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    Cypress marking code

    Abstract: DL818
    Text: Preliminary ComL- DL818 1:8 Clock Fanout Buffer Product Features Product Description • The CYPRESS ComL-series of logic circuits are produced using advanced 0.35-micron CMOS technology, achieving the industries fastest logic. Low Voltage Operation VDD = 3.3V


    Original     		PDF DL818 35-micron 400MHz ComL-DL818 Cypress marking code DL818

    lvds 20 pin to 30 pin

    Abstract: LVDS 31 pin lvds 26 pin lvds standard 20 pin lvds 32 pin LVDS 20 pin of 30 pin LVDS DL818
    Text: Preliminary ComL- DL818 1:8 Clock Fanout Buffer Product Features Product Description • The CYPRESS ComL-series of logic circuits are produced using advanced 0.35-micron CMOS technology, achieving the industries fastest logic. Low Voltage Operation VDD = 3.3V


    Original     		PDF DL818 35-micron 400MHz ComL-DL818 ComL-DL818 lvds 20 pin to 30 pin LVDS 31 pin lvds 26 pin lvds standard 20 pin lvds 32 pin LVDS 20 pin of 30 pin LVDS DL818

    dallas date code ds1230

    Abstract: 25091 e8 sot223 24446
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC


    Original     		PDF DS1621 DS1869 DK815282AAB DJ824247ABA DM846764AA DS2502 DS87C520 DN901118AAB DK935356AAB dallas date code ds1230 25091 e8 sot223 24446

    Hyundai 9944

    Abstract: nseb ds1000m-100 DS2165Q
    Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		PDF DS1000M-100 DS1000 DH927108AJC DS87C520 DN901118AAB Hyundai 9944 nseb DS2165Q

    dallas date code ds12887

    Abstract: dallas date code P23073 DS1225A DALLAS DS80C320 9832 P23403 dallas date code ds80c320 P23074
    Text: RELIABILITY MONITOR STRESS: ULTRASOUND CONDITIONS: J-STD-020 MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS1233 A5 JAN 99 P23064 9842 CARSEM DM823017AB SOT-223 DS1803 A2 NOV 98 P22797 9833 CHIPPAC, KOREA DS1869 A3 MAR 99 P23360


    Original     		PDF J-STD-020 DM823017AB DS1233 DS1803 DS1869 DS2109 DS2153 DS2175 DS5002 P23064 dallas date code ds12887 dallas date code P23073 DS1225A DALLAS DS80C320 9832 P23403 dallas date code ds80c320 P23074

    DS1233 a5

    Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC


    Original     		PDF DS1621 DK815282AAB DK906731AAC DS1869 DJ821534ABB DJ824252AAC DJ824247ABA DS1233 a5 e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869

    74 HTC 192

    Abstract: DS2165Q
    Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH833179ADA HOUR99 DS87C520 DN825394AAB J-STD-020 30C/60% 74 HTC 192 DS2165Q

    fds5002

    Abstract: dallas E8 24715
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC


    Original     		PDF DS1621 DS1869 DK815282AAB DK906731AAC DJ821534ABB DJ824252AAC DJ824247ABA fds5002 dallas E8 24715

    DN901118AAB

    Abstract: c5 99 sot223 dk91
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA


    Original     		PDF DM846764AA DM849359AC DS2502 DM849359AC DN901118AAB c5 99 sot223 dk91

    ti 9919

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA


    Original     		PDF DM846764AA DM842206AL DM849359AC DS2502 DM849359AC ti 9919

    DS87520

    Abstract: P2305 P23855
    Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH833179ADA P23057 P23178 DN825394AAB P23415 P23306 P23307 J-STD-020 DS87520 P2305 P23855

    DM92

    Abstract: DM-92 472E-06
    Text: RELIABILITY MONITOR DS1232L APR '99 MONITOR-CHIPPAC,KOREA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232L C2 SOIC 150 CPK ChipPac, K 9848 PROCESS Single Poly, Single Metal DL829603AAC 8 0.8 µm Standard Process JOB NO DESCRIPT


    Original     		PDF DS1232L DL829603AAC DM92 DM-92 472E-06

    74 HTC 00

    Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
    Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH927108AJC DK935356AAB J-STD-020 30C/60% 74 HTC 00 74 HTC 08 DS1302 DIE REVISION Hyundai 9944

    DS2175D1

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Single Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2401 READ POINT QTY FAILS C2 MAR '99 P23371 9851 CARSEM DM832008AIA


    Original     		PDF DM832008AIA DK826547AA DS2401 P23371 P23673 DS80C320 DK826547AA DS2175D1