FGG676
Abstract: fg676 PK035
Text: R PK035 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG676/FGG676) Package 676-BALL FINE-PITCH BGA, 1.00MM PITCH (FG676/FGG676) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
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PK035
FG676/FGG676)
676-BALL
FGG676
fg676
PK035
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Untitled
Abstract: No abstract text available
Text: R Fine Pitch BGA FG676 Package PK035 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
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FG676)
PK035
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fg676
Abstract: 676-Pin bga pin 676
Text: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)
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FG676
676-PIN
FG676)
fg676
bga pin 676
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XC2V1000
Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
Text: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch
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CS144:
FG256,
FG456,
FG676:
FF896,
FF1152,
FF1517:
BG575
BG728:
BF957:
XC2V1000
XC2V1000 Pin-out
IO-L93N
XC2V80
XC2V40
XC2V250
XC2V500
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34992
Abstract: XCV600E FG680 BG680 XCV100 TQ144 XCV1000E XCV600E HQ240 XCV300 PQ240 XCV50 PQ240 CS144 BG560
Text: Competitive Overview Virtex Series FPGA Competitive Cross Reference XCV100E 32K 30K-95K 2988 2/24 EP20K100E XCV200E 94 158 176 284 PQ240 FG256 BG432 FG456 158 176 316 312 83K 80K-400K 7116 2/24 PQ240 BG432 FG676 158 316 404 130K 130K-560K 10812 2/24 HQ240
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XCV100E
30K-95K
XCV200E
80K-400K
PQ240
BG432
FG676
130K-560K
HQ240
34992
XCV600E FG680
BG680
XCV100 TQ144
XCV1000E
XCV600E HQ240
XCV300 PQ240
XCV50 PQ240
CS144
BG560
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30255
Abstract: 34590-94-8 744050
Text: 100% Material Declaration Data Sheet for Spartan -3/-3A FG676 Cu Wire Package PK534 (v1.2) March 19, 2012 Average Weight: 3.0582 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3
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FG676
PK534
30255
34590-94-8
744050
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fg676
Abstract: PK035
Text: R Fine-Pitch BGA FG676 Package PK035 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
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FG676)
PK035
fg676
PK035
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XC3S700A
Abstract: xc3s200aft256 XC3S400AFT256 XC3S50A L01P L02P FG320 UG331 L05P xc3s400a ftg256
Text: Spartan-3A FPGA Family: Data Sheet R DS529 July 10, 2007 Product Specification Module 1: Introduction and Ordering Information - DS529-1 v1.4.1 July 10, 2007 • • • • • • • Introduction Features Architectural and Configuration Overview General I/O Capabilities
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DS529
DS529-1
DS529-2
DS529-3
XC3S50A
XC3S200A
FT256
DS529-4
XC3S700A
xc3s200aft256
XC3S400AFT256
L01P
L02P
FG320
UG331
L05P
xc3s400a ftg256
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ACTEL FUSION AFS1500
Abstract: FlashPro3 PQ208 QN108 QN180 M1AFS1500 AFS250 rc oscillator M-LVDS
Text: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
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130-nm,
128-Bit
ACTEL FUSION AFS1500
FlashPro3
PQ208
QN108
QN180
M1AFS1500
AFS250
rc oscillator
M-LVDS
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AFS600-FG256
Abstract: zo 103 ma 75 607 A54 ZENER flashpro3 schematic mark AT0 Unipolar PC atx 400 P4 power supply diagram zener Diode B23 PQ208 QN108 QN180
Text: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
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130-nm,
128-Bit
AFS600-FG256
zo 103 ma 75 607
A54 ZENER
flashpro3 schematic
mark AT0
Unipolar PC atx 400 P4 power supply diagram
zener Diode B23
PQ208
QN108
QN180
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A54 ZENER
Abstract: AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM
Text: v2.0 Actel Fusion Family of Mixed-Signal FPGAs Features and Benefits In-System Programming ISP and Security High-Performance Reprogrammable Flash Technology Advanced Digital I/O • • • • • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents
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128-Bit
130-nm,
A54 ZENER
AFS600-FG256
mark AT0
QN108
CORE8051
bipolar ROM
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UG628
Abstract: No abstract text available
Text: Spartan-6 FPGA Configuration User Guide UG380 v2.5 January 23, 2013 Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG380
UG628
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SPARTAN-3 XC3S400 PQ208
Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
Text: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,
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DS099-1
XC3S50CP132,
XC3S2000FG456,
XC3S4000FG676
DS099-1,
DS099-2,
DS099-3,
DS099-4,
DS313,
DS314-1,
SPARTAN-3 XC3S400 PQ208
SPARTAN-3 XC3S400 pq208 architecture
SPARTAN-3 XC3S400 tq144
SPARTAN-3 XC3S400
Spartan-3 FPGA Family
XC3S4000-FG676
SPARTAN-3 XC3S400 pin
SPARTAN-3 XC3S400 architecture
XILINX SPARTAN VQG100
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XC3S700AN FGG484
Abstract: XC3S400AN-FGG400 XC3S700A FGG484 xc3s200an XC3S400AN FGG400 FGG676 SPARTAN 3an XC3S50A XC3S700AN-FG484 XC3S700AN
Text: Spartan-3AN FPGA Family Data Sheet R DS557 June 2, 2008 Module 1: Introduction and Ordering Information - DS557-1 v3.1 June 2, 2008 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview
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DS557
DS557-1
XC3S50AN.
XC3S700AN
FG484
XC3S1400AN
FGG676
DS557-4
XC3S700AN FGG484
XC3S400AN-FGG400
XC3S700A FGG484
xc3s200an
XC3S400AN
FGG400
SPARTAN 3an
XC3S50A XC3S700AN-FG484
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BLVDS-25
Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)
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FF896
FF1152
FF11486
10Gbps
BLVDS-25
LVDSEXT-25
4564 RAM
XC2VP70 FF1704 pinout
XC2V1000 Pin-out
XC2V1500
XC2V2000
XC2V3000
XC2V6000
XC2V8000
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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XCV200E Device, FG456 Package
Abstract: XCV300BG432 BG432 PCI33 XCV200 XCV300 XCV400 XCV400E p146 AE-29
Text: Application Note - Virtex-E Virtex-E Package Compatibility Guide This package compatibility guide describes the Virtex-E pin-outs and establishes guidelines for package compatibility between Virtex and Virtex-E devices. by Robert Le, Sr. Applications Engineer,
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XCV200E
FG456
XCV200
XCV300E
BG432
XCV200E Device, FG456 Package
XCV300BG432
PCI33
XCV300
XCV400
XCV400E
p146
AE-29
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XCF00S
Abstract: spartan 3a FGG900 DS099 XCN07010
Text: ds313.fm Page 1 Friday, April 18, 2008 10:26 AM Spartan-3L Low Power FPGA Family R DS313 v1.2 April 18, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07010, Product Discontinuation Notice, for more information on last-time purchases and replacement products.
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ds313
DS313
XCN07010,
SSTL18
XCF00S
spartan 3a
FGG900
DS099
XCN07010
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SCHEMATIC DIAGRAM OF POWER SAVER DEVICE
Abstract: diode zener nt 9838 Keller AG am3 socket pinout AT-610 XILINX vhdl code REED SOLOMON NORTEL OC-12 A26 zener w9 0780 specifications for multiplexer of nortel
Text: Editorial contact: Ann Duft Xilinx, Inc. 408 879-4726 publicrelations@xilinx.com Kathy Keller Oak Ridge Public Relations (408) 253-5042 kathy.keller@oakridge.com Product Marketing contact: Bruce Jorgens Xilinx, Inc. (408) 879-5236 bruce.jorgens@xilinx.com
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1998--Dramatically
SCHEMATIC DIAGRAM OF POWER SAVER DEVICE
diode zener nt 9838
Keller AG
am3 socket pinout
AT-610
XILINX vhdl code REED SOLOMON
NORTEL OC-12
A26 zener
w9 0780
specifications for multiplexer of nortel
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XC9572PC44
Abstract: XC9572-PC44 XCS20XL PQ208 XCS20 PQ208 XC9536-PC44 Xilinx jtag cable Schematic XC95144 PQ100 interfacing cpld xc9572 with keyboard 6552 XC4010XL PQ160
Text: R Release Document Foundation Series 2.1i Installation Guide and Release Notes July 1999 Read This Before Installation Foundation Series 2.1i Installation Guide and Release Notes R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Timing Wizard, TRACE,
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XC2064,
XC3090,
XC4005,
XC5210,
XC-DS501
95/98/NT,
XC4000
XC9572PC44
XC9572-PC44
XCS20XL PQ208
XCS20 PQ208
XC9536-PC44
Xilinx jtag cable Schematic
XC95144 PQ100
interfacing cpld xc9572 with keyboard
6552
XC4010XL PQ160
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a51 ZENER DIODE
Abstract: transistor 2n2222 bipolar ROM EQUIVALENCES TRANSISTOR LIST ProASIC3 lvds yl 1060
Text: Revision 3 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •
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130-nm,
128-Bit
a51 ZENER DIODE
transistor 2n2222
bipolar ROM
EQUIVALENCES TRANSISTOR LIST
ProASIC3 lvds
yl 1060
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Untitled
Abstract: No abstract text available
Text: Spartan-3A DSP FPGA Family: Complete Data Sheet R DS610 April 2, 2007 Advance Product Specification Module 1: Introduction and Ordering Information • DS610-1 v1.0 April 2, 2007 • • • • • • • Introduction Features Architectural Overview Configuration Overview
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DS610
DS610-1
DS610-2
UG331:
XC3SD1800A
XC3SD3400A
FG676
DS610-4
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Untitled
Abstract: No abstract text available
Text: £ XILINX Virtex 2.5 V Field Programmable Gate Arrays February 16, 1999 Version 1.3 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz
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OCR Scan
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66-MHz
16-bit
32-bit
XCV400
XCV600
XCV800
XCV1000
XCV300
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Untitled
Abstract: No abstract text available
Text: V ir te x 2 .5 V £ XILINX Field Programmable Gate Arrays May 13, 1999 Version 1.5 Advance Product Specification Features • • • • • • Fast, high-density Field-Programmable Gate Arrays - Densities from 50k to 1M system gates - System performance up to 200 MHz
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66-MHz
16-bit
32-bit
Regis00
XCV1000
XCV300
FG680
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