. In-System Programmability Guidelines for MAX II Devices MII51013-1.5 Introduction As time-to-market pressure increases, design engineers require advanced system-level products to ensure problem-free development and manufacturing. Programmable logic devices PLDs with in-system
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Agilent 3070 Tester
jam player
altera usb blaster
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Untitled
Abstract: No abstract text available
Text: Customer Interface Customer Interface • • Holtek provides the ASIC designer with four methods to ensure a smooth and trouble-free interface to the Holtek design process. Depending upon the design tools and methodology used by the designer, one of the following ways may
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EPM9320 device marking
Abstract: Signal Path Designer
Text: White Paper Advantages of ISP-Based PLDs Over Traditional PLDs Introduction As time-to-market pressures increase, design engineers continually look for ways to speed up the development of advanced system-level products and to ensure problem-free manufacturing. Complex programmable logic
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EPM9320 device marking
Signal Path Designer
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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BITBLASTER
Abstract: jtag mhz
Text: In-System Programmability in MAX Devices September 2005, ver. 1.5 Application Note 95 Introduction MAX® devices are programmable logic devices PLDs , based on the Altera® Multiple Array MatriX (MAX) architecture that and supports the IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface. MAX devices
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d4564163-a80
Abstract: NEC D4564163-A80 d4564163 sdram controller MT48LC4M32B2-7 d456 MT48LC4M32B2 SDR100 MT48LC2M32B2 EP2S60F672C5
Text: 1. SDRAM Controller Core NII51005-7.1.0 Core Overview The SDRAM controller core with Avalon interface provides an Avalon Memory-Mapped Avalon-MM interface to off-chip SDRAM. The SDRAM controller allows designers to create custom systems in an Altera® FPGA that connect easily to SDRAM chips. The SDRAM
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PC100
d4564163-a80
NEC D4564163-A80
d4564163
sdram controller
MT48LC4M32B2-7
d456
MT48LC4M32B2
SDR100
MT48LC2M32B2
EP2S60F672C5
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EPF10K10
Abstract: EPF10K10A EPF10K20 EPF10K30 EPF10K30A EPF10K40 EPF10K50
Text: In-System Programmability June 2000, ver. 1.03 in MAX Devices Application Note 95 Introduction MAX® devices are programmable logic devices PLDs , based on the Altera® Multiple Array MatriX (MAX) architecture that and supports the IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface. MAX devices
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EPF10K10
EPF10K10A
EPF10K20
EPF10K30
EPF10K30A
EPF10K40
EPF10K50
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BITBLASTER
Abstract: No abstract text available
Text: In-System Programmability in MAX 9000 Devices June 1995, ver. 1 Application Brief 141 Introduction MAX 9000 devices are the first programmable logic devices PLDs based on Altera’s Multiple Array MatriX (MAX) architecture to offer in-system programmability (ISP). MAX 9000 ISP is implemented through the Joint
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BGA780
Abstract: No abstract text available
Text: 5. Reference and Ordering Information SIIGX51007-1.3 Software Stratix II GX devices are supported by the Altera® Quartus® II design software, which provides a comprehensive environment for system-on-a-programmable-chip SOPC design. The Quartus II software
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XP/2000/NT,
BGA780
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Untitled
Abstract: No abstract text available
Text: Buy On-Line - BuyAltera.com Download Center Products End Markets Frequently Asked Questions Technology Training Support About Altera Literature Buy Online Sign in/register myAltera Account Search Home > Buy Online > View Cart Customer Service View Cart
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epf10k50v
Abstract: asap2 6 pin JTAG header BYTEBLASTER IN SYSTEM PROGRAMMING DATASHEET jtag mhz EPF10K10 EPF10K10A EPF10K20 EPF10K30
Text: In-System Programmability August 1999, ver. 1.02 in MAX Devices Application Note 95 Introduction MAX® devices are programmable logic devices PLDs , based on the Altera® Multiple Array MatriX (MAX) architecture that and supports the IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface. MAX devices
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MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
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272048
Abstract: MAX EPLD TRANSISTOR JC 84-1MISR4 CY7C342B EME-6300H P26 TRANSISTOR failure test report EPLD
Text: Cypress Semiconductor Qualification Report QTP# 97185 VERSION 1.0 November, 1997 CY7C342B 128-Macrocell MAX EPLD Cypress Semiconductor 128 Macrocell MAX EPLD - P26 Technology Device: CY7C342B Package: PLCC QTP# 97185, V. 1.0 Page 2 of 8 November, 1997
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128-Macrocell
7C342B
7C342B
CY7C342B-JC
272048
MAX EPLD
TRANSISTOR JC
84-1MISR4
CY7C342B
EME-6300H
P26 TRANSISTOR
failure test report
EPLD
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