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    DS87520

    Abstract: P2305 P23855
    Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH833179ADA P23057 P23178 DN825394AAB P23415 P23306 P23307 J-STD-020 DS87520 P2305 P23855

    DS2175D1

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Single Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2401 READ POINT QTY FAILS C2 MAR '99 P23371 9851 CARSEM DM832008AIA


    Original     		PDF DM832008AIA DK826547AA DS2401 P23371 P23673 DS80C320 DK826547AA DS2175D1