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    A141

    Abstract: A143 DPV3232V
    Text: PV3232V 32K X 32 UVEPROM VERSAPAC Dense-Pac Microsystems. Inc. O DESCRIPTION: The D PV3232V is a 66-pin Pin Grid Array PG A consisting of four 32K X 8 U V EPR O M devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate with matched thermal coefficients.


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    DPV3232V DPV3232V 66-pin 250ns 128KX8, 64KX16 32KX32 30A014-30 A141 A143 PDF

    12 SQ 045 JF

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM PV3232VA DESCRIPTION; The PV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


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    DPV3232VA DPV3232VA 66-pin 250ns 128KX8, 64KX16 32KX32 E75R415 12 SQ 045 JF PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM PV3232VA Dense-Pac Microsystems. Inc. 32K X 3 2 UVEPROM VERSAPAC O DESCRIPTION: The PV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan
    DPV3232VA DPV3232VA 66-pin 250ns 128KXS, 64KX16 32KX32 30A014-60 PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM * r ~ T PV3232VA Dense-Pac Microsystems. Inc. 32K X 32 UVEPROM VERSAPAC O DESCRIPTION: The PV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan
    DPV3232VA DPV3232VA 66-pin 120ns 150ns 170ns 200ns 250ns DPV12832V 128KX8, PDF